DE102004041178A1 - Akustischer Filmresonator und Herstellungsverfahren hierfür - Google Patents
Akustischer Filmresonator und Herstellungsverfahren hierfür Download PDFInfo
- Publication number
- DE102004041178A1 DE102004041178A1 DE200410041178 DE102004041178A DE102004041178A1 DE 102004041178 A1 DE102004041178 A1 DE 102004041178A1 DE 200410041178 DE200410041178 DE 200410041178 DE 102004041178 A DE102004041178 A DE 102004041178A DE 102004041178 A1 DE102004041178 A1 DE 102004041178A1
- Authority
- DE
- Germany
- Prior art keywords
- film resonator
- manufacturing
- method therefor
- acoustic film
- piezoelectric thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 abstract 3
- 239000010408 film Substances 0.000 abstract 2
- 229910000929 Ru alloy Inorganic materials 0.000 abstract 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 abstract 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 1
- 229910052707 ruthenium Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/562—Monolithic crystal filters comprising a ceramic piezoelectric layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/564—Monolithic crystal filters implemented with thin-film techniques
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/023—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Der offenbarte akustische Filmresonator umfasst Folgendes: einen piezoelektrischen Dünnfilm, der auf einer Hauptoberfläche eines Substrats ausgebildet ist, und eine untere Elektrode und eine obere Elektrode, welche so angeordnet sind, dass der piezoelektrische Dünnfilm zwischen sie geschichtet ist. Bei diesem akustischen Filmresonator ist der piezoelektrische Dünnfilm aus Aluminiumnitrid hergestellt, und die untere Elektrode und/oder die obere Elektrode enthält eine Ruthenium- oder Rutheniumlegierungsschicht.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-303707 | 2003-08-27 | ||
JP2003303707A JP2005073175A (ja) | 2003-08-27 | 2003-08-27 | 圧電薄膜共振子及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
DE102004041178A1 true DE102004041178A1 (de) | 2005-05-04 |
DE102004041178B4 DE102004041178B4 (de) | 2013-08-14 |
DE102004041178B8 DE102004041178B8 (de) | 2014-01-23 |
Family
ID=34214006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200410041178 Active DE102004041178B8 (de) | 2003-08-27 | 2004-08-25 | Akustischer Filmresonator und Verfahren zu dessen Herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US7323953B2 (de) |
JP (1) | JP2005073175A (de) |
KR (1) | KR20050021309A (de) |
CN (1) | CN100594674C (de) |
DE (1) | DE102004041178B8 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112008002181B4 (de) | 2007-08-14 | 2023-08-03 | Avago Technologies International Sales Pte. Limited | Bulkakustikwellenstruktur mit einer piezoelektrischen Aluminiumkupfernitrid-Schicht und darauf bezogenes Verfahren |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4548171B2 (ja) * | 2005-03-24 | 2010-09-22 | ソニー株式会社 | 圧電共振素子およびその製造方法 |
JP4629492B2 (ja) * | 2005-05-10 | 2011-02-09 | 太陽誘電株式会社 | 圧電薄膜共振子およびフィルタ |
JP2007048816A (ja) * | 2005-08-08 | 2007-02-22 | Seiko Epson Corp | アクチュエータ装置の製造方法及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
