JP2000156504A5 - - Google Patents
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- Publication number
- JP2000156504A5 JP2000156504A5 JP1998251675A JP25167598A JP2000156504A5 JP 2000156504 A5 JP2000156504 A5 JP 2000156504A5 JP 1998251675 A JP1998251675 A JP 1998251675A JP 25167598 A JP25167598 A JP 25167598A JP 2000156504 A5 JP2000156504 A5 JP 2000156504A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- film
- insulating film
- semiconductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 78
- 230000001681 protective effect Effects 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000012535 impurity Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25167598A JP4493741B2 (ja) | 1998-09-04 | 1998-09-04 | 半導体装置の作製方法 |
| US09/387,053 US6359320B1 (en) | 1998-09-04 | 1999-08-31 | Thin-film transistor with lightly-doped drain |
| EP99117347A EP0989614B1 (en) | 1998-09-04 | 1999-09-03 | TFT with an LDD structure and its manufacturing method |
| US10/084,428 US6737717B2 (en) | 1998-09-04 | 2002-02-28 | Thin-film transistor having lightly-doped drain structure |
| US10/813,233 US7098088B2 (en) | 1998-09-04 | 2004-03-31 | Semiconductor device having semiconductor circuit formed by semiconductor elements and method for manufacturing the same |
| US11/492,993 US7410847B2 (en) | 1998-09-04 | 2006-07-26 | Semiconductor device having semiconductor circuit formed by semiconductor elements and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25167598A JP4493741B2 (ja) | 1998-09-04 | 1998-09-04 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000156504A JP2000156504A (ja) | 2000-06-06 |
| JP2000156504A5 true JP2000156504A5 (enExample) | 2005-10-27 |
| JP4493741B2 JP4493741B2 (ja) | 2010-06-30 |
Family
ID=17226353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25167598A Expired - Fee Related JP4493741B2 (ja) | 1998-09-04 | 1998-09-04 | 半導体装置の作製方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (4) | US6359320B1 (enExample) |
| EP (1) | EP0989614B1 (enExample) |
| JP (1) | JP4493741B2 (enExample) |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0869967A (ja) * | 1994-08-26 | 1996-03-12 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP3830623B2 (ja) * | 1997-07-14 | 2006-10-04 | 株式会社半導体エネルギー研究所 | 結晶性半導体膜の作製方法 |
| JP3295346B2 (ja) * | 1997-07-14 | 2002-06-24 | 株式会社半導体エネルギー研究所 | 結晶性珪素膜の作製方法及びそれを用いた薄膜トランジスタ |
| US6246070B1 (en) * | 1998-08-21 | 2001-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device provided with semiconductor circuit made of semiconductor element and method of fabricating the same |
| JP2000174282A (ja) * | 1998-12-03 | 2000-06-23 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US6593592B1 (en) | 1999-01-29 | 2003-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having thin film transistors |
| US7122835B1 (en) * | 1999-04-07 | 2006-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrooptical device and a method of manufacturing the same |
| JP2001196594A (ja) * | 1999-08-31 | 2001-07-19 | Fujitsu Ltd | 薄膜トランジスタ、液晶表示用基板及びその製造方法 |
| JP2001119029A (ja) * | 1999-10-18 | 2001-04-27 | Fujitsu Ltd | 薄膜トランジスタ及びその製造方法及びそれを備えた液晶表示装置 |
| US6407440B1 (en) * | 2000-02-25 | 2002-06-18 | Micron Technology Inc. | Pixel cell with high storage capacitance for a CMOS imager |
| US8610645B2 (en) * | 2000-05-12 | 2013-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| EP1309994A2 (de) | 2000-08-18 | 2003-05-14 | Siemens Aktiengesellschaft | Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung |
| DE10043204A1 (de) | 2000-09-01 | 2002-04-04 | Siemens Ag | Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung |
| DE10061299A1 (de) | 2000-12-08 | 2002-06-27 | Siemens Ag | Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu |
| DE10061297C2 (de) | 2000-12-08 | 2003-05-28 | Siemens Ag | Verfahren zur Sturkturierung eines OFETs |
| TW525216B (en) | 2000-12-11 | 2003-03-21 | Semiconductor Energy Lab | Semiconductor device, and manufacturing method thereof |
| SG111923A1 (en) | 2000-12-21 | 2005-06-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
| DE10105914C1 (de) | 2001-02-09 | 2002-10-10 | Siemens Ag | Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung |
| US6720198B2 (en) | 2001-02-19 | 2004-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
