DE102004041178B8 - Akustischer Filmresonator und Verfahren zu dessen Herstellung - Google Patents
Akustischer Filmresonator und Verfahren zu dessen Herstellung Download PDFInfo
- Publication number
- DE102004041178B8 DE102004041178B8 DE200410041178 DE102004041178A DE102004041178B8 DE 102004041178 B8 DE102004041178 B8 DE 102004041178B8 DE 200410041178 DE200410041178 DE 200410041178 DE 102004041178 A DE102004041178 A DE 102004041178A DE 102004041178 B8 DE102004041178 B8 DE 102004041178B8
- Authority
- DE
- Germany
- Prior art keywords
- production
- film resonator
- acoustic film
- acoustic
- resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/562—Monolithic crystal filters comprising a ceramic piezoelectric layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/564—Monolithic crystal filters implemented with thin-film techniques
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/023—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-303707 | 2003-08-27 | ||
JP2003303707A JP2005073175A (ja) | 2003-08-27 | 2003-08-27 | 圧電薄膜共振子及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
DE102004041178A1 DE102004041178A1 (de) | 2005-05-04 |
DE102004041178B4 DE102004041178B4 (de) | 2013-08-14 |
DE102004041178B8 true DE102004041178B8 (de) | 2014-01-23 |
Family
ID=34214006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200410041178 Active DE102004041178B8 (de) | 2003-08-27 | 2004-08-25 | Akustischer Filmresonator und Verfahren zu dessen Herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US7323953B2 (de) |
JP (1) | JP2005073175A (de) |
KR (1) | KR20050021309A (de) |
CN (1) | CN100594674C (de) |
DE (1) | DE102004041178B8 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4548171B2 (ja) * | 2005-03-24 | 2010-09-22 | ソニー株式会社 | 圧電共振素子およびその製造方法 |
JP4629492B2 (ja) * | 2005-05-10 | 2011-02-09 | 太陽誘電株式会社 | 圧電薄膜共振子およびフィルタ |
JP2007048816A (ja) * | 2005-08-08 | 2007-02-22 | Seiko Epson Corp | アクチュエータ装置の製造方法及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
JP4756461B2 (ja) | 2005-10-12 | 2011-08-24 | 宇部興産株式会社 | 窒化アルミニウム薄膜およびそれを用いた圧電薄膜共振子 |
JP4252584B2 (ja) | 2006-04-28 | 2009-04-08 | 富士通メディアデバイス株式会社 | 圧電薄膜共振器およびフィルタ |
WO2008016075A1 (fr) * | 2006-08-03 | 2008-02-07 | Panasonic Corporation | Résonateur à films acoustiques variable en fréquence, filtre et appareil de communication utilisant celui-ci |
JP2008054258A (ja) * | 2006-08-28 | 2008-03-06 | Kanagawa Acad Of Sci & Technol | 半導体素子、フィルタ素子、通信機器及び半導体素子の製造方法 |
JP4968900B2 (ja) * | 2006-10-17 | 2012-07-04 | 太陽誘電株式会社 | ラダー型フィルタの製造方法 |
US8833174B2 (en) * | 2007-04-12 | 2014-09-16 | Colorado School Of Mines | Piezoelectric sensor based smart-die structure for predicting the onset of failure during die casting operations |
US7405625B1 (en) * | 2007-04-25 | 2008-07-29 | Analog Devices, Inc. | Common-mode control structures and signal converter systems for use therewith |
JP5009369B2 (ja) * | 2007-07-13 | 2012-08-22 | 太陽誘電株式会社 | 圧電薄膜共振素子及びこれを用いた回路部品 |
WO2009011022A1 (ja) | 2007-07-13 | 2009-01-22 | Fujitsu Limited | 圧電薄膜共振素子及びこれを用いた回路部品 |
US8035277B2 (en) * | 2007-08-14 | 2011-10-11 | Avago Technologies Wireless Ip (Singapore) Pte.Ltd. | Method for forming a multi-layer electrode underlying a piezoelectric layer and related structure |
