HK1218166A1 - 可移動體驅動方法和可移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置以及設備製造方法 - Google Patents
可移動體驅動方法和可移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置以及設備製造方法Info
- Publication number
- HK1218166A1 HK1218166A1 HK16106076.6A HK16106076A HK1218166A1 HK 1218166 A1 HK1218166 A1 HK 1218166A1 HK 16106076 A HK16106076 A HK 16106076A HK 1218166 A1 HK1218166 A1 HK 1218166A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- movable body
- body drive
- device manufacturing
- pattern formation
- drive system
- Prior art date
Links
- 238000000034 method Methods 0.000 title 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000007261 regionalization Effects 0.000 title 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
- G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
- G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Data Mining & Analysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optics & Photonics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006236975 | 2006-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1218166A1 true HK1218166A1 (zh) | 2017-02-03 |
Family
ID=39136020
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16106076.6A HK1218166A1 (zh) | 2006-08-31 | 2016-05-30 | 可移動體驅動方法和可移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置以及設備製造方法 |
HK18104102.7A HK1244891A1 (zh) | 2006-08-31 | 2018-03-26 | 移動體驅動方法和移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置、以及設備製造方法 |
HK18104345.4A HK1244893A1 (zh) | 2006-08-31 | 2018-03-29 | 曝光裝置和方法以及設備製造方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18104102.7A HK1244891A1 (zh) | 2006-08-31 | 2018-03-26 | 移動體驅動方法和移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置、以及設備製造方法 |
HK18104345.4A HK1244893A1 (zh) | 2006-08-31 | 2018-03-29 | 曝光裝置和方法以及設備製造方法 |
Country Status (9)
Country | Link |
---|---|
US (9) | US8013982B2 (zh) |
EP (4) | EP3291010A1 (zh) |
JP (10) | JP5251511B2 (zh) |
KR (10) | KR101634893B1 (zh) |
CN (1) | CN101410945B (zh) |
HK (3) | HK1218166A1 (zh) |
SG (5) | SG174737A1 (zh) |
TW (7) | TWI572995B (zh) |
WO (1) | WO2008026739A1 (zh) |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201407395SA (en) | 2006-08-31 | 2014-12-30 | Nikon Corp | Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method |
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US9304412B2 (en) | 2007-08-24 | 2016-04-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method |
US8237919B2 (en) * | 2007-08-24 | 2012-08-07 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads |
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US8237916B2 (en) * | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
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WO2010013331A1 (ja) * | 2008-07-30 | 2010-02-04 | パイオニア株式会社 | 電子ビーム装置 |
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JP5151852B2 (ja) * | 2008-09-22 | 2013-02-27 | 株式会社ニコン | 補正情報作成方法、露光方法及び露光装置、並びにデバイス製造方法 |
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US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
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US8760629B2 (en) * | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
US8902402B2 (en) | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
JP5438988B2 (ja) * | 2009-02-17 | 2014-03-12 | 株式会社ミツトヨ | 測定システムおよび干渉計 |
US8792084B2 (en) * | 2009-05-20 | 2014-07-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
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US8553204B2 (en) * | 2009-05-20 | 2013-10-08 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