| KR100437475B1 (ko) * | 2001-04-13 | 2004-06-23 | 삼성에스디아이 주식회사 | 평판 디스플레이 장치용 표시 소자 제조 방법 |
| KR100379684B1 (ko) * | 2001-04-20 | 2003-04-10 | 엘지.필립스 엘시디 주식회사 | 박막 트랜지스터 액정표시소자 제조방법 |
| JP4969001B2 (ja) * | 2001-09-20 | 2012-07-04 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| DE10151036A1 (de) | 2001-10-16 | 2003-05-08 | Siemens Ag | Isolator für ein organisches Elektronikbauteil |
| DE10151440C1 (de) | 2001-10-18 | 2003-02-06 | Siemens Ag | Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung |
| DE10160732A1 (de) | 2001-12-11 | 2003-06-26 | Siemens Ag | Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu |
| TW503496B (en) | 2001-12-31 | 2002-09-21 | Megic Corp | Chip packaging structure and manufacturing process of the same |
| TW517361B (en) * | 2001-12-31 | 2003-01-11 | Megic Corp | Chip package structure and its manufacture process |
| TW584950B (en) | 2001-12-31 | 2004-04-21 | Megic Corp | Chip packaging structure and process thereof |
| US6673698B1 (en) | 2002-01-19 | 2004-01-06 | Megic Corporation | Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers |
| TW544882B (en) * | 2001-12-31 | 2003-08-01 | Megic Corp | Chip package structure and process thereof |
| DE10212640B4 (de) | 2002-03-21 | 2004-02-05 | Siemens Ag | Logische Bauteile aus organischen Feldeffekttransistoren |
| US6930328B2 (en) * | 2002-04-11 | 2005-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| DE10226370B4 (de) | 2002-06-13 | 2008-12-11 | Polyic Gmbh & Co. Kg | Substrat für ein elektronisches Bauteil, Verwendung des Substrates, Verfahren zur Erhöhung der Ladungsträgermobilität und Organischer Feld-Effekt Transistor (OFET) |
| JP4234363B2 (ja) * | 2002-07-05 | 2009-03-04 | シャープ株式会社 | 薄膜トランジスタ装置及びその製造方法、並びにそれを備えた薄膜トランジスタ基板及び表示装置 |
| WO2004017439A2 (de) | 2002-07-29 | 2004-02-26 | Siemens Aktiengesellschaft | Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu |
| GB0218170D0 (en) * | 2002-08-06 | 2002-09-11 | Koninkl Philips Electronics Nv | Electroluminescent display devices |
| ATE355566T1 (de) | 2002-08-23 | 2006-03-15 | Polyic Gmbh & Co Kg | Organisches bauelement zum überspannungsschutz und dazugehörige schaltung |
| US7094684B2 (en) * | 2002-09-20 | 2006-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| CN100578573C (zh) * | 2002-09-20 | 2010-01-06 | 株式会社半导体能源研究所 | 显示器件及其制造方法 |
| US20040124421A1 (en) * | 2002-09-20 | 2004-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof |
| DE10253154A1 (de) | 2002-11-14 | 2004-05-27 | Siemens Ag | Messgerät zur Bestimmung eines Analyten in einer Flüssigkeitsprobe |
| ATE354182T1 (de) | 2002-11-19 | 2007-03-15 | Polyic Gmbh & Co Kg | Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu |
| JP4373085B2 (ja) | 2002-12-27 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法、剥離方法及び転写方法 |
| DE10302149A1 (de) | 2003-01-21 | 2005-08-25 | Siemens Ag | Verwendung leitfähiger Carbon-black/Graphit-Mischungen für die Herstellung von low-cost Elektronik |
| DE10339036A1 (de) | 2003-08-25 | 2005-03-31 | Siemens Ag | Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu |
| WO2005022262A1 (en) * | 2003-08-28 | 2005-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, manufacturing method for thin film transistor and manufacturing method for display device |
| DE10340643B4 (de) | 2003-09-03 | 2009-04-16 | Polyic Gmbh & Co. Kg | Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht |
| DE10340644B4 (de) | 2003-09-03 | 2010-10-07 | Polyic Gmbh & Co. Kg | Mechanische Steuerelemente für organische Polymerelektronik |
| JP4182022B2 (ja) * | 2004-04-01 | 2008-11-19 | キヤノン株式会社 | 表示装置用パネル及び表示装置 |
| KR101112538B1 (ko) * | 2004-07-27 | 2012-03-13 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| TWI247180B (en) | 2004-08-06 | 2006-01-11 | Au Optronics Corp | Thin film transistor structure for flat panel display and method for fabricating the same |
| DE102004040831A1 (de) | 2004-08-23 | 2006-03-09 | Polyic Gmbh & Co. Kg | Funketikettfähige Umverpackung |
| KR101061850B1 (ko) * | 2004-09-08 | 2011-09-02 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조방법 |
| US7033870B1 (en) * | 2004-11-29 | 2006-04-25 | International Business Machines Corporation | Semiconductor transistors with reduced gate-source/drain capacitances |
| DE102004059464A1 (de) | 2004-12-10 | 2006-06-29 | Polyic Gmbh & Co. Kg | Elektronikbauteil mit Modulator |
