HK1153543A1 - 可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法 - Google Patents

可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法

Info

Publication number
HK1153543A1
HK1153543A1 HK11107667.4A HK11107667A HK1153543A1 HK 1153543 A1 HK1153543 A1 HK 1153543A1 HK 11107667 A HK11107667 A HK 11107667A HK 1153543 A1 HK1153543 A1 HK 1153543A1
Authority
HK
Hong Kong
Prior art keywords
movable body
pattern formation
exposure
device manufacturing
body drive
Prior art date
Application number
HK11107667.4A
Other languages
English (en)
Inventor
Yuho Kanaya
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1153543A1 publication Critical patent/HK1153543A1/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK11107667.4A 2008-05-13 2011-07-25 可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法 HK1153543A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7169508P 2008-05-13 2008-05-13
US12/463,562 US8817236B2 (en) 2008-05-13 2009-05-11 Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method
PCT/JP2009/059239 WO2009139498A1 (en) 2008-05-13 2009-05-13 Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1153543A1 true HK1153543A1 (zh) 2012-03-30

Family

ID=41315841

Family Applications (2)

Application Number Title Priority Date Filing Date
HK11107667.4A HK1153543A1 (zh) 2008-05-13 2011-07-25 可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法
HK13108237.1A HK1181124A1 (zh) 2008-05-13 2013-07-15 曝光設備、曝光方法以及器件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK13108237.1A HK1181124A1 (zh) 2008-05-13 2013-07-15 曝光設備、曝光方法以及器件製造方法

Country Status (9)

Country Link
US (2) US8817236B2 (zh)
EP (2) EP2294484B1 (zh)
JP (3) JP5531451B2 (zh)
KR (2) KR101511922B1 (zh)
CN (2) CN102027417B (zh)
HK (2) HK1153543A1 (zh)
SG (1) SG174099A1 (zh)
TW (2) TWI454852B (zh)
WO (1) WO2009139498A1 (zh)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101670624B1 (ko) * 2008-04-30 2016-11-09 가부시키가이샤 니콘 스테이지 장치, 패턴 형성 장치, 노광 장치, 스테이지 구동 방법, 노광 방법, 그리고 디바이스 제조 방법
US8599359B2 (en) 2008-12-19 2013-12-03 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, and carrier method
US8760629B2 (en) 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8902402B2 (en) 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8773635B2 (en) * 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8553204B2 (en) * 2009-05-20 2013-10-08 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8970820B2 (en) 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
US8792084B2 (en) * 2009-05-20 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
NL2004834A (en) * 2009-07-08 2011-01-10 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US8488109B2 (en) 2009-08-25 2013-07-16 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8493547B2 (en) 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20110096318A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110096306A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
US20110096312A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110102761A1 (en) * 2009-09-28 2011-05-05 Nikon Corporation Stage apparatus, exposure apparatus, and device fabricating method
US20110128523A1 (en) * 2009-11-19 2011-06-02 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
US20110123913A1 (en) * 2009-11-19 2011-05-26 Nikon Corporation Exposure apparatus, exposing method, and device fabricating method
US8488106B2 (en) * 2009-12-28 2013-07-16 Nikon Corporation Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
DE102012216286A1 (de) 2011-09-30 2013-04-04 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage mit optimiertem Messsystem
JP6156147B2 (ja) 2011-11-17 2017-07-05 株式会社ニコン エンコーダ装置、光学装置、露光装置、及びデバイス製造方法
US9207549B2 (en) 2011-12-29 2015-12-08 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
JP6039917B2 (ja) * 2012-05-22 2016-12-07 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
CN102951607B (zh) * 2012-12-20 2013-11-13 北京理工大学 磁悬浮式定位平台
US20160336101A1 (en) * 2013-09-04 2016-11-17 Ckd Corporation Armature coil for electromagnetic actuator, electromagnetic actuator, exposure apparatus, and device manufacturing method
KR102299921B1 (ko) 2014-10-07 2021-09-09 삼성전자주식회사 광학 장치
JP6468792B2 (ja) 2014-10-21 2019-02-13 日本コントロールシステム株式会社 パターン補正量算出装置、パターン補正量算出方法、およびプログラム
JP6344297B2 (ja) 2015-04-16 2018-06-20 株式会社デンソー 撮像装置およびそれに用いられるプリント基板
JP2017111031A (ja) 2015-12-17 2017-06-22 株式会社ニューフレアテクノロジー パターン検査装置及びパターン検査方法
NL2018639A (en) * 2016-04-26 2017-11-01 Asml Netherlands Bv Measurement system, calibration method, lithographic apparatus and positioner
CN110716391A (zh) * 2018-07-11 2020-01-21 上海微电子装备(集团)股份有限公司 大尺寸基板曝光机
WO2020055540A1 (en) * 2018-09-12 2020-03-19 Cymer, Llc Metrology for a body of a gas discharge stage
CN114152193B (zh) * 2020-09-07 2023-02-21 上海微电子装备(集团)股份有限公司 运动台光栅测量系统和光刻机

