HK1153543A1 - 可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法 - Google Patents
可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法Info
- Publication number
- HK1153543A1 HK1153543A1 HK11107667.4A HK11107667A HK1153543A1 HK 1153543 A1 HK1153543 A1 HK 1153543A1 HK 11107667 A HK11107667 A HK 11107667A HK 1153543 A1 HK1153543 A1 HK 1153543A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- movable body
- pattern formation
- exposure
- device manufacturing
- body drive
- Prior art date
Links
- 238000000034 method Methods 0.000 title 3
- 230000007261 regionalization Effects 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7169508P | 2008-05-13 | 2008-05-13 | |
US12/463,562 US8817236B2 (en) | 2008-05-13 | 2009-05-11 | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
PCT/JP2009/059239 WO2009139498A1 (en) | 2008-05-13 | 2009-05-13 | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1153543A1 true HK1153543A1 (zh) | 2012-03-30 |
Family
ID=41315841
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11107667.4A HK1153543A1 (zh) | 2008-05-13 | 2011-07-25 | 可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法 |
HK13108237.1A HK1181124A1 (zh) | 2008-05-13 | 2013-07-15 | 曝光設備、曝光方法以及器件製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13108237.1A HK1181124A1 (zh) | 2008-05-13 | 2013-07-15 | 曝光設備、曝光方法以及器件製造方法 |
Country Status (9)
Country | Link |
---|---|
US (2) | US8817236B2 (zh) |
EP (2) | EP2294484B1 (zh) |
JP (3) | JP5531451B2 (zh) |
KR (2) | KR101511922B1 (zh) |
CN (2) | CN102027417B (zh) |
HK (2) | HK1153543A1 (zh) |
SG (1) | SG174099A1 (zh) |
TW (2) | TWI454852B (zh) |
WO (1) | WO2009139498A1 (zh) |
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TWI622084B (zh) | 2006-09-01 | 2018-04-21 | Nikon Corp | Mobile body driving method, moving body driving system, pattern forming method and device, exposure method and device, component manufacturing method, and correction method |
US7619207B2 (en) | 2006-11-08 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7903866B2 (en) | 2007-03-29 | 2011-03-08 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object |
US7710540B2 (en) * | 2007-04-05 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8098362B2 (en) | 2007-05-30 | 2012-01-17 | Nikon Corporation | Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method |
US8237916B2 (en) | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
JP4528338B2 (ja) * | 2008-03-04 | 2010-08-18 | キヤノン株式会社 | 制振装置、露光装置及びデバイス製造方法 |
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- 2009-05-13 JP JP2009116048A patent/JP5531451B2/ja active Active
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- 2009-05-13 SG SG2011061413A patent/SG174099A1/en unknown
- 2009-05-13 TW TW098115769A patent/TWI454852B/zh active
- 2009-05-13 CN CN201210487739.0A patent/CN102944982B/zh active Active
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CN102944982B (zh) | 2015-06-10 |
TWI548953B (zh) | 2016-09-11 |
JP5531451B2 (ja) | 2014-06-25 |
JP2015084449A (ja) | 2015-04-30 |
US20140327899A1 (en) | 2014-11-06 |
KR101511922B1 (ko) | 2015-04-13 |
SG174099A1 (en) | 2011-09-29 |
JP5979254B2 (ja) | 2016-08-24 |
JP2009278096A (ja) | 2009-11-26 |
KR20110020805A (ko) | 2011-03-03 |
CN102027417B (zh) | 2013-02-13 |
CN102027417A (zh) | 2011-04-20 |
EP2711775A3 (en) | 2017-05-17 |
EP2294484B1 (en) | 2014-06-11 |
KR101422894B1 (ko) | 2014-07-23 |
JP2014017501A (ja) | 2014-01-30 |
HK1181124A1 (zh) | 2013-11-01 |
US8817236B2 (en) | 2014-08-26 |
EP2294484A1 (en) | 2011-03-16 |
TW201433886A (zh) | 2014-09-01 |
TW201001095A (en) | 2010-01-01 |
KR20140015632A (ko) | 2014-02-06 |
JP5679132B2 (ja) | 2015-03-04 |
CN102944982A (zh) | 2013-02-27 |
US20090284724A1 (en) | 2009-11-19 |
US9436102B2 (en) | 2016-09-06 |
EP2711775A2 (en) | 2014-03-26 |
TWI454852B (zh) | 2014-10-01 |
WO2009139498A1 (en) | 2009-11-19 |
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