WO2009023098A2 (en) | 2007-08-14 | 2009-02-19 | Skyworks Solutions, Inc. | Bulk acoustic wave structure with aluminum copper nitride piezoelectric layer and related method |
JP2008079328A (ja) * | 2007-10-12 | 2008-04-03 | Fujitsu Media Device Kk | 圧電薄膜共振子及びその製造方法 |
CN101960717B (zh) * | 2008-03-04 | 2014-04-23 | 太阳诱电株式会社 | 压电薄膜谐振器、滤波器、通信模块及通信装置 |
US7602102B1 (en) * | 2008-04-24 | 2009-10-13 | Skyworks Solutions, Inc. | Bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling |
US7795781B2 (en) * | 2008-04-24 | 2010-09-14 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator with reduced energy loss |
JP5286016B2 (ja) * | 2008-10-03 | 2013-09-11 | 京セラ株式会社 | フィルタおよびデュプレクサ、ならびにフィルタの製造方法 |
US8390397B2 (en) * | 2010-03-29 | 2013-03-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator structure comprising hybrid electrodes |
US9608589B2 (en) | 2010-10-26 | 2017-03-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of forming acoustic resonator using intervening seed layer |
KR101856057B1 (ko) * | 2011-12-08 | 2018-05-10 | 삼성전자주식회사 | 체적 음향 공진기, 체적 음향 공진기의 제조방법 및 체적 음향 공진기를 이용한 rf 디바이스 |
US9065421B2 (en) | 2012-01-31 | 2015-06-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator with multi-layers of different piezoelectric materials and method of making |
KR102176280B1 (ko) | 2015-12-18 | 2020-11-09 | 삼성전기주식회사 | 음향 공진기 및 그 제조 방법 |
CN107527993B (zh) * | 2016-06-20 | 2020-05-26 | 上海磁宇信息科技有限公司 | 一种磁性隧道结接触电极及其形成方法 |
KR102395994B1 (ko) * | 2017-12-27 | 2022-05-11 | 삼성전자주식회사 | 지향성 마이크로폰 |
JP7298991B2 (ja) * | 2018-01-22 | 2023-06-27 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
CN110957989B (zh) | 2018-09-26 | 2024-01-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | 薄膜体声波谐振器及其制作方法 |
CN111384920A (zh) * | 2018-12-29 | 2020-07-07 | 中芯集成电路(宁波)有限公司上海分公司 | 晶体谐振器与控制电路的集成结构及其集成方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204776A (ja) * | 1992-12-28 | 1994-07-22 | Oki Electric Ind Co Ltd | 圧電薄膜振動子の製造方法 |
US5587620A (en) * | 1993-12-21 | 1996-12-24 | Hewlett-Packard Company | Tunable thin film acoustic resonators and method for making the same |
JP2000069594A (ja) * | 1998-06-02 | 2000-03-03 | Hewlett Packard Co <Hp> | 音響共振器とその製作方法 |
US6271619B1 (en) * | 1997-05-13 | 2001-08-07 | Mitsubishi Denki Kabushiki Kaisha | Piezoelectric thin film device |
US20030132683A1 (en) * | 2002-01-08 | 2003-07-17 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator, piezoelectric filter, duplexer, communication apparatus, and method for manufacturing piezoelectric resonator |
Family Cites Families (20)
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JP3672115B2 (ja) | 1995-09-19 | 2005-07-13 | 富士通株式会社 | 薄膜形成方法及び半導体装置の製造方法 |
WO1999066558A1 (fr) | 1998-06-19 | 1999-12-23 | Hitachi, Ltd. | Dispositif a semiconducteur et son procede de production |
JP2000244030A (ja) | 1999-02-23 | 2000-09-08 | Mitsubishi Electric Corp | 圧電体薄膜素子 |
JP2001111136A (ja) | 1999-10-08 | 2001-04-20 | Fujitsu Ltd | 磁化方向制御膜及びこれを用いた磁気抵抗効果型センサ |
JP2001251159A (ja) | 2000-03-08 | 2001-09-14 | Mitsubishi Electric Corp | 薄膜圧電素子及びその製造方法 |
US6472954B1 (en) | 2001-04-23 | 2002-10-29 | Agilent Technologies, Inc. | Controlled effective coupling coefficients for film bulk acoustic resonators |
JP4074493B2 (ja) | 2001-08-31 | 2008-04-09 | 日本碍子株式会社 | セラミック素子 |