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US20110102761A1 (en) * | 2009-09-28 | 2011-05-05 | Nikon Corporation | Stage apparatus, exposure apparatus, and device fabricating method |
US20110096312A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110096306A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110096318A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110123913A1 (en) * | 2009-11-19 | 2011-05-26 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
US20110128523A1 (en) * | 2009-11-19 | 2011-06-02 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US8488106B2 (en) * | 2009-12-28 | 2013-07-16 | Nikon Corporation | Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method |
NL2006804A (en) | 2010-06-24 | 2011-12-28 | Asml Netherlands Bv | Measurement system, method and lithographic apparatus. |
NL2007155A (en) | 2010-08-25 | 2012-02-28 | Asml Netherlands Bv | Stage apparatus, lithographic apparatus and method of positioning an object table. |
CN102175133B (zh) * | 2011-02-25 | 2012-07-18 | 清华大学 | 全局金属膜厚度测量装置 |
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JP5533769B2 (ja) * | 2011-04-14 | 2014-06-25 | ウシオ電機株式会社 | マスクとワークの位置合せ方法 |
KR101801148B1 (ko) * | 2011-08-16 | 2017-11-27 | 삼성전자주식회사 | 초정밀 위치 제어 장치 및 그 6자유도 스테이지의 위치 및 자세 정보 산출 방법 |
US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
JP5971965B2 (ja) * | 2012-02-07 | 2016-08-17 | キヤノン株式会社 | 面形状計測方法、面形状計測装置、プログラム、および、光学素子の製造方法 |
WO2014054689A1 (ja) * | 2012-10-02 | 2014-04-10 | 株式会社ニコン | 移動体装置、露光装置、及びデバイス製造方法 |
JP2014115115A (ja) * | 2012-12-06 | 2014-06-26 | Advantest Corp | 補正装置、プローブ装置、および試験装置 |
JP6381184B2 (ja) | 2013-07-09 | 2018-08-29 | キヤノン株式会社 | 校正方法、測定装置、露光装置および物品の製造方法 |
JP6228420B2 (ja) * | 2013-10-08 | 2017-11-08 | キヤノン株式会社 | 検出装置、リソグラフィ装置、および物品の製造方法 |
CN106415193B (zh) | 2014-03-21 | 2019-08-09 | 卡尔佩迪姆技术有限公司 | 用于在柔性基板上制造微型结构的系统和方法 |
CN105045042B (zh) * | 2015-04-23 | 2017-06-16 | 清华大学 | 一种硅片台曝光区域六自由度位移测量方法 |
CN106483778B (zh) * | 2015-08-31 | 2018-03-30 | 上海微电子装备(集团)股份有限公司 | 基于相对位置测量的对准系统、双工件台系统及测量系统 |
KR20180059812A (ko) * | 2015-09-30 | 2018-06-05 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 플랫 패널 디스플레이 제조 방법 |
WO2017057539A1 (ja) * | 2015-09-30 | 2017-04-06 | 株式会社ニコン | 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法 |
CN107544213B (zh) * | 2016-06-29 | 2019-10-25 | 上海微电子装备(集团)股份有限公司 | 光刻机动态调平调焦方法 |
JP6704813B2 (ja) * | 2016-08-05 | 2020-06-03 | キヤノン株式会社 | 計測装置、露光装置、および物品の製造方法 |
JP6426691B2 (ja) * | 2016-12-22 | 2018-11-21 | ファナック株式会社 | 数値制御装置 |
JP6506785B2 (ja) * | 2017-02-02 | 2019-04-24 | 株式会社Kokusai Electric | リソグラフィ用テンプレートの製造方法、プログラム及び基板処理装置 |
CN108801161B (zh) * | 2017-04-28 | 2021-06-29 | 北京小米移动软件有限公司 | 测量系统、方法及装置、可读存储介质 |
CN109856929B (zh) * | 2017-11-30 | 2020-06-16 | 上海微电子装备(集团)股份有限公司 | 信号处理装置及处理方法、对准系统及对准方法和光刻机 |
CN108168438B (zh) * | 2017-12-28 | 2020-02-14 | 长春禹衡光学有限公司 | 一种封闭式光栅 |
CN108844500B (zh) * | 2018-04-10 | 2020-11-20 | 苏州久越金属科技有限公司 | 一种镭射自动化高效测量方法 |
CN108710266B (zh) * | 2018-05-18 | 2021-05-04 | 江苏影速集成电路装备股份有限公司 | 一种触发式对位结构的直写式曝光系统及方法 |
CN112334834B (zh) * | 2018-07-03 | 2023-10-17 | 应用材料公司 | 使用各自进行多次扫描的多个写入列来制作准确的光栅图案的系统和方法 |
CN111351464A (zh) * | 2018-12-20 | 2020-06-30 | 鸿富锦精密电子(郑州)有限公司 | 平整度检测装置及方法 |
JP7301695B2 (ja) * | 2019-09-19 | 2023-07-03 | キヤノン株式会社 | 制御装置、制御方法、リソグラフィ装置、および物品の製造方法 |
US20230305407A1 (en) * | 2020-07-28 | 2023-09-28 | Asml Netherlands B.V. | Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method |
JP7519691B2 (ja) | 2021-09-06 | 2024-07-22 | 尾池工業株式会社 | フレキシブル基板 |
JP7212996B1 (ja) | 2022-05-09 | 2023-01-26 | アツ子 森内 | 多目的 閂ケース付きアナログデジタル錠 |