JP4756461B2 (ja) | 2005-10-12 | 2011-08-24 | 宇部興産株式会社 | 窒化アルミニウム薄膜およびそれを用いた圧電薄膜共振子 |
JP4252584B2 (ja) | 2006-04-28 | 2009-04-08 | 富士通メディアデバイス株式会社 | 圧電薄膜共振器およびフィルタ |
CN101501990B (zh) * | 2006-08-03 | 2012-03-14 | 松下电器产业株式会社 | 频率可变声音薄膜谐振器、滤波器以及使用滤波器的通信装置 |
JP2008054258A (ja) * | 2006-08-28 | 2008-03-06 | Kanagawa Acad Of Sci & Technol | 半導体素子、フィルタ素子、通信機器及び半導体素子の製造方法 |
JP4968900B2 (ja) * | 2006-10-17 | 2012-07-04 | 太陽誘電株式会社 | ラダー型フィルタの製造方法 |
US8833174B2 (en) * | 2007-04-12 | 2014-09-16 | Colorado School Of Mines | Piezoelectric sensor based smart-die structure for predicting the onset of failure during die casting operations |
US7405625B1 (en) * | 2007-04-25 | 2008-07-29 | Analog Devices, Inc. | Common-mode control structures and signal converter systems for use therewith |
JP5009369B2 (ja) * | 2007-07-13 | 2012-08-22 | 太陽誘電株式会社 | 圧電薄膜共振素子及びこれを用いた回路部品 |
WO2009011022A1 (ja) * | 2007-07-13 | 2009-01-22 | Fujitsu Limited | 圧電薄膜共振素子及びこれを用いた回路部品 |
KR101312222B1 (ko) * | 2007-08-14 | 2013-09-27 | 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 | 다층 전극 제조 방법, baw 공진기 및 그 제조 방법 |
JP2008079328A (ja) * | 2007-10-12 | 2008-04-03 | Fujitsu Media Device Kk | 圧電薄膜共振子及びその製造方法 |
US8653908B2 (en) | 2008-03-04 | 2014-02-18 | Taiyo Yuden Co., Ltd. | Film bulk acoustic resonator, filter, communication module and communication apparatus |
US7795781B2 (en) * | 2008-04-24 | 2010-09-14 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator with reduced energy loss |
US7602102B1 (en) * | 2008-04-24 | 2009-10-13 | Skyworks Solutions, Inc. | Bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling |
JP5286016B2 (ja) * | 2008-10-03 | 2013-09-11 | 京セラ株式会社 | フィルタおよびデュプレクサ、ならびにフィルタの製造方法 |
US8390397B2 (en) * | 2010-03-29 | 2013-03-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator structure comprising hybrid electrodes |
US9608589B2 (en) | 2010-10-26 | 2017-03-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of forming acoustic resonator using intervening seed layer |
KR101856057B1 (ko) | 2011-12-08 | 2018-05-10 | 삼성전자주식회사 | 체적 음향 공진기, 체적 음향 공진기의 제조방법 및 체적 음향 공진기를 이용한 rf 디바이스 |
US9065421B2 (en) | 2012-01-31 | 2015-06-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator with multi-layers of different piezoelectric materials and method of making |
KR102176280B1 (ko) | 2015-12-18 | 2020-11-09 | 삼성전기주식회사 | 음향 공진기 및 그 제조 방법 |
CN107527993B (zh) * | 2016-06-20 | 2020-05-26 | 上海磁宇信息科技有限公司 | 一种磁性隧道结接触电极及其形成方法 |
KR102395994B1 (ko) * | 2017-12-27 | 2022-05-11 | 삼성전자주식회사 | 지향성 마이크로폰 |
JP7298991B2 (ja) * | 2018-01-22 | 2023-06-27 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
CN110957989B (zh) | 2018-09-26 | 2024-01-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | 薄膜体声波谐振器及其制作方法 |
CN111384920A (zh) * | 2018-12-29 | 2020-07-07 | 中芯集成电路(宁波)有限公司上海分公司 | 晶体谐振器与控制电路的集成结构及其集成方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204776A (ja) * | 1992-12-28 | 1994-07-22 | Oki Electric Ind Co Ltd | 圧電薄膜振動子の製造方法 |
US5587620A (en) * | 1993-12-21 | 1996-12-24 | Hewlett-Packard Company | Tunable thin film acoustic resonators and method for making the same |
