FR2849016B1 - Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu - Google Patents

Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu

Info

Publication number
FR2849016B1
FR2849016B1 FR0216088A FR0216088A FR2849016B1 FR 2849016 B1 FR2849016 B1 FR 2849016B1 FR 0216088 A FR0216088 A FR 0216088A FR 0216088 A FR0216088 A FR 0216088A FR 2849016 B1 FR2849016 B1 FR 2849016B1
Authority
FR
France
Prior art keywords
making
polymeric material
sacrificial layer
component obtained
suspended micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0216088A
Other languages
English (en)
Other versions
FR2849016A1 (fr
Inventor
Philippe Robert
France Michel
Pachurka Catherine Maeder
Nicolas Sillon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0216088A priority Critical patent/FR2849016B1/fr
Priority to PCT/FR2003/003789 priority patent/WO2004056698A2/fr
Priority to EP03799623A priority patent/EP1572578A2/fr
Priority to AU2003299341A priority patent/AU2003299341A1/en
Publication of FR2849016A1 publication Critical patent/FR2849016A1/fr
Application granted granted Critical
Publication of FR2849016B1 publication Critical patent/FR2849016B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00611—Processes for the planarisation of structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0108—Sacrificial polymer, ashing of organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0118—Processes for the planarization of structures
    • B81C2201/0125—Blanket removal, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
FR0216088A 2002-12-18 2002-12-18 Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu Expired - Fee Related FR2849016B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0216088A FR2849016B1 (fr) 2002-12-18 2002-12-18 Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu
PCT/FR2003/003789 WO2004056698A2 (fr) 2002-12-18 2003-12-18 Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu
EP03799623A EP1572578A2 (fr) 2002-12-18 2003-12-18 Procede de realisation d une micro-structure suspendue plane , utilisant une couche sacrificielle en materiau polymere et composant obtenu
AU2003299341A AU2003299341A1 (en) 2002-12-18 2003-12-18 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0216088A FR2849016B1 (fr) 2002-12-18 2002-12-18 Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu

Publications (2)

Publication Number Publication Date
FR2849016A1 FR2849016A1 (fr) 2004-06-25
FR2849016B1 true FR2849016B1 (fr) 2005-06-10

Family

ID=32406154

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0216088A Expired - Fee Related FR2849016B1 (fr) 2002-12-18 2002-12-18 Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu

Country Status (4)

Country Link
EP (1) EP1572578A2 (fr)
AU (1) AU2003299341A1 (fr)
FR (1) FR2849016B1 (fr)
WO (1) WO2004056698A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2874213B1 (fr) * 2004-08-13 2007-03-02 Commissariat Energie Atomique Dispositif comprenant un microsysteme encapsule et procede de fabrication
US7264984B2 (en) 2004-12-21 2007-09-04 Touchdown Technologies, Inc. Process for forming MEMS
US7271022B2 (en) 2004-12-21 2007-09-18 Touchdown Technologies, Inc. Process for forming microstructures
US7245135B2 (en) 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US7362119B2 (en) 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US7365553B2 (en) 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7180316B1 (en) 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
GB2588891B (en) * 2019-10-23 2024-04-24 Smart Photonics Holding B V Manufacturing a semiconductor structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102948A (ja) * 1986-10-20 1988-05-07 Canon Inc インクジエツト記録ヘツドの製造方法
DE69311277T2 (de) * 1992-12-15 1998-01-15 Asulab Sa Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen
US5636070A (en) 1994-04-30 1997-06-03 Daewoo Electronics Co, Ltd. Thin film actuated mirror array
JP2002531915A (ja) * 1998-12-02 2002-09-24 フォームファクター，インコーポレイテッド リソグラフィ接触要素
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US7057246B2 (en) * 2000-08-23 2006-06-06 Reflectivity, Inc Transition metal dielectric alloy materials for MEMS

Also Published As

Publication number Publication date
WO2004056698A3 (fr) 2004-11-11
EP1572578A2 (fr) 2005-09-14
WO2004056698A2 (fr) 2004-07-08
AU2003299341A1 (en) 2004-07-14
FR2849016A1 (fr) 2004-06-25

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Legal Events

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ST Notification of lapse

Effective date: 20160831