Family Cites Families (181)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE224448C (zh) | ||||
DE221563C (zh) | ||||
JPS5129184B1 (zh) | 1971-07-15 | 1976-08-24 | ||
US4215938A (en) * | 1978-09-28 | 1980-08-05 | Farrand Industries, Inc. | Method and apparatus for correcting the error of a position measuring interferometer |
US4346164A (en) * | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
JPS57117238A (en) | 1981-01-14 | 1982-07-21 | Nippon Kogaku Kk <Nikon> | Exposing and baking device for manufacturing integrated circuit with illuminometer |
JPS57153433A (en) * | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
JPS58202448A (ja) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | 露光装置 |
JPS5919912A (ja) | 1982-07-26 | 1984-02-01 | Hitachi Ltd | 液浸距離保持装置 |
DD221563A1 (de) | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
JPS60119407A (ja) * | 1983-11-30 | 1985-06-26 | Nippon Kogaku Kk <Nikon> | 比較検査装置 |
DD224448A1 (de) | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | Einrichtung zur fotolithografischen strukturuebertragung |
US4780617A (en) * | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
JPS6144429A (ja) | 1984-08-09 | 1986-03-04 | Nippon Kogaku Kk <Nikon> | 位置合わせ方法、及び位置合せ装置 |
JPS61113376A (ja) | 1984-11-07 | 1986-05-31 | Sony Corp | テレビジヨン信号の動き検出装置 |
JPS6265326A (ja) | 1985-09-18 | 1987-03-24 | Hitachi Ltd | 露光装置 |
JPS63157419A (ja) | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
JPS63292005A (ja) * | 1987-05-25 | 1988-11-29 | Nikon Corp | 走り誤差補正をなした移動量検出装置 |
US5489986A (en) * | 1989-02-28 | 1996-02-06 | Nikon Corporation | Position detecting apparatus |
US5070250A (en) * | 1989-02-28 | 1991-12-03 | Nikon Corporation | Position detection apparatus with adjustable beam and interference fringe positions |
US5021649A (en) | 1989-03-28 | 1991-06-04 | Canon Kabushiki Kaisha | Relief diffraction grating encoder |
JP2784225B2 (ja) | 1989-11-28 | 1998-08-06 | 双葉電子工業株式会社 | 相対移動量測定装置 |
JP3077149B2 (ja) * | 1990-01-22 | 2000-08-14 | 株式会社ニコン | 測定装置、測定方法、及び露光装置、露光方法、及び回路パターンチップ |
US5523843A (en) * | 1990-07-09 | 1996-06-04 | Canon Kabushiki Kaisha | Position detecting system |
DE4033556A1 (de) | 1990-10-22 | 1992-04-23 | Suess Kg Karl | Messanordnung fuer x,y,(phi)-koordinatentische |
JPH04305915A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JPH04305917A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
US5506684A (en) | 1991-04-04 | 1996-04-09 | Nikon Corporation | Projection scanning exposure apparatus with synchronous mask/wafer alignment system |
JP3149472B2 (ja) | 1991-08-30 | 2001-03-26 | 株式会社ニコン | 走査露光装置および物体の移動測定装置 |
DE4219311C2 (de) | 1991-06-13 | 1996-03-07 | Sony Magnescale Inc | Verschiebungsdetektor |
JPH0562877A (ja) | 1991-09-02 | 1993-03-12 | Yasuko Shinohara | 光によるlsi製造縮小投影露光装置の光学系 |
JPH05129184A (ja) | 1991-10-30 | 1993-05-25 | Canon Inc | 投影露光装置 |
JP3167419B2 (ja) | 1992-05-28 | 2001-05-21 | 株式会社アルファ | 自動車用バッテリ監視装置 |
JPH06124873A (ja) | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
JP2753930B2 (ja) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
JP3316833B2 (ja) | 1993-03-26 | 2002-08-19 | 株式会社ニコン | 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法 |
KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
JP3303386B2 (ja) | 1993-02-03 | 2002-07-22 | 株式会社ニコン | 投影露光装置及び方法 |
US5461237A (en) * | 1993-03-26 | 1995-10-24 | Nikon Corporation | Surface-position setting apparatus |
US5583609A (en) * | 1993-04-23 | 1996-12-10 | Nikon Corporation | Projection exposure apparatus |