JP3672115B2 (ja) | 1995-09-19 | 2005-07-13 | 富士通株式会社 | 薄膜形成方法及び半導体装置の製造方法 |
WO1998052280A1 (fr) * | 1997-05-13 | 1998-11-19 | Mitsubishi Denki Kabushiki Kaisha | Dispositif a couche mince piezo-electrique |
US6060818A (en) * | 1998-06-02 | 2000-05-09 | Hewlett-Packard Company | SBAR structures and method of fabrication of SBAR.FBAR film processing techniques for the manufacturing of SBAR/BAR filters |
KR100765682B1 (ko) | 1998-06-19 | 2007-10-11 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치 및 그 제조 방법 |
JP2000244030A (ja) | 1999-02-23 | 2000-09-08 | Mitsubishi Electric Corp | 圧電体薄膜素子 |
JP2001111136A (ja) | 1999-10-08 | 2001-04-20 | Fujitsu Ltd | 磁化方向制御膜及びこれを用いた磁気抵抗効果型センサ |
JP2001251159A (ja) | 2000-03-08 | 2001-09-14 | Mitsubishi Electric Corp | 薄膜圧電素子及びその製造方法 |
US6472954B1 (en) | 2001-04-23 | 2002-10-29 | Agilent Technologies, Inc. | Controlled effective coupling coefficients for film bulk acoustic resonators |
JP4074493B2 (ja) | 2001-08-31 | 2008-04-09 | 日本碍子株式会社 | セラミック素子 |
JP3954395B2 (ja) * | 2001-10-26 | 2007-08-08 | 富士通株式会社 | 圧電薄膜共振子、フィルタ、および圧電薄膜共振子の製造方法 |
US6906451B2 (en) | 2002-01-08 | 2005-06-14 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator, piezoelectric filter, duplexer, communication apparatus, and method for manufacturing piezoelectric resonator |
KR100506729B1 (ko) * | 2002-05-21 | 2005-08-08 | 삼성전기주식회사 | 박막 벌크 어코스틱 공진기(FBARs)소자 및 그제조방법 |
KR100489828B1 (ko) * | 2003-04-07 | 2005-05-16 | 삼성전기주식회사 | Fbar 소자 및 그 제조방법 |
JP4024741B2 (ja) * | 2003-10-20 | 2007-12-19 | 富士通メディアデバイス株式会社 | 圧電薄膜共振子及びフィルタ |
CN100546178C (zh) * | 2003-12-19 | 2009-09-30 | 宇部兴产株式会社 | 制造压电薄膜器件的方法和压电薄膜器件 |
JP4373949B2 (ja) * | 2004-04-20 | 2009-11-25 | 株式会社東芝 | 薄膜圧電共振器及びその製造方法 |
JP4149416B2 (ja) * | 2004-05-31 | 2008-09-10 | 富士通メディアデバイス株式会社 | 圧電薄膜共振子およびフィルタならびにそれらの製造方法 |
JP2006019935A (ja) * | 2004-06-30 | 2006-01-19 | Toshiba Corp | 薄膜圧電共振器及びその製造方法 |
KR100760780B1 (ko) * | 2004-09-28 | 2007-09-21 | 후지쓰 메디아 데바이스 가부시키가이샤 | 분파기 |
JP4535841B2 (ja) * | 2004-10-28 | 2010-09-01 | 富士通メディアデバイス株式会社 | 圧電薄膜共振子及びこれを用いたフィルタ |
JP4550658B2 (ja) * | 2005-04-28 | 2010-09-22 | 富士通メディアデバイス株式会社 | 圧電薄膜共振器およびフィルタ |
JP4629492B2 (ja) * | 2005-05-10 | 2011-02-09 | 太陽誘電株式会社 | 圧電薄膜共振子およびフィルタ |
JP4707533B2 (ja) * | 2005-10-27 | 2011-06-22 | 太陽誘電株式会社 | 圧電薄膜共振器およびフィルタ |
-
2003
- 2003-08-27 JP JP2003303707A patent/JP2005073175A/ja not_active Withdrawn
-
2004
- 2004-08-25 DE DE200410041178 patent/DE102004041178B8/de active Active
- 2004-08-26 US US10/926,329 patent/US7323953B2/en active Active
- 2004-08-26 KR KR1020040067470A patent/KR20050021309A/ko active Search and Examination
- 2004-08-27 CN CN200410057295A patent/CN100594674C/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112008002181B4 (de) | 2007-08-14 | 2023-08-03 | Avago Technologies International Sales Pte. Limited | Bulkakustikwellenstruktur mit einer piezoelektrischen Aluminiumkupfernitrid-Schicht und darauf bezogenes Verfahren |
Also Published As
Publication number | Publication date |
---|---|
DE102004041178B4 (de) | 2013-08-14 |
KR20050021309A (ko) | 2005-03-07 |
DE102004041178B8 (de) | 2014-01-23 |
