CN1276259C - 光刻接触元件 - Google Patents

光刻接触元件 Download PDF

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Publication number
CN1276259C
CN1276259C CNB998140368A CN99814036A CN1276259C CN 1276259 C CN1276259 C CN 1276259C CN B998140368 A CNB998140368 A CN B998140368A CN 99814036 A CN99814036 A CN 99814036A CN 1276259 C CN1276259 C CN 1276259C
Authority
CN
China
Prior art keywords
conductive
substrate
contact element
contact
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998140368A
Other languages
English (en)
Chinese (zh)
Other versions
CN1329721A (zh
Inventor
G·L·马蒂厄
B·N·埃尔德里奇
G·W·格鲁布
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/205,022 external-priority patent/US6268015B1/en
Priority claimed from US09/205,023 external-priority patent/US6255126B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN1329721A publication Critical patent/CN1329721A/zh
Application granted granted Critical
Publication of CN1276259C publication Critical patent/CN1276259C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connecting Device With Holders (AREA)
CNB998140368A 1998-12-02 1999-12-01 光刻接触元件 Expired - Fee Related CN1276259C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/205,022 US6268015B1 (en) 1998-12-02 1998-12-02 Method of making and using lithographic contact springs
US09/205,023 US6255126B1 (en) 1998-12-02 1998-12-02 Lithographic contact elements
US09/205,022 1998-12-02
US09/205,023 1998-12-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2006101085411A Division CN1900725B (zh) 1998-12-02 1999-12-01 光刻接触元件

Publications (2)

Publication Number Publication Date
CN1329721A CN1329721A (zh) 2002-01-02
CN1276259C true CN1276259C (zh) 2006-09-20

Family

ID=26900020

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998140368A Expired - Fee Related CN1276259C (zh) 1998-12-02 1999-12-01 光刻接触元件

Country Status (9)

Country Link
US (2) US7553165B2 (enExample)
EP (2) EP1316803A3 (enExample)
JP (3) JP2002531915A (enExample)
KR (6) KR20080024236A (enExample)
CN (1) CN1276259C (enExample)
AU (1) AU2038000A (enExample)
DE (1) DE69908638T2 (enExample)
TW (1) TW589453B (enExample)
WO (1) WO2000033089A2 (enExample)

Families Citing this family (110)

* Cited by examiner, † Cited by third party
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EP1135690B1 (en) 2003-06-04
DE69908638T2 (de) 2004-04-29
KR100841127B1 (ko) 2008-06-24
WO2000033089A2 (en) 2000-06-08
KR20090038040A (ko) 2009-04-17
US7553165B2 (en) 2009-06-30
JP2002531915A (ja) 2002-09-24
EP1135690A2 (en) 2001-09-26
EP1316803A2 (en) 2003-06-04
WO2000033089A3 (en) 2001-03-08
EP1316803A3 (en) 2005-11-09
JP2004186670A (ja) 2004-07-02
JP2010266465A (ja) 2010-11-25
DE69908638D1 (de) 2003-07-10
KR20080024236A (ko) 2008-03-17
TW589453B (en) 2004-06-01
KR20070010205A (ko) 2007-01-22
KR20010078403A (ko) 2001-08-20
AU2038000A (en) 2000-06-19
US7841863B2 (en) 2010-11-30
KR20070087060A (ko) 2007-08-27
CN1329721A (zh) 2002-01-02
US20090263986A1 (en) 2009-10-22
US20080254651A1 (en) 2008-10-16
KR20080047629A (ko) 2008-05-29

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