DE60238959D1 - Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung - Google Patents
Piezoelektrischer Oszillator und Verfahren zu dessen HerstellungInfo
- Publication number
- DE60238959D1 DE60238959D1 DE60238959T DE60238959T DE60238959D1 DE 60238959 D1 DE60238959 D1 DE 60238959D1 DE 60238959 T DE60238959 T DE 60238959T DE 60238959 T DE60238959 T DE 60238959T DE 60238959 D1 DE60238959 D1 DE 60238959D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- piezoelectric oscillator
- piezoelectric
- oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001119196A JP4576741B2 (ja) | 2001-04-18 | 2001-04-18 | 圧電発振器 |
JP2001274632 | 2001-09-11 | ||
JP2001355413 | 2001-11-21 | ||
JP2002026018A JP4045807B2 (ja) | 2001-09-11 | 2002-02-01 | 圧電発振器 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60238959D1 true DE60238959D1 (de) | 2011-02-24 |
Family
ID=27482214
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60238570T Expired - Lifetime DE60238570D1 (de) | 2001-04-18 | 2002-04-17 | Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung |
DE60236790T Expired - Lifetime DE60236790D1 (de) | 2001-04-18 | 2002-04-17 | Piezoelektrischer oszillator und verfahren zu seiner herstellung |
DE60238959T Expired - Lifetime DE60238959D1 (de) | 2001-04-18 | 2002-04-17 | Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60238570T Expired - Lifetime DE60238570D1 (de) | 2001-04-18 | 2002-04-17 | Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung |
DE60236790T Expired - Lifetime DE60236790D1 (de) | 2001-04-18 | 2002-04-17 | Piezoelektrischer oszillator und verfahren zu seiner herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US7023288B2 (de) |
EP (3) | EP2101551B1 (de) |
KR (1) | KR100910781B1 (de) |
CN (1) | CN1295861C (de) |
DE (3) | DE60238570D1 (de) |
ES (1) | ES2348024T3 (de) |
WO (1) | WO2002087070A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004242089A (ja) * | 2003-02-06 | 2004-08-26 | Murata Mfg Co Ltd | 水晶発振器およびそれを用いた電子装置 |
JP4244865B2 (ja) * | 2004-06-03 | 2009-03-25 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
JP2006245098A (ja) * | 2005-03-01 | 2006-09-14 | Seiko Epson Corp | 電子部品及びその製造方法、並びに電子機器 |
US7342308B2 (en) * | 2005-12-20 | 2008-03-11 | Atmel Corporation | Component stacking for integrated circuit electronic package |
US7821122B2 (en) | 2005-12-22 | 2010-10-26 | Atmel Corporation | Method and system for increasing circuitry interconnection and component capacity in a multi-component package |
JP4244053B2 (ja) * | 2006-06-16 | 2009-03-25 | エプソントヨコム株式会社 | 圧電デバイスを備えた電子モジュール |
NO326372B1 (no) * | 2006-09-21 | 2008-11-17 | Polight As | Polymerlinse |
KR100790750B1 (ko) * | 2006-12-06 | 2008-01-02 | 삼성전기주식회사 | 수정진동자 패키지 |
JP4458203B2 (ja) * | 2007-12-06 | 2010-04-28 | 株式会社村田製作所 | 圧電振動部品 |
JP2009188633A (ja) * | 2008-02-05 | 2009-08-20 | Nippon Dempa Kogyo Co Ltd | 表面実装発振器 |
JP4788740B2 (ja) * | 2008-06-09 | 2011-10-05 | セイコーエプソン株式会社 | 圧電発振器、及びその製造方法、並びに圧電発振器を利用した携帯電話装置、電子機器 |
JP2013153412A (ja) * | 2011-12-27 | 2013-08-08 | Nippon Dempa Kogyo Co Ltd | 表面実装型圧電発振器 |
CN104285372B (zh) * | 2012-06-19 | 2017-07-04 | 株式会社大真空 | 表面安装型压电振荡器 |
