JP4797391B2 - インターポーザの製造方法 - Google Patents
インターポーザの製造方法 Download PDFInfo
- Publication number
- JP4797391B2 JP4797391B2 JP2005035043A JP2005035043A JP4797391B2 JP 4797391 B2 JP4797391 B2 JP 4797391B2 JP 2005035043 A JP2005035043 A JP 2005035043A JP 2005035043 A JP2005035043 A JP 2005035043A JP 4797391 B2 JP4797391 B2 JP 4797391B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- probes
- manufacturing
- interposer
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49609—Spring making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
に形成された複数の導通孔の他方面側と、第3基板に形成された複数の第2のプローブとを接続するステップとを含む。
この発明のさらに他の局面においては、本体と、前記本体に接続された複数のプローブとからなるインターポーザを製造する方法は、基板の上にレジストを用いて、複数のプローブを形成するステップと、レジストを除去して基板上に形成された複数のプローブを露出させるステップと、露出された複数のプローブを本体の所定の位置に接続するステップと、複数のプローブを本体に接続した後で、基板を除去するステップとを含む。
検査用電極と電気的に接触する接触子と、接触子を先端で支持する梁部とを有し、接触子が被検査体の検査用電極の配列パターンと同一のパターンになるように形成されている。
Claims (4)
- 本体と、前記本体に接続された複数のプローブとからなるインターポーザを製造する方法であって、
前記本体を製造するステップは、
一方面側と他方面側とを有し、ドライエッチングで加工可能な第1基板を準備するステップと、
前記第1基板にドライエッチングで複数の貫通孔を形成するステップと、
前記貫通孔を導通可能な導通孔にするステップとを含み、
前記複数のプローブを製造するステップは、
第2基板を準備するステップと、
前記第2基板の表面上にレジストを用いて所望の形状のモールドを形成するステップと、
前記モールドを用いて所望の形状の複数の第1のプローブを形成するステップとを含み、
前記第1基板に形成された複数の導通孔の一方面側と、前記第2基板に形成された複数の第1のプローブとを接続するステップとを含み、
前記貫通孔を導通孔にするステップは、前記第1基板に形成された複数の貫通孔の一方面側にメッキ用の金属板を接着して前記貫通孔のボトムアップフィル方式で導電層をメッキし、その後、前記金属板を除去するステップを含む、インターポーザの製造方法。 - 前記複数のプローブを製造するステップは、
第3基板を準備するステップと、
前記第3基板の表面上にレジストを用いて所望の形状のモールドを形成するステップと、
前記モールドを用いて所望の形状の複数の第2のプローブを形成するステップとを含み、
前記第1基板の他方面側に形成された複数の導通孔と、前記第3基板に形成された複数の第2のプローブとを接続するステップとを含む、請求項1に記載のインターポーザの製造方法。 - 前記レジストを用いて所望の形状のモールドを形成するステップは、ジグザグ形状のプローブを形成するためのモールドを形成するステップを含む、請求項1または2に記載のインターポーザの製造方法。
- 前記第1基板にドライエッチングで複数の貫通孔を形成するステップは、100μm以下の孔を形成するステップを含む、請求項1から3のいずれかに記載のインターポーザの製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005035043A JP4797391B2 (ja) | 2005-02-10 | 2005-02-10 | インターポーザの製造方法 |
AT06713381T ATE553388T1 (de) | 2005-02-10 | 2006-02-09 | Interposer, sondenkarte und verfahren zur herstellung eines zwischenstellungsglieds |
US11/884,075 US7891090B2 (en) | 2005-02-10 | 2006-02-09 | Method for manufacturing an interposer |
PCT/JP2006/302238 WO2006085573A1 (ja) | 2005-02-10 | 2006-02-09 | インターポーザ、プローブカードおよびインターポーザの製造方法 |
EP06713381A EP1847834B1 (en) | 2005-02-10 | 2006-02-09 | Interposer, probe card and method for manufacturing interposer |
TW095104644A TW200703601A (en) | 2005-02-10 | 2006-02-10 | Interposer, probe card, and manufacturing method for interposer |
US13/004,520 US20110109338A1 (en) | 2005-02-10 | 2011-01-11 | Interposer, probe card and method for manufacturing the interposer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005035043A JP4797391B2 (ja) | 2005-02-10 | 2005-02-10 | インターポーザの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006222309A JP2006222309A (ja) | 2006-08-24 |
JP4797391B2 true JP4797391B2 (ja) | 2011-10-19 |
Family
ID=36793144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005035043A Expired - Fee Related JP4797391B2 (ja) | 2005-02-10 | 2005-02-10 | インターポーザの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7891090B2 (ja) |
EP (1) | EP1847834B1 (ja) |
JP (1) | JP4797391B2 (ja) |
TW (1) | TW200703601A (ja) |
WO (1) | WO2006085573A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4797391B2 (ja) * | 2005-02-10 | 2011-10-19 | 東京エレクトロン株式会社 | インターポーザの製造方法 |
KR100920380B1 (ko) * | 2007-05-30 | 2009-10-07 | (주)엠투엔 | 프로브 팁의 제조 방법 |
US7987591B2 (en) | 2009-08-13 | 2011-08-02 | International Business Machines Corporation | Method of forming silicon chicklet pedestal |
KR101101589B1 (ko) * | 2009-10-19 | 2012-01-02 | 삼성전기주식회사 | 프로브 기판 및 그의 제조 방법 |
JP5648897B2 (ja) * | 2010-06-10 | 2015-01-07 | 独立行政法人産業技術総合研究所 | 貫通孔を形成しためっき層付シリコン基板の製造方法 |