Family Cites Families (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880617A (en) * 1981-03-23 1989-11-14 Dow Corning Corporation Lattice-entrapped composition
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
US5196745A (en) 1991-08-16 1993-03-23 Massachusetts Institute Of Technology Magnetic positioning device
KR100300618B1 (ko) 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JPH07270122A (ja) 1994-03-30 1995-10-20 Canon Inc 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法
KR970076451A (ko) * 1996-05-13 1997-12-12 가나이 츠토무 디스플레이장치 및 표시방법
SG88824A1 (en) 1996-11-28 2002-05-21 Nikon Corp Projection exposure method
US6151100A (en) * 1996-12-12 2000-11-21 Canon Kabushiki Kaisha Positioning system
EP0890136B9 (en) 1996-12-24 2003-12-10 ASML Netherlands B.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
KR100841147B1 (ko) 1998-03-11 2008-06-24 가부시키가이샤 니콘 레이저 장치, 자외광 조사 장치 및 방법, 물체의 패턴 검출장치 및 방법
US6008610A (en) * 1998-03-20 1999-12-28 Nikon Corporation Position control apparatus for fine stages carried by a coarse stage on a high-precision scanning positioning system
TW490596B (en) * 1999-03-08 2002-06-11 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
US6144119A (en) * 1999-06-18 2000-11-07 Nikon Corporation Planar electric motor with dual coil and magnet arrays
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
TW546699B (en) 2000-02-25 2003-08-11 Nikon Corp Exposure apparatus and exposure method capable of controlling illumination distribution
DE10011130A1 (de) 2000-03-10 2001-09-13 Mannesmann Vdo Ag Entlüftungseinrichtung für einen Kraftstoffbehälter
US7289212B2 (en) 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
TW527526B (en) 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7561270B2 (en) 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US20020109823A1 (en) * 2001-02-09 2002-08-15 Nikon Corporation. Wafer stage assembly
JP4714403B2 (ja) 2001-02-27 2011-06-29 エーエスエムエル ユーエス,インコーポレイテッド デュアルレチクルイメージを露光する方法および装置
US6788385B2 (en) * 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
JP2003028673A (ja) 2001-07-10 2003-01-29 Canon Inc 光学式エンコーダ、半導体製造装置、デバイス製造方法、半導体製造工場および半導体製造装置の保守方法
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US6881963B2 (en) * 2002-11-08 2005-04-19 Canon Kabushiki Kaisha Vibration control of an object
JP4362867B2 (ja) 2002-12-10 2009-11-11 株式会社ニコン 露光装置及びデバイス製造方法
US7025498B2 (en) 2003-05-30 2006-04-11 Asml Holding N.V. System and method of measuring thermal expansion
US20050074014A1 (en) 2003-10-01 2005-04-07 Rao Chunghwa Heman Network brokering system
TWI295408B (en) 2003-10-22 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method, and measurement system
US20070164234A1 (en) * 2004-01-15 2007-07-19 Nikon Corporation Exposure apparatus and device manufacturing method
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US7102729B2 (en) 2004-02-03 2006-09-05 Asml Netherlands B.V. Lithographic apparatus, measurement system, and device manufacturing method
JP4751032B2 (ja) 2004-04-22 2011-08-17 株式会社森精機製作所 変位検出装置
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7256871B2 (en) 2004-07-27 2007-08-14 Asml Netherlands B.V. Lithographic apparatus and method for calibrating the same
EP1794650A4 (en) 2004-09-30 2008-09-10 Nikon Corp OPTICAL PROJECTION DEVICE AND EXPOSURE DEVICE