JP3375076B2 (ja) | 1993-04-27 | 2003-02-10 | 株式会社ニコン | 投影露光方法及び装置、並びに素子製造方法 |
US5581324A (en) * | 1993-06-10 | 1996-12-03 | Nikon Corporation | Thermal distortion compensated projection exposure method and apparatus for manufacturing semiconductors |
JPH09223650A (ja) | 1996-02-15 | 1997-08-26 | Nikon Corp | 露光装置 |
US6122036A (en) | 1993-10-21 | 2000-09-19 | Nikon Corporation | Projection exposure apparatus and method |
US5625453A (en) * | 1993-10-26 | 1997-04-29 | Canon Kabushiki Kaisha | System and method for detecting the relative positional deviation between diffraction gratings and for measuring the width of a line constituting a diffraction grating |
JPH07190741A (ja) * | 1993-12-27 | 1995-07-28 | Nippon Telegr & Teleph Corp <Ntt> | 測定誤差補正法 |
JPH07220990A (ja) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
JPH07270122A (ja) * | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
JPH0883753A (ja) * | 1994-09-13 | 1996-03-26 | Nikon Corp | 焦点検出方法 |
JPH08316125A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JPH08316124A (ja) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JP3815750B2 (ja) * | 1995-10-09 | 2006-08-30 | キヤノン株式会社 | ステージ装置、ならびに前記ステージ装置を用いた露光装置およびデバイス製造方法 |
JPH09318321A (ja) * | 1996-05-30 | 1997-12-12 | Olympus Optical Co Ltd | 測長装置 |
JPH1063011A (ja) | 1996-08-14 | 1998-03-06 | Nikon Corp | 走査型露光装置及び走査露光方法 |
US5917580A (en) * | 1996-08-29 | 1999-06-29 | Canon Kabushiki Kaisha | Scan exposure method and apparatus |
US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
EP0951054B1 (en) * | 1996-11-28 | 2008-08-13 | Nikon Corporation | Aligner and method for exposure |
JP4029183B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
JPH10223528A (ja) | 1996-12-30 | 1998-08-21 | Nikon Corp | 投影露光装置及び位置合わせ方法 |
EP0900412B1 (en) | 1997-03-10 | 2005-04-06 | ASML Netherlands B.V. | Lithographic apparatus comprising a positioning device having two object holders |
JPH10270535A (ja) | 1997-03-25 | 1998-10-09 | Nikon Corp | 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法 |
JP3747566B2 (ja) | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
JP3817836B2 (ja) | 1997-06-10 | 2006-09-06 | 株式会社ニコン | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
JPH1116816A (ja) | 1997-06-25 | 1999-01-22 | Nikon Corp | 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法 |
US6020964A (en) * | 1997-12-02 | 2000-02-01 | Asm Lithography B.V. | Interferometer system and lithograph apparatus including an interferometer system |
JPH11176727A (ja) | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
JP3809268B2 (ja) * | 1997-12-19 | 2006-08-16 | キヤノン株式会社 | デバイス製造方法 |
JPH11191585A (ja) * | 1997-12-26 | 1999-07-13 | Canon Inc | ステージ装置、およびこれを用いた露光装置、ならびにデバイス製造方法 |
JPH11233420A (ja) | 1998-02-18 | 1999-08-27 | Nikon Corp | 投影露光装置及び位置検出方法 |
WO1999046835A1 (fr) | 1998-03-11 | 1999-09-16 | Nikon Corporation | Dispositif a laser ultraviolet et appareil d'exposition comportant un tel dispositif a laser ultraviolet |
US6008610A (en) * | 1998-03-20 | 1999-12-28 | Nikon Corporation | Position control apparatus for fine stages carried by a coarse stage on a high-precision scanning positioning system |
AU2747999A (en) | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
KR100604120B1 (ko) | 1998-05-19 | 2006-07-24 | 가부시키가이샤 니콘 | 수차측정장치와 측정방법 및 이 장치를 구비한투영노광장치와 이 방법을 이용한 디바이스 제조방법,노광방법 |
JP2000058436A (ja) | 1998-08-11 | 2000-02-25 | Nikon Corp | 投影露光装置及び露光方法 |
JP2000068192A (ja) | 1998-08-18 | 2000-03-03 | Nikon Corp | 露光装置、露光方法及び位置検出方法 |