TWI408386B (zh) * | 2011-01-28 | 2013-09-11 | Chroma Ate Inc | A carrier plate having an airtight via hole for a semiconductor test apparatus, and a method of manufacturing the same |
US8491315B1 (en) * | 2011-11-29 | 2013-07-23 | Plastronics Socket Partners, Ltd. | Micro via adapter socket |
US8641428B2 (en) * | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9082764B2 (en) | 2012-03-05 | 2015-07-14 | Corning Incorporated | Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same |
DE102017002150A1 (de) * | 2017-03-06 | 2018-09-06 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Elektrisches Kontaktelement |
US11201426B2 (en) * | 2018-08-13 | 2021-12-14 | Apple Inc. | Electrical contact appearance and protection |
KR20220049203A (ko) * | 2020-10-14 | 2022-04-21 | (주)포인트엔지니어링 | 전기 전도성 접촉핀, 이의 제조방법, 검사장치 및 성형물의 제조방법 및 그 성형물 |
Family Cites Families (19)
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US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5225771A (en) * | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
US5806181A (en) * | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
JP3759622B2 (ja) * | 1996-05-17 | 2006-03-29 | フォームファクター,インコーポレイテッド | 超小型電子接触構造及びその製造方法 |
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
US6114240A (en) * | 1997-12-18 | 2000-09-05 | Micron Technology, Inc. | Method for fabricating semiconductor components using focused laser beam |
TW589453B (en) * | 1998-12-02 | 2004-06-01 | Formfactor Inc | Lithographic contact elements |
JP2000321302A (ja) * | 1999-05-14 | 2000-11-24 | Tokyo Cathode Laboratory Co Ltd | プローブカード用回路基板及び回路基板の製造方法 |
JP2001091544A (ja) * | 1999-09-27 | 2001-04-06 | Hitachi Ltd | 半導体検査装置の製造方法 |
AU2001277799A1 (en) | 2000-08-16 | 2002-02-25 | Apex International Inc | Probe, probe card and probe manufacturing method |
JP2002286758A (ja) * | 2001-03-28 | 2002-10-03 | Yamaha Corp | プローブユニットおよびその製造方法 |
JP2003129286A (ja) * | 2001-10-29 | 2003-05-08 | Applied Materials Inc | フェイスアップ式めっき装置及びその運転方法 |
US6651325B2 (en) * | 2002-02-19 | 2003-11-25 | Industrial Technologies Research Institute | Method for forming cantilever beam probe card and probe card formed |
KR100373762B1 (en) | 2002-09-25 | 2003-02-26 | Uk Ki Lee | Method for manufacturing cavity-type micro-probe using mems technology and micro-probe according to the same |
JP2004259530A (ja) * | 2003-02-25 | 2004-09-16 | Shinko Electric Ind Co Ltd | 外部接触端子を有する半導体装置及びその使用方法 |
JP4153328B2 (ja) * | 2003-02-25 | 2008-09-24 | 日本シイエムケイ株式会社 | 多層プリント配線板の製造方法 |
KR100523745B1 (ko) * | 2003-03-24 | 2005-10-25 | 주식회사 유니테스트 | 전자소자 검사용 마이크로 프로브 및 그 제조 방법 |
JP4330367B2 (ja) * | 2003-04-03 | 2009-09-16 | 新光電気工業株式会社 | インターポーザー及びその製造方法ならびに電子装置 |
JP4797391B2 (ja) * | 2005-02-10 | 2011-10-19 | 東京エレクトロン株式会社 | インターポーザの製造方法 |
-
2005
- 2005-02-10 JP JP2005035043A patent/JP4797391B2/ja not_active Expired - Fee Related
-
2006
- 2006-02-09 WO PCT/JP2006/302238 patent/WO2006085573A1/ja active Application Filing
- 2006-02-09 US US11/884,075 patent/US7891090B2/en not_active Expired - Fee Related
- 2006-02-09 EP EP06713381A patent/EP1847834B1/en not_active Not-in-force
- 2006-02-10 TW TW095104644A patent/TW200703601A/zh not_active IP Right Cessation
-
2011
- 2011-01-11 US US13/004,520 patent/US20110109338A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2006085573A1 (ja) | 2006-08-17 |
EP1847834B1 (en) | 2012-04-11 |
TW200703601A (en) | 2007-01-16 |
US20110109338A1 (en) | 2011-05-12 |
EP1847834A1 (en) | 2007-10-24 |
TWI306650B (ja) | 2009-02-21 |
US20080171452A1 (en) | 2008-07-17 |
JP2006222309A (ja) | 2006-08-24 |
US7891090B2 (en) | 2011-02-22 |
EP1847834A4 (en) | 2008-04-30 |
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