JP4859820B2 - プローブ - Google Patents
プローブ Download PDFInfo
- Publication number
- JP4859820B2 JP4859820B2 JP2007314194A JP2007314194A JP4859820B2 JP 4859820 B2 JP4859820 B2 JP 4859820B2 JP 2007314194 A JP2007314194 A JP 2007314194A JP 2007314194 A JP2007314194 A JP 2007314194A JP 4859820 B2 JP4859820 B2 JP 4859820B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contactor
- probe
- wafer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Description
2 プローブカード
10 プローブ
11 コンタクタ
21 支持部
22 梁部
23 接触子
24 外側切り込み部
25 内側切り込み部
26 先端部
P 電極
W ウェハ
Claims (1)
- 被検査体と接触して当該被検査体の電気的特性を検査するためのプローブであって、
支持部材によって片持ち支持される梁部と、
前記梁部の自由端部から被検査体側に延伸する接触子と、を有し、
前記接触子はニッケルコバルトで形成され、
前記梁部の自由端部側の前記接触子の側部には、切り込み部が上下方向に2箇所に形成され、
前記梁部の固定端部側の前記接触子の側部には、前記自由端部側の2箇所の切り込み部の間に切り込み部が1箇所に形成され、
前記切り込み部は、前記接触子にかかる接触圧力により当該接触子が上下方向に圧縮されないように形成されていることを特徴とする、プローブ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007314194A JP4859820B2 (ja) | 2007-12-05 | 2007-12-05 | プローブ |
CN2008801181929A CN101878431B (zh) | 2007-12-05 | 2008-11-05 | 探针 |
PCT/JP2008/070107 WO2009072368A1 (ja) | 2007-12-05 | 2008-11-05 | プローブ |
TW097142650A TWI391667B (zh) | 2007-12-05 | 2008-11-05 | 探針 |
US12/746,252 US8674717B2 (en) | 2007-12-05 | 2008-11-05 | Cantilevered probe having a bending contact |
KR1020107011584A KR101111974B1 (ko) | 2007-12-05 | 2008-11-05 | 프로브 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007314194A JP4859820B2 (ja) | 2007-12-05 | 2007-12-05 | プローブ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009139161A JP2009139161A (ja) | 2009-06-25 |
JP4859820B2 true JP4859820B2 (ja) | 2012-01-25 |
Family
ID=40717549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007314194A Expired - Fee Related JP4859820B2 (ja) | 2007-12-05 | 2007-12-05 | プローブ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8674717B2 (ja) |
JP (1) | JP4859820B2 (ja) |
KR (1) | KR101111974B1 (ja) |
CN (1) | CN101878431B (ja) |
TW (1) | TWI391667B (ja) |
WO (1) | WO2009072368A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013142806A1 (en) * | 2012-03-23 | 2013-09-26 | Advantest Corporation | Laterally driven probes for semiconductor testing |
US9678108B1 (en) | 2014-02-06 | 2017-06-13 | Advantest America, Inc. | Methods to manufacture semiconductor probe tips |
US10877070B2 (en) * | 2018-01-19 | 2020-12-29 | Formfactor Beaverton, Inc. | Probes with fiducial targets, probe systems including the same, and associated methods |
CN111141938B (zh) * | 2018-11-02 | 2021-10-29 | 旺矽科技股份有限公司 | 适用于具有倾斜导电接点的多待测单元的探针模块 |
JP7421990B2 (ja) * | 2020-04-08 | 2024-01-25 | 株式会社日本マイクロニクス | 電気的接続装置および検査方法 |
JP7470860B2 (ja) | 2021-03-16 | 2024-04-18 | 日本電子材料株式会社 | プローブカード用プローブおよびその製造方法 |
US11927603B2 (en) | 2021-10-20 | 2024-03-12 | Formfactor, Inc. | Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4199209A (en) * | 1978-08-18 | 1980-04-22 | Amp Incorporated | Electrical interconnecting device |
JP2000150598A (ja) * | 1998-11-07 | 2000-05-30 | Tokyo Electron Ltd | コンタクタ及びその製造方法 |
US6380755B1 (en) | 1998-09-14 | 2002-04-30 | Tokyo Electron Limited | Testing apparatus for test piece testing method contactor and method of manufacturing the same |
US6268015B1 (en) | 1998-12-02 | 2001-07-31 | Formfactor | Method of making and using lithographic contact springs |
US6255126B1 (en) | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
EP1135690B1 (en) * | 1998-12-02 | 2003-06-04 | Formfactor, Inc. | Lithographic contact elements |
US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