US6144118A (en) * | 1998-09-18 | 2000-11-07 | General Scanning, Inc. | High-speed precision positioning apparatus |
EP1014199B1 (en) | 1998-12-24 | 2011-03-30 | Canon Kabushiki Kaisha | Stage control apparatus, exposure apparatus and method of manufacturing a semiconductor device |
US6924884B2 (en) * | 1999-03-08 | 2005-08-02 | Asml Netherlands B.V. | Off-axis leveling in lithographic projection apparatus |
TW490596B (en) * | 1999-03-08 | 2002-06-11 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus |
US6381004B1 (en) | 1999-09-29 | 2002-04-30 | Nikon Corporation | Exposure apparatus and device manufacturing method |
WO2001035168A1 (en) | 1999-11-10 | 2001-05-17 | Massachusetts Institute Of Technology | Interference lithography utilizing phase-locked scanning beams |
JP4428781B2 (ja) | 1999-12-28 | 2010-03-10 | キヤノン株式会社 | 光学式ロータリエンコーダ及びモータ制御装置 |
WO2001052004A1 (en) * | 2000-01-11 | 2001-07-19 | Electro Scientific Industries, Inc. | Abbe error correction system and method |
JP2001308003A (ja) * | 2000-02-15 | 2001-11-02 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
SG124257A1 (en) | 2000-02-25 | 2006-08-30 | Nikon Corp | Exposure apparatus and exposure method capable of controlling illumination distribution |
JP2001313250A (ja) | 2000-02-25 | 2001-11-09 | Nikon Corp | 露光装置、その調整方法、及び前記露光装置を用いるデバイス製造方法 |
JP2001332490A (ja) * | 2000-03-14 | 2001-11-30 | Nikon Corp | 位置合わせ方法、露光方法、露光装置、及びデバイス製造方法 |
US6639686B1 (en) * | 2000-04-13 | 2003-10-28 | Nanowave, Inc. | Method of and apparatus for real-time continual nanometer scale position measurement by beam probing as by laser beams and the like of atomic and other undulating surfaces such as gratings or the like relatively moving with respect to the probing beams |
JP2002014005A (ja) | 2000-04-25 | 2002-01-18 | Nikon Corp | 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置 |
US20020041377A1 (en) | 2000-04-25 | 2002-04-11 | Nikon Corporation | Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method |
JP2002090114A (ja) | 2000-07-10 | 2002-03-27 | Mitsutoyo Corp | 光スポット位置センサ及び変位測定装置 |
TW527526B (en) * | 2000-08-24 | 2003-04-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7289212B2 (en) | 2000-08-24 | 2007-10-30 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufacturing thereby |
US7561270B2 (en) * | 2000-08-24 | 2009-07-14 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
JP2002164269A (ja) * | 2000-11-27 | 2002-06-07 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
KR100815222B1 (ko) | 2001-02-27 | 2008-03-19 | 에이에스엠엘 유에스, 인크. | 리소그래피 장치 및 적어도 하나의 레티클 상에 형성된 적어도 두 개의 패턴으로부터의 이미지로 기판 스테이지 상의 필드를 노출시키는 방법 |
US7515719B2 (en) | 2001-03-27 | 2009-04-07 | Cambridge Mechatronics Limited | Method and apparatus to create a sound field |
JP4198338B2 (ja) * | 2001-07-09 | 2008-12-17 | 株式会社 東北テクノアーチ | ステージ装置 |
JP2003031474A (ja) * | 2001-07-16 | 2003-01-31 | Oki Electric Ind Co Ltd | 露光装置および露光方法 |
TW529172B (en) | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
JP2003249443A (ja) | 2001-12-21 | 2003-09-05 | Nikon Corp | ステージ装置、ステージ位置管理方法、露光方法及び露光装置、並びにデバイス製造方法 |
KR100927560B1 (ko) * | 2002-01-29 | 2009-11-23 | 가부시키가이샤 니콘 | 이미지 형성 상태 조정 시스템, 노광 방법 및 노광 장치, 그리고 프로그램 및 정보 기록 매체 |
US6987555B2 (en) * | 2002-04-23 | 2006-01-17 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
JP4168665B2 (ja) | 2002-05-22 | 2008-10-22 | 株式会社ニコン | 露光方法及び露光装置、デバイス製造方法 |
KR20050025626A (ko) * | 2002-07-31 | 2005-03-14 | 가부시키가이샤 니콘 | 위치계측방법, 위치제어방법, 노광방법 및 노광장치,그리고 디바이스 제조방법 |
CN100462844C (zh) | 2002-08-23 | 2009-02-18 | 株式会社尼康 | 投影光学系统、微影方法、曝光装置及使用此装置的方法 |