| DE102004059465A1 (de) | 2004-12-10 | 2006-06-14 | Polyic Gmbh & Co. Kg | Erkennungssystem |
| DE102004063435A1 (de) | 2004-12-23 | 2006-07-27 | Polyic Gmbh & Co. Kg | Organischer Gleichrichter |
| DE102005009819A1 (de) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe |
| DE102005009820A1 (de) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Elektronikbaugruppe mit organischen Logik-Schaltelementen |
| DE102005017655B4 (de) | 2005-04-15 | 2008-12-11 | Polyic Gmbh & Co. Kg | Mehrschichtiger Verbundkörper mit elektronischer Funktion |
| JP4675680B2 (ja) * | 2005-05-30 | 2011-04-27 | シャープ株式会社 | 薄膜トランジスタ基板の製造方法 |
| DE102005031448A1 (de) | 2005-07-04 | 2007-01-11 | Polyic Gmbh & Co. Kg | Aktivierbare optische Schicht |
| DE102005035589A1 (de) | 2005-07-29 | 2007-02-01 | Polyic Gmbh & Co. Kg | Verfahren zur Herstellung eines elektronischen Bauelements |
| DE102005044306A1 (de) | 2005-09-16 | 2007-03-22 | Polyic Gmbh & Co. Kg | Elektronische Schaltung und Verfahren zur Herstellung einer solchen |
| US20070231974A1 (en) * | 2006-03-30 | 2007-10-04 | Hsien-Kun Chiu | Thin film transistor having copper line and fabricating method thereof |
| JP2008010566A (ja) * | 2006-06-28 | 2008-01-17 | Ricoh Co Ltd | 半導体デバイス |
| US7777224B2 (en) * | 2007-01-30 | 2010-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| KR101092483B1 (ko) * | 2007-05-31 | 2011-12-13 | 캐논 가부시끼가이샤 | 산화물 반도체를 사용한 박막트랜지스터의 제조 방법 |
| WO2009125459A1 (ja) * | 2008-04-08 | 2009-10-15 | シャープ株式会社 | 半導体装置及びその製造方法 |
| JP2010003868A (ja) * | 2008-06-20 | 2010-01-07 | Sanyo Electric Co Ltd | 撮像装置 |
| JP2010205987A (ja) * | 2009-03-04 | 2010-09-16 | Sony Corp | 薄膜トランジスタおよびその製造方法並びに表示装置 |
| KR101730347B1 (ko) * | 2009-09-16 | 2017-04-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| KR102008769B1 (ko) | 2009-11-27 | 2019-08-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작방법 |
| IN2012DN05920A (enExample) * | 2010-01-20 | 2015-09-18 | Semiconductor Energy Lab | |
| JP5732500B2 (ja) * | 2013-09-06 | 2015-06-10 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP5978199B2 (ja) * | 2013-12-25 | 2016-08-24 | 株式会社半導体エネルギー研究所 | 発光装置 |
| TWI566409B (zh) * | 2014-08-26 | 2017-01-11 | 元太科技工業股份有限公司 | 電晶體及其製作方法 |
| KR102308905B1 (ko) * | 2014-11-21 | 2021-10-06 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 박막 트랜지스터의 제조 방법 및 박막 트랜지스터를 구비한 유기 발광 표시 장치 |
| KR102352182B1 (ko) * | 2015-01-23 | 2022-01-17 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| JP6007269B2 (ja) * | 2015-03-03 | 2016-10-12 | 株式会社半導体エネルギー研究所 | 表示装置及び電子機器 |
| DE112017004148T5 (de) | 2016-08-19 | 2019-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Verfahren zum Steuern der Stromzufuhr in einer Halbleitervorrichtung |
| JP2017142537A (ja) * | 2017-05-11 | 2017-08-17 | 株式会社半導体エネルギー研究所 | 半導体装置及び電子機器 |
| CN109216373B (zh) * | 2017-07-07 | 2021-04-09 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法 |
| JP7271246B2 (ja) * | 2019-03-19 | 2023-05-11 | 株式会社ジャパンディスプレイ | 表示装置 |
| WO2021189445A1 (zh) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制备方法、阵列基板、显示装置 |
| US12050398B2 (en) * | 2020-05-19 | 2024-07-30 | Micron Technology, Inc. | Semiconductor device and method of forming the same |
| KR20230085264A (ko) * | 2021-12-06 | 2023-06-14 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 그 제조 방법 |
| EP4350774A4 (en) * | 2022-08-03 | 2024-08-21 | Changxin Memory Technologies, Inc. | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHODS THEREFOR |
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1998
- 1998-09-04 JP JP25167598A patent/JP4493741B2/ja not_active Expired - Fee Related
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1999
- 1999-08-31 US US09/387,053 patent/US6359320B1/en not_active Expired - Lifetime
- 1999-09-03 EP EP99117347A patent/EP0989614B1/en not_active Expired - Lifetime
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2002
- 2002-02-28 US US10/084,428 patent/US6737717B2/en not_active Expired - Lifetime
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2004
- 2004-03-31 US US10/813,233 patent/US7098088B2/en not_active Expired - Fee Related
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2006
- 2006-07-26 US US11/492,993 patent/US7410847B2/en not_active Expired - Fee Related
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