JPH0493157U - - Google Patents
Info
- Publication number
- JPH0493157U JPH0493157U JP1990128765U JP12876590U JPH0493157U JP H0493157 U JPH0493157 U JP H0493157U JP 1990128765 U JP1990128765 U JP 1990128765U JP 12876590 U JP12876590 U JP 12876590U JP H0493157 U JPH0493157 U JP H0493157U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/075—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/50—
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- H10W72/531—
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- H10W72/5363—
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- H10W72/59—
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- H10W72/931—
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- H10W72/934—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128765U JPH0493157U (enExample) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128765U JPH0493157U (enExample) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0493157U true JPH0493157U (enExample) | 1992-08-13 |
Family
ID=31876208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990128765U Pending JPH0493157U (enExample) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0493157U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186670A (ja) * | 1998-12-02 | 2004-07-02 | Formfactor Inc | リソグラフィ接触要素 |
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1990
- 1990-11-29 JP JP1990128765U patent/JPH0493157U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186670A (ja) * | 1998-12-02 | 2004-07-02 | Formfactor Inc | リソグラフィ接触要素 |