US20060139595A1 (en) 2004-12-27 2006-06-29 Asml Netherlands B.V. Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness
US7515281B2 (en) * 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161659B2 (en) 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7405811B2 (en) 2005-04-20 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and positioning apparatus
US7349069B2 (en) 2005-04-20 2008-03-25 Asml Netherlands B.V. Lithographic apparatus and positioning apparatus
JP2006349945A (ja) * 2005-06-15 2006-12-28 Fujifilm Holdings Corp 露光装置
WO2006137440A1 (ja) * 2005-06-22 2006-12-28 Nikon Corporation 計測装置及び露光装置、並びにデバイス製造方法
US7348574B2 (en) * 2005-09-02 2008-03-25 Asml Netherlands, B.V. Position measurement system and lithographic apparatus
US7362446B2 (en) 2005-09-15 2008-04-22 Asml Netherlands B.V. Position measurement unit, measurement system and lithographic apparatus comprising such position measurement unit
US7978339B2 (en) 2005-10-04 2011-07-12 Asml Netherlands B.V. Lithographic apparatus temperature compensation
GB2431251A (en) 2005-10-11 2007-04-18 Hewlett Packard Development Co Data transfer device
KR20180091963A (ko) * 2006-01-19 2018-08-16 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 패턴 형성 장치, 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
WO2007097466A1 (ja) * 2006-02-21 2007-08-30 Nikon Corporation 測定装置及び方法、処理装置及び方法、パターン形成装置及び方法、露光装置及び方法、並びにデバイス製造方法
JP5115859B2 (ja) 2006-02-21 2013-01-09 株式会社ニコン パターン形成装置、露光装置及び露光方法、並びにデバイス製造方法
KR101356270B1 (ko) 2006-02-21 2014-01-28 가부시키가이샤 니콘 패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법
US7602489B2 (en) 2006-02-22 2009-10-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7253875B1 (en) 2006-03-03 2007-08-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7636165B2 (en) 2006-03-21 2009-12-22 Asml Netherlands B.V. Displacement measurement systems lithographic apparatus and device manufacturing method
TWI454859B (zh) * 2006-03-30 2014-10-01 尼康股份有限公司 移動體裝置、曝光裝置與曝光方法以及元件製造方法
US7483120B2 (en) 2006-05-09 2009-01-27 Asml Netherlands B.V. Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
TWI602032B (zh) 2006-08-31 2017-10-11 Nippon Kogaku Kk Exposure apparatus, exposure method, and device manufacturing method
KR101423017B1 (ko) * 2006-08-31 2014-07-28 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
TWI547771B (zh) 2006-08-31 2016-09-01 尼康股份有限公司 Mobile body drive system and moving body driving method, pattern forming apparatus and method, exposure apparatus and method, component manufacturing method, and method of determining
TW201809913A (zh) 2006-09-01 2018-03-16 日商尼康股份有限公司 曝光裝置、曝光方法、以及元件製造方法
TWI622084B (zh) 2006-09-01 2018-04-21 Nikon Corp Mobile body driving method, moving body driving system, pattern forming method and device, exposure method and device, component manufacturing method, and correction method
US7619207B2 (en) 2006-11-08 2009-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7903866B2 (en) 2007-03-29 2011-03-08 Asml Netherlands B.V. Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object
US7710540B2 (en) * 2007-04-05 2010-05-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8098362B2 (en) 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
US8237916B2 (en) 2007-12-28 2012-08-07 Nikon Corporation Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method
JP4528338B2 (ja) * 2008-03-04 2010-08-18 キヤノン株式会社 制振装置、露光装置及びデバイス製造方法