JP2004101362A (ja) | 2002-09-10 | 2004-04-02 | Canon Inc | ステージ位置計測および位置決め装置 |
DE60335595D1 (de) | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung |
EP1420298B1 (en) | 2002-11-12 | 2013-02-20 | ASML Netherlands B.V. | Lithographic apparatus |
CN101382738B (zh) * | 2002-11-12 | 2011-01-12 | Asml荷兰有限公司 | 光刻投射装置 |
KR20130010039A (ko) | 2002-12-10 | 2013-01-24 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
EP1450176A1 (en) | 2003-02-21 | 2004-08-25 | Liaisons Electroniques-Mecaniques Lem S.A. | Magnetic field sensor and electrical current sensor therewith |
JP4362862B2 (ja) * | 2003-04-01 | 2009-11-11 | 株式会社ニコン | ステージ装置及び露光装置 |
KR101431938B1 (ko) | 2003-04-10 | 2014-08-19 | 가부시키가이샤 니콘 | 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템 |
KR101516141B1 (ko) | 2003-05-06 | 2015-05-04 | 가부시키가이샤 니콘 | 투영 광학계, 노광 장치 및 노광 방법 |
JP4292573B2 (ja) * | 2003-05-13 | 2009-07-08 | 株式会社ニコン | ステージ装置及び露光装置 |
US7025498B2 (en) * | 2003-05-30 | 2006-04-11 | Asml Holding N.V. | System and method of measuring thermal expansion |
TWI482200B (zh) * | 2003-06-19 | 2015-04-21 | 尼康股份有限公司 | An exposure apparatus, an exposure method, and an element manufacturing method |
JP4492239B2 (ja) | 2003-07-28 | 2010-06-30 | 株式会社ニコン | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
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TWI295408B (en) * | 2003-10-22 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method, and measurement system |
US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
US7102729B2 (en) * | 2004-02-03 | 2006-09-05 | Asml Netherlands B.V. | Lithographic apparatus, measurement system, and device manufacturing method |
JP2005252246A (ja) | 2004-02-04 | 2005-09-15 | Nikon Corp | 露光装置及び方法、位置制御方法、並びにデバイス製造方法 |
TW200537255A (en) | 2004-02-04 | 2005-11-16 | Nikon Corp | Exposure equipment and method, position control method and device manufacturing method |
JP2005236087A (ja) | 2004-02-20 | 2005-09-02 | Nikon Corp | 露光装置 |
JP4429037B2 (ja) | 2004-02-27 | 2010-03-10 | キヤノン株式会社 | ステージ装置及びその制御方法 |
JP2005249452A (ja) | 2004-03-02 | 2005-09-15 | Konica Minolta Medical & Graphic Inc | リニアエンコーダ、画像読取装置及び画像記録装置 |
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JP2005268608A (ja) * | 2004-03-19 | 2005-09-29 | Sumitomo Heavy Ind Ltd | ステージ装置 |
US7898642B2 (en) | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4751032B2 (ja) | 2004-04-22 | 2011-08-17 | 株式会社森精機製作所 | 変位検出装置 |
US20050241694A1 (en) | 2004-04-29 | 2005-11-03 | Red Flame Hot Tap Services Ltd. | Hot tapping method, system and apparatus |
US7126109B2 (en) * | 2004-06-14 | 2006-10-24 | Gsi Group Corporation | Encoder scale error compensation employing comparison among multiple detectors |
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US7256871B2 (en) * | 2004-07-27 | 2007-08-14 | Asml Netherlands B.V. | Lithographic apparatus and method for calibrating the same |
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SG188914A1 (en) | 2004-09-17 | 2013-04-30 | Nikon Corp | Exposure apparatus, exposure method, and method for manufacturing device |
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JP4424739B2 (ja) | 2004-10-19 | 2010-03-03 | キヤノン株式会社 | ステージ装置 |
US7388663B2 (en) * | 2004-10-28 | 2008-06-17 | Asml Netherlands B.V. | Optical position assessment apparatus and method |
TWI649790B (zh) * | 2004-11-18 | 2019-02-01 | 日商尼康股份有限公司 | 位置測量方法、位置控制方法、測量方法、裝載方法、曝光方法及曝光裝置、及元件製造方法 |
KR101261063B1 (ko) | 2004-11-25 | 2013-05-06 | 가부시키가이샤 니콘 | 이동체 시스템, 노광 장치 및 디바이스 제조 방법 |
JP2006165216A (ja) * | 2004-12-07 | 2006-06-22 | Nikon Corp | 評価方法、走査露光方法及び走査型露光装置 |
