DE60238959D1 - Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung - Google Patents

Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung

Info

Publication number
DE60238959D1
DE60238959D1 DE60238959T DE60238959T DE60238959D1 DE 60238959 D1 DE60238959 D1 DE 60238959D1 DE 60238959 T DE60238959 T DE 60238959T DE 60238959 T DE60238959 T DE 60238959T DE 60238959 D1 DE60238959 D1 DE 60238959D1
Authority
DE
Germany
Prior art keywords
production
piezoelectric oscillator
piezoelectric
oscillator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60238959T
Other languages
English (en)
Inventor
Hitoshi Takanashi
Tsuneo Uchiyama
Youji Nagano
Kyo Horie
Noriyuki Watanabe
Kazuhiro Shii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Miyazaki Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001119196A external-priority patent/JP4576741B2/ja
Priority claimed from JP2002026018A external-priority patent/JP4045807B2/ja
Application filed by Miyazaki Epson Corp filed Critical Miyazaki Epson Corp
Application granted granted Critical
Publication of DE60238959D1 publication Critical patent/DE60238959D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/0538Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/0538Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10083Electromechanical or electro-acoustic component, e.g. microphone
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10234Metallic balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10242Metallic cylinders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018Presence of a frame in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
DE60238959T 2001-04-18 2002-04-17 Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung Expired - Lifetime DE60238959D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001119196A JP4576741B2 (ja) 2001-04-18 2001-04-18 圧電発振器
JP2001274632 2001-09-11
JP2001355413 2001-11-21
JP2002026018A JP4045807B2 (ja) 2001-09-11 2002-02-01 圧電発振器

Publications (1)

Publication Number Publication Date
DE60238959D1 true DE60238959D1 (de) 2011-02-24

Family

ID=27482214

Family Applications (3)

Application Number Title Priority Date Filing Date
DE60238570T Expired - Lifetime DE60238570D1 (de) 2001-04-18 2002-04-17 Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung
DE60236790T Expired - Lifetime DE60236790D1 (de) 2001-04-18 2002-04-17 Piezoelektrischer oszillator und verfahren zu seiner herstellung
DE60238959T Expired - Lifetime DE60238959D1 (de) 2001-04-18 2002-04-17 Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE60238570T Expired - Lifetime DE60238570D1 (de) 2001-04-18 2002-04-17 Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung
DE60236790T Expired - Lifetime DE60236790D1 (de) 2001-04-18 2002-04-17 Piezoelektrischer oszillator und verfahren zu seiner herstellung

Country Status (7)

Country Link
US (1) US7023288B2 (de)
EP (3) EP2101551B1 (de)
KR (1) KR100910781B1 (de)
CN (1) CN1295861C (de)
DE (3) DE60238570D1 (de)
ES (1) ES2348024T3 (de)
WO (1) WO2002087070A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004242089A (ja) * 2003-02-06 2004-08-26 Murata Mfg Co Ltd 水晶発振器およびそれを用いた電子装置
JP4244865B2 (ja) * 2004-06-03 2009-03-25 セイコーエプソン株式会社 圧電発振器および電子機器
JP2006245098A (ja) * 2005-03-01 2006-09-14 Seiko Epson Corp 電子部品及びその製造方法、並びに電子機器
US7342308B2 (en) * 2005-12-20 2008-03-11 Atmel Corporation Component stacking for integrated circuit electronic package
US7821122B2 (en) 2005-12-22 2010-10-26 Atmel Corporation Method and system for increasing circuitry interconnection and component capacity in a multi-component package
JP4244053B2 (ja) * 2006-06-16 2009-03-25 エプソントヨコム株式会社 圧電デバイスを備えた電子モジュール
NO326372B1 (no) * 2006-09-21 2008-11-17 Polight As Polymerlinse
KR100790750B1 (ko) * 2006-12-06 2008-01-02 삼성전기주식회사 수정진동자 패키지
JP4458203B2 (ja) * 2007-12-06 2010-04-28 株式会社村田製作所 圧電振動部品
JP2009188633A (ja) * 2008-02-05 2009-08-20 Nippon Dempa Kogyo Co Ltd 表面実装発振器
JP4788740B2 (ja) * 2008-06-09 2011-10-05 セイコーエプソン株式会社 圧電発振器、及びその製造方法、並びに圧電発振器を利用した携帯電話装置、電子機器
JP2013153412A (ja) * 2011-12-27 2013-08-08 Nippon Dempa Kogyo Co Ltd 表面実装型圧電発振器
CN104285372B (zh) * 2012-06-19 2017-07-04 株式会社大真空 表面安装型压电振荡器
FI20125725L (fi) * 2012-06-26 2013-12-27 Tellabs Oy Mekaanisella suojauksella varustettu piirikorttijärjestely
US9018753B2 (en) * 2013-08-02 2015-04-28 Stmicroelectronics Pte Ltd Electronic modules

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991719A (ja) * 1982-11-17 1984-05-26 Nippon Dempa Kogyo Co Ltd 圧電振動子
JPH043609A (ja) 1990-04-20 1992-01-08 Victor Co Of Japan Ltd 発振器
JPH0471019A (ja) 1990-07-12 1992-03-05 Brother Ind Ltd データ処理装置
JPH0471019U (de) * 1990-10-31 1992-06-23
JP3128906B2 (ja) * 1991-12-04 2001-01-29 セイコーエプソン株式会社 圧電発振器
JPH06291551A (ja) * 1993-03-31 1994-10-18 Nippon Dempa Kogyo Co Ltd 圧電発振器
JP3101175B2 (ja) 1994-04-15 2000-10-23 シチズン時計株式会社 水晶発振器
US5642265A (en) * 1994-11-29 1997-06-24 Sgs-Thomson Microelectronics, Inc. Ball grid array package with detachable module
JPH11343171A (ja) * 1998-05-29 1999-12-14 Murata Mfg Co Ltd 圧電セラミック、圧電セラミックの製造方法、および圧電発振子
JPH11355047A (ja) * 1998-06-08 1999-12-24 Toyo Commun Equip Co Ltd 圧電発振器
JP2000323927A (ja) 1999-05-13 2000-11-24 Toyo Commun Equip Co Ltd 圧電発振器
JP2001016036A (ja) * 1999-06-29 2001-01-19 Nippon Dempa Kogyo Co Ltd 表面実装型の水晶発振器
KR100506534B1 (ko) * 2000-01-31 2005-08-05 긴세키 가부시키가이샤 압전진동자를 사용한 발진회로용 용기, 그 제조방법 및발진기
KR20030055681A (ko) * 2001-12-27 2003-07-04 삼성전기주식회사 온도보상형 수정발진기 및 그 제조방법

Also Published As

Publication number Publication date
KR100910781B1 (ko) 2009-08-04
ES2348024T3 (es) 2010-11-26
CN1295861C (zh) 2007-01-17
KR20030013426A (ko) 2003-02-14
EP2101551B1 (de) 2010-12-08
EP1381151A4 (de) 2008-02-06
CN1461517A (zh) 2003-12-10
EP1381151B1 (de) 2010-06-23
DE60236790D1 (de) 2010-08-05
US20040113708A1 (en) 2004-06-17
WO2002087070A1 (fr) 2002-10-31
EP2101551A1 (de) 2009-09-16
US7023288B2 (en) 2006-04-04
EP2101406A1 (de) 2009-09-16
EP2101406B1 (de) 2011-01-12
DE60238570D1 (de) 2011-01-20
EP1381151A1 (de) 2004-01-14

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