JP3954395B2 (ja) * | 2001-10-26 | 2007-08-08 | 富士通株式会社 | 圧電薄膜共振子、フィルタ、および圧電薄膜共振子の製造方法 |
KR100506729B1 (ko) * | 2002-05-21 | 2005-08-08 | 삼성전기주식회사 | 박막 벌크 어코스틱 공진기(FBARs)소자 및 그제조방법 |
KR100489828B1 (ko) * | 2003-04-07 | 2005-05-16 | 삼성전기주식회사 | Fbar 소자 및 그 제조방법 |
JP4024741B2 (ja) * | 2003-10-20 | 2007-12-19 | 富士通メディアデバイス株式会社 | 圧電薄膜共振子及びフィルタ |
EP1701440A4 (de) * | 2003-12-19 | 2008-09-24 | Ube Industries | Verfahren zur herstellung eines piezoelektrischen dünnfilmbauelements und piezoelektrisches dünnfilmbauelement |
JP4373949B2 (ja) * | 2004-04-20 | 2009-11-25 | 株式会社東芝 | 薄膜圧電共振器及びその製造方法 |
JP4149416B2 (ja) * | 2004-05-31 | 2008-09-10 | 富士通メディアデバイス株式会社 | 圧電薄膜共振子およびフィルタならびにそれらの製造方法 |
JP2006019935A (ja) * | 2004-06-30 | 2006-01-19 | Toshiba Corp | 薄膜圧電共振器及びその製造方法 |
KR100760780B1 (ko) * | 2004-09-28 | 2007-09-21 | 후지쓰 메디아 데바이스 가부시키가이샤 | 분파기 |
JP4535841B2 (ja) * | 2004-10-28 | 2010-09-01 | 富士通メディアデバイス株式会社 | 圧電薄膜共振子及びこれを用いたフィルタ |
JP4550658B2 (ja) * | 2005-04-28 | 2010-09-22 | 富士通メディアデバイス株式会社 | 圧電薄膜共振器およびフィルタ |
JP4629492B2 (ja) * | 2005-05-10 | 2011-02-09 | 太陽誘電株式会社 | 圧電薄膜共振子およびフィルタ |
JP4707533B2 (ja) * | 2005-10-27 | 2011-06-22 | 太陽誘電株式会社 | 圧電薄膜共振器およびフィルタ |
-
2003
- 2003-08-27 JP JP2003303707A patent/JP2005073175A/ja not_active Withdrawn
-
2004
- 2004-08-25 DE DE200410041178 patent/DE102004041178B8/de active Active
- 2004-08-26 KR KR1020040067470A patent/KR20050021309A/ko active Search and Examination
- 2004-08-26 US US10/926,329 patent/US7323953B2/en active Active
- 2004-08-27 CN CN200410057295A patent/CN100594674C/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204776A (ja) * | 1992-12-28 | 1994-07-22 | Oki Electric Ind Co Ltd | 圧電薄膜振動子の製造方法 |
US5587620A (en) * | 1993-12-21 | 1996-12-24 | Hewlett-Packard Company | Tunable thin film acoustic resonators and method for making the same |
US6271619B1 (en) * | 1997-05-13 | 2001-08-07 | Mitsubishi Denki Kabushiki Kaisha | Piezoelectric thin film device |
JP2000069594A (ja) * | 1998-06-02 | 2000-03-03 | Hewlett Packard Co <Hp> | 音響共振器とその製作方法 |
US20030132683A1 (en) * | 2002-01-08 | 2003-07-17 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator, piezoelectric filter, duplexer, communication apparatus, and method for manufacturing piezoelectric resonator |
Also Published As
Publication number | Publication date |
---|---|
US20050046519A1 (en) | 2005-03-03 |
DE102004041178A1 (de) | 2005-05-04 |
KR20050021309A (ko) | 2005-03-07 |
JP2005073175A (ja) | 2005-03-17 |
CN1592100A (zh) | 2005-03-09 |
DE102004041178B4 (de) | 2013-08-14 |
US7323953B2 (en) | 2008-01-29 |
CN100594674C (zh) | 2010-03-17 |
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8110 | Request for examination paragraph 44 | ||
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Owner name: TAIYO YUDEN CO., LTD., TOKIO/TOKYO, JP |
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R018 | Grant decision by examination section/examining division | ||
R083 | Amendment of/additions to inventor(s) | ||
R020 | Patent grant now final |
Effective date: 20131115 |
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R082 | Change of representative |
Representative=s name: HL KEMPNER PATENTANWAELTE, SOLICITORS (ENGLAND, DE Representative=s name: HL KEMPNER PATENTANWALT, RECHTSANWALT, SOLICIT, DE |