US7528931B2 (en) * | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20060139595A1 (en) * | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness |
JP2006196555A (ja) * | 2005-01-11 | 2006-07-27 | Nikon Corp | 収差計測方法及び装置、並びに露光方法及び装置 |
JP4450739B2 (ja) * | 2005-01-21 | 2010-04-14 | 富士フイルム株式会社 | 露光装置 |
JP2006210570A (ja) | 2005-01-27 | 2006-08-10 | Nikon Corp | 調整方法、露光装置 |
US7515281B2 (en) * | 2005-04-08 | 2009-04-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7161659B2 (en) * | 2005-04-08 | 2007-01-09 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7405811B2 (en) * | 2005-04-20 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
US7349069B2 (en) * | 2005-04-20 | 2008-03-25 | Asml Netherlands B.V. | Lithographic apparatus and positioning apparatus |
US7348574B2 (en) | 2005-09-02 | 2008-03-25 | Asml Netherlands, B.V. | Position measurement system and lithographic apparatus |
US7362446B2 (en) | 2005-09-15 | 2008-04-22 | Asml Netherlands B.V. | Position measurement unit, measurement system and lithographic apparatus comprising such position measurement unit |
JP2007093546A (ja) | 2005-09-30 | 2007-04-12 | Nikon Corp | エンコーダシステム、ステージ装置及び露光装置 |
US7978339B2 (en) | 2005-10-04 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus temperature compensation |
EP2857902B1 (en) * | 2006-01-19 | 2016-04-20 | Nikon Corporation | Immersion exposure apparatus, immersion exposure method, and device fabricating method |
CN101385121B (zh) * | 2006-02-21 | 2011-04-20 | 株式会社尼康 | 图案形成装置及图案形成方法、移动体驱动系统及移动体驱动方法、曝光装置及曝光方法、以及组件制造方法 |
WO2007097379A1 (ja) | 2006-02-21 | 2007-08-30 | Nikon Corporation | パターン形成装置、マーク検出装置、露光装置、パターン形成方法、露光方法及びデバイス製造方法 |
CN102866591B (zh) | 2006-02-21 | 2015-08-19 | 株式会社尼康 | 曝光装置及方法、以及元件制造方法 |
US7602489B2 (en) | 2006-02-22 | 2009-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7253875B1 (en) | 2006-03-03 | 2007-08-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7636165B2 (en) * | 2006-03-21 | 2009-12-22 | Asml Netherlands B.V. | Displacement measurement systems lithographic apparatus and device manufacturing method |
JP4265805B2 (ja) | 2006-03-29 | 2009-05-20 | シャープ株式会社 | 画像処理システム |
US7576832B2 (en) * | 2006-05-04 | 2009-08-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7483120B2 (en) | 2006-05-09 | 2009-01-27 | Asml Netherlands B.V. | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
JP4393540B2 (ja) | 2006-08-01 | 2010-01-06 | シャープ株式会社 | 樹脂含有粒子の凝集体の製造方法、トナー、現像剤、現像装置および画像形成装置 |
SG10201407395SA (en) | 2006-08-31 | 2014-12-30 | Nikon Corp | Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method |
KR101634893B1 (ko) * | 2006-08-31 | 2016-06-29 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
KR101477465B1 (ko) | 2006-08-31 | 2014-12-29 | 가부시키가이샤 니콘 | 이동체 구동 시스템 및 이동체 구동 방법, 패턴 형성 장치 및 방법, 노광 장치 및 방법, 디바이스 제조 방법, 그리고 결정 방법 |
TW201610608A (zh) * | 2006-09-01 | 2016-03-16 | 尼康股份有限公司 | 移動體驅動方法及移動體驅動系統、圖案形成方法及裝置、曝光方法及裝置、以及元件製造方法 |
KR101660667B1 (ko) * | 2006-09-01 | 2016-09-27 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법 |
US7619207B2 (en) * | 2006-11-08 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7903866B2 (en) * | 2007-03-29 | 2011-03-08 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object |
US7710540B2 (en) * | 2007-04-05 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8547527B2 (en) | 2007-07-24 | 2013-10-01 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method |
TW201907243A (zh) * | 2007-12-28 | 2019-02-16 | 日商尼康股份有限公司 | 曝光裝置、曝光方法、以及元件製造方法 |
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