FI20125725L (fi) * | 2012-06-26 | 2013-12-27 | Tellabs Oy | Mekaanisella suojauksella varustettu piirikorttijärjestely |
US9018753B2 (en) * | 2013-08-02 | 2015-04-28 | Stmicroelectronics Pte Ltd | Electronic modules |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5991719A (ja) * | 1982-11-17 | 1984-05-26 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
JPH043609A (ja) | 1990-04-20 | 1992-01-08 | Victor Co Of Japan Ltd | 発振器 |
JPH0471019A (ja) | 1990-07-12 | 1992-03-05 | Brother Ind Ltd | データ処理装置 |
JPH0471019U (de) * | 1990-10-31 | 1992-06-23 | ||
JP3128906B2 (ja) * | 1991-12-04 | 2001-01-29 | セイコーエプソン株式会社 | 圧電発振器 |
JPH06291551A (ja) * | 1993-03-31 | 1994-10-18 | Nippon Dempa Kogyo Co Ltd | 圧電発振器 |
JP3101175B2 (ja) | 1994-04-15 | 2000-10-23 | シチズン時計株式会社 | 水晶発振器 |
US5642265A (en) * | 1994-11-29 | 1997-06-24 | Sgs-Thomson Microelectronics, Inc. | Ball grid array package with detachable module |
JPH11343171A (ja) * | 1998-05-29 | 1999-12-14 | Murata Mfg Co Ltd | 圧電セラミック、圧電セラミックの製造方法、および圧電発振子 |
JPH11355047A (ja) * | 1998-06-08 | 1999-12-24 | Toyo Commun Equip Co Ltd | 圧電発振器 |
JP2000323927A (ja) | 1999-05-13 | 2000-11-24 | Toyo Commun Equip Co Ltd | 圧電発振器 |
JP2001016036A (ja) * | 1999-06-29 | 2001-01-19 | Nippon Dempa Kogyo Co Ltd | 表面実装型の水晶発振器 |
KR100506534B1 (ko) * | 2000-01-31 | 2005-08-05 | 긴세키 가부시키가이샤 | 압전진동자를 사용한 발진회로용 용기, 그 제조방법 및발진기 |
KR20030055681A (ko) * | 2001-12-27 | 2003-07-04 | 삼성전기주식회사 | 온도보상형 수정발진기 및 그 제조방법 |
-
2002
- 2002-04-17 EP EP09164309A patent/EP2101551B1/de not_active Expired - Fee Related
- 2002-04-17 CN CNB028012526A patent/CN1295861C/zh not_active Expired - Fee Related
- 2002-04-17 DE DE60238570T patent/DE60238570D1/de not_active Expired - Lifetime
- 2002-04-17 WO PCT/JP2002/003809 patent/WO2002087070A1/ja active Application Filing
- 2002-04-17 US US10/475,072 patent/US7023288B2/en not_active Expired - Lifetime
- 2002-04-17 EP EP02764101A patent/EP1381151B1/de not_active Expired - Fee Related
- 2002-04-17 KR KR1020027015725A patent/KR100910781B1/ko not_active IP Right Cessation
- 2002-04-17 ES ES02764101T patent/ES2348024T3/es not_active Expired - Lifetime
- 2002-04-17 DE DE60236790T patent/DE60236790D1/de not_active Expired - Lifetime
- 2002-04-17 DE DE60238959T patent/DE60238959D1/de not_active Expired - Lifetime
- 2002-04-17 EP EP09164310A patent/EP2101406B1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100910781B1 (ko) | 2009-08-04 |
ES2348024T3 (es) | 2010-11-26 |
CN1295861C (zh) | 2007-01-17 |
KR20030013426A (ko) | 2003-02-14 |
EP2101551B1 (de) | 2010-12-08 |
EP1381151A4 (de) | 2008-02-06 |
CN1461517A (zh) | 2003-12-10 |
EP1381151B1 (de) | 2010-06-23 |
DE60236790D1 (de) | 2010-08-05 |
US20040113708A1 (en) | 2004-06-17 |
WO2002087070A1 (fr) | 2002-10-31 |
EP2101551A1 (de) | 2009-09-16 |
US7023288B2 (en) | 2006-04-04 |
EP2101406A1 (de) | 2009-09-16 |
EP2101406B1 (de) | 2011-01-12 |
DE60238570D1 (de) | 2011-01-20 |
EP1381151A1 (de) | 2004-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R082 | Change of representative |
Ref document number: 2101406 Country of ref document: EP Representative=s name: GROSSE, SCHUMACHER, KNAUER VON HIRSCHHAUSEN, 80335 |