Also Published As

Publication number Publication date
CN102944982B (zh) 2015-06-10
TWI548953B (zh) 2016-09-11
JP5531451B2 (ja) 2014-06-25
JP2015084449A (ja) 2015-04-30
US20140327899A1 (en) 2014-11-06
KR101511922B1 (ko) 2015-04-13
SG174099A1 (en) 2011-09-29
JP5979254B2 (ja) 2016-08-24
JP2009278096A (ja) 2009-11-26
KR20110020805A (ko) 2011-03-03
CN102027417B (zh) 2013-02-13
CN102027417A (zh) 2011-04-20
EP2711775A3 (en) 2017-05-17
EP2294484B1 (en) 2014-06-11
KR101422894B1 (ko) 2014-07-23
JP2014017501A (ja) 2014-01-30
HK1181124A1 (zh) 2013-11-01
US8817236B2 (en) 2014-08-26
EP2294484A1 (en) 2011-03-16
TW201433886A (zh) 2014-09-01
TW201001095A (en) 2010-01-01
KR20140015632A (ko) 2014-02-06
JP5679132B2 (ja) 2015-03-04
CN102944982A (zh) 2013-02-27
US20090284724A1 (en) 2009-11-19
US9436102B2 (en) 2016-09-06
EP2711775A2 (en) 2014-03-26
TWI454852B (zh) 2014-10-01
WO2009139498A1 (en) 2009-11-19

Similar Documents

Publication Publication Date Title
HK1244891A1 (zh) 移動體驅動方法和移動體驅動系統、圖案形成方法和裝置、曝光方法和裝置、以及設備製造方法
HK1153543A1 (zh) 可移動體系統、可移動體驅動方法、圖案形成設備、圖案形成方法、曝光設備、曝光方法以及器件製造方法
HK1218187A1 (zh) 可移動體驅動方法和可移動體驅動系統、模式形成方法和裝置、曝光方法和裝置以及設備製造方法
HK1218168A1 (zh) 移動體驅動方法及移動體驅動系統、圖案形成方法及裝置、曝光方法及裝置、以及組件製造方法
HK1204089A1 (zh) 移動體驅動系統及方法、圖案形成裝置及方法、曝光裝置及方法、組件製造方法
HK1218167A1 (zh) 移動體驅動方法及移動體驅動系統、圖案形成方法及設備、曝光方法及設備、裝置製造方法以及校正方法
SG10201510758QA (en) Movable Body Drive Method, Movable Body Drive System, Pattern Formation Method, Pattern Forming Apparatus, Exposure Method, Exposure Apparatus, and Device Manufacturing Method
HK1222716A1 (zh) 曝光裝置、曝光方法、及元件製造方法
HK1169716A1 (zh) 曝光裝置、移動體驅動系統、圖案形成裝置、以及曝光方法
HK1215734A1 (zh) 曝光方法及曝光裝置、以及元件製造方法
EP2184768A4 (en) MOBILE OBJECT TRAINING METHOD AND SYSTEM, PATTERN FORMATION METHOD AND APPARATUS, EXPOSURE METHOD AND APPARATUS, AND COMPONENT MANUFACTURING METHOD
HK1206436A1 (zh) 曝光裝置、曝光方法、以及組件製造方法
EP2003680A4 (en) STRUCTURE TRAINING DEVICE, STRUCTURE FORMING METHOD, MOBILE OBJECT DRIVE SYSTEM, MOBILE BODY DRIVE PROCESS, EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
HK1136878A1 (en) Exposure apparatus, exposure method, and device manufacturing method
IL207506A0 (en) Metrology method and apparatus, lithographic apparatus, and device manufacturing method
HK1155821A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1150888A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1137077A1 (en) Exposure apparatus, exposure method and device manufacturing method
HK1136912A1 (en) Moving body driving method and apparatus, exposure method and apparatus, pattern forming method and apparatus, and device manufacturing method
IL220021A0 (en) Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
HK1169492A1 (zh) 曝光設備、曝光方法及器件製造方法
HK1182184A1 (zh) 曝光方法及裝置、以及元件製造方法

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230511