JP4579361B2 (ja) * | 1999-09-24 | 2010-11-10 | 軍生 木本 | 接触子組立体 |
US20040051541A1 (en) * | 2002-09-04 | 2004-03-18 | Yu Zhou | Contact structure with flexible cable and probe contact assembly using same |
US7567089B2 (en) * | 2003-02-04 | 2009-07-28 | Microfabrica Inc. | Two-part microprobes for contacting electronic components and methods for making such probes |
US6859054B1 (en) * | 2003-08-13 | 2005-02-22 | Advantest Corp. | Probe contact system using flexible printed circuit board |
DE102004036407A1 (de) * | 2003-08-27 | 2005-06-09 | Japan Electronic Materials Corp., Amagasaki | Prüfkarte und Verbinder für diese |
TWI266057B (en) * | 2004-02-05 | 2006-11-11 | Ind Tech Res Inst | Integrated probe card and the packaging method |
JP2005292019A (ja) * | 2004-04-02 | 2005-10-20 | Japan Electronic Materials Corp | プローブ |
US7176703B2 (en) * | 2004-08-31 | 2007-02-13 | Hitachi Global Storage Technologies Netherlands B.V. | Test probe with thermally activated grip and release |
JP2006119024A (ja) * | 2004-10-22 | 2006-05-11 | Tokyo Electron Ltd | プローブおよびその製造方法 |
US7629806B2 (en) * | 2005-03-08 | 2009-12-08 | Tokyo Electron Limited | Method for forming connection pin, probe, connection pin, probe card and method for manufacturing probe card |
US7487569B2 (en) * | 2005-08-19 | 2009-02-10 | The Scott Fetzer Company | Vacuum cleaner with drive assist |
JP4684805B2 (ja) * | 2005-08-25 | 2011-05-18 | 東京エレクトロン株式会社 | プローブ装置及び被検査体とプローブとの接触圧の調整方法 |
US7649367B2 (en) * | 2005-12-07 | 2010-01-19 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
JP4522975B2 (ja) * | 2006-06-19 | 2010-08-11 | 東京エレクトロン株式会社 | プローブカード |
JP5041275B2 (ja) * | 2006-08-08 | 2012-10-03 | 軍生 木本 | 電気信号接続用座標変換装置 |
US20080036484A1 (en) * | 2006-08-10 | 2008-02-14 | Leeno Industrial Inc. | Test probe and manufacturing method thereof |
JP2008122356A (ja) * | 2006-10-18 | 2008-05-29 | Isao Kimoto | プローブ |
US7583101B2 (en) * | 2007-01-18 | 2009-09-01 | Formfactor, Inc. | Probing structure with fine pitch probes |
JP5099487B2 (ja) * | 2007-08-03 | 2012-12-19 | 軍生 木本 | 複数梁合成型接触子 |
US7589547B2 (en) * | 2007-09-13 | 2009-09-15 | Touchdown Technologies, Inc. | Forked probe for testing semiconductor devices |
JP5288248B2 (ja) * | 2008-06-04 | 2013-09-11 | 軍生 木本 | 電気信号接続装置 |
US8536889B2 (en) * | 2009-03-10 | 2013-09-17 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
US8427186B2 (en) * | 2010-01-12 | 2013-04-23 | Formfactor, Inc. | Probe element having a substantially zero stiffness and applications thereof |
-
2007
- 2007-12-05 JP JP2007314194A patent/JP4859820B2/ja not_active Expired - Fee Related
-
2008
- 2008-11-05 WO PCT/JP2008/070107 patent/WO2009072368A1/ja active Application Filing
- 2008-11-05 TW TW097142650A patent/TWI391667B/zh not_active IP Right Cessation
- 2008-11-05 US US12/746,252 patent/US8674717B2/en not_active Expired - Fee Related
- 2008-11-05 KR KR1020107011584A patent/KR101111974B1/ko not_active IP Right Cessation
- 2008-11-05 CN CN2008801181929A patent/CN101878431B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100277193A1 (en) | 2010-11-04 |
TW200935066A (en) | 2009-08-16 |
KR20100077208A (ko) | 2010-07-07 |
JP2009139161A (ja) | 2009-06-25 |
WO2009072368A1 (ja) | 2009-06-11 |
CN101878431B (zh) | 2013-05-15 |
CN101878431A (zh) | 2010-11-03 |
TWI391667B (zh) | 2013-04-01 |
KR101111974B1 (ko) | 2012-02-14 |
US8674717B2 (en) | 2014-03-18 |
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