US7323953B2 (en) | 2008-01-29 |
US20050046519A1 (en) | 2005-03-03 |
JP2005073175A (ja) | 2005-03-17 |
CN1592100A (zh) | 2005-03-09 |
CN100594674C (zh) | 2010-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102004041178A1 (de) | Akustischer Filmresonator und Herstellungsverfahren hierfür | |
JP2005511853A5 (de) | ||
DE69808903T2 (de) | Verfahren zur herstellung eines mehrschichtwerkstoffes und ein mehrschichtwerkstoff der mit diesem verfahren herzustellen ist | |
ATE357740T1 (de) | Verfahren zur herstellung von substraten und dadurch hergestellte substrate | |
JP2002324666A5 (de) | ||
ATE483531T1 (de) | Substrat, umfassend zumindest eine voll- oder teilflächige makrostrukturierte schicht, verfahren zu deren herstellung und deren verwendung | |
EP2339310A3 (de) | Verbindungsbauteil mit integriertem Ultraschallsensor und Herstellungsverfahren | |
EP1329964A3 (de) | Piezoelektrisches Bauelement, Flüssigkeitsstrahlkopf und deren Herstellungsverfahren | |
DE20206640U1 (de) | Bodenplatten ohne unterseitige Klebstoffbeschichtung | |
DK1239525T3 (da) | Piezokeramiske, flerlagede aktuatorer samt en fremgangsmåde til fremstilling deraf | |
KR970070152A (ko) | 전도성 접착제 결합수단 | |
TW200713341A (en) | Chip resistor and method for producing the same | |
WO2007052225A3 (en) | Pillar based biosensor and method of making the same | |
EP1467483A3 (de) | Verfahren zur Herstellung einer akustischen Oberflächenwellenvorrichtung | |
EP1635404A3 (de) | Verbindungshalbleiter-Bauelement, dessen Herstellungsverfahren, Verbindungshalbleiter-Bauelement verwendender LED-Kopf und LED-Kopf verwendende Bilderzeugungsvorrichtung | |
EP1341217A3 (de) | Kondensator für eine Halbleiteranordnung, dessen Herstellungsmethode und Verwendung in einer elektronischen Anordnung | |
TW200606967A (en) | Method for manufacturing multilayer electronic component | |
EP1748500A3 (de) | Piezoelektrisches Element, Tröpfchenausstosskopf und Tröpfchenausstossgerät | |
EP1250031A3 (de) | Leiterplatte und deren Herstellungsverfahren | |
JP2002050939A5 (de) | ||
EP1580806A3 (de) | Halbleitersubstrat, Verfahren zur Herstellung einem Halbleitersubstrat und einer Halbleitervorrichtungen | |
WO2007127107A3 (en) | Microfabricated devices and method for fabricating microfabricated devices | |
DE50207639D1 (de) | Verfahren zum herstellen eines titan-aluminium-formbauteils | |
DE102007008107A1 (de) | Verfahren zur Herstellung einer Reflexionsschicht für Leuchtdiode und Leuchtdiodenträger mit der Reflexionsschicht | |
CN109860347A (zh) | 一种led氧化物键合结构及制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8127 | New person/name/address of the applicant |
Owner name: TAIYO YUDEN CO., LTD., TOKIO/TOKYO, JP |
|
R016 | Response to examination communication | ||
R018 | Grant decision by examination section/examining division | ||
R083 | Amendment of/additions to inventor(s) | ||
R020 | Patent grant now final |
Effective date: 20131115 |
|
R082 | Change of representative |
Representative=s name: HL KEMPNER PATENTANWAELTE, SOLICITORS (ENGLAND, DE Representative=s name: HL KEMPNER PATENTANWALT, RECHTSANWALT, SOLICIT, DE |