HK1182184A1 - 曝光方法及裝置、以及元件製造方法 - Google Patents
曝光方法及裝置、以及元件製造方法Info
- Publication number
- HK1182184A1 HK1182184A1 HK13107916.1A HK13107916A HK1182184A1 HK 1182184 A1 HK1182184 A1 HK 1182184A1 HK 13107916 A HK13107916 A HK 13107916A HK 1182184 A1 HK1182184 A1 HK 1182184A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- producing device
- exposure apparatus
- producing
- exposure method
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0277—Electrolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US833607P | 2007-12-20 | 2007-12-20 | |
US12/261,741 US8917378B2 (en) | 2007-12-20 | 2008-10-30 | Exposure method, exposure apparatus, and method for producing device with plurality of projection optical systems and pattern having first partial pattern area and second partial area having overlaid area with first partial pattern area |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1182184A1 true HK1182184A1 (zh) | 2013-11-22 |
Family
ID=40339663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13107916.1A HK1182184A1 (zh) | 2007-12-20 | 2013-07-08 | 曝光方法及裝置、以及元件製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8917378B2 (zh) |
EP (1) | EP2238514A1 (zh) |
JP (1) | JP5412814B2 (zh) |
KR (1) | KR101605567B1 (zh) |
CN (2) | CN102890431B (zh) |
HK (1) | HK1182184A1 (zh) |
TW (1) | TWI440990B (zh) |
WO (1) | WO2009081676A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253923B1 (en) * | 2008-09-23 | 2012-08-28 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
CN102419334A (zh) * | 2011-09-13 | 2012-04-18 | 浙江中控太阳能技术有限公司 | 一种能同时检测平面镜平整度和清洁度的装置及方法 |
CN103869602A (zh) * | 2012-12-14 | 2014-06-18 | 京东方科技集团股份有限公司 | 一种掩膜板及其实现曝光接合的方法 |
CN103969958B (zh) * | 2013-01-25 | 2016-03-30 | 上海微电子装备有限公司 | 一种多曝光视场拼接系统和方法 |
JP5344105B1 (ja) | 2013-03-08 | 2013-11-20 | ウシオ電機株式会社 | 光配向用偏光光照射装置及び光配向用偏光光照射方法 |
US9229332B2 (en) | 2013-09-18 | 2016-01-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Systems and methods for high-throughput and small-footprint scanning exposure for lithography |
CN104749902B (zh) * | 2013-12-31 | 2017-02-15 | 上海微电子装备有限公司 | 掩模板面型整形装置 |
JP5773095B1 (ja) * | 2015-02-10 | 2015-09-02 | ウシオ電機株式会社 | 光照射装置および光照射方法 |
CN106802538B (zh) * | 2017-03-16 | 2019-01-29 | 无锡影速半导体科技有限公司 | 超大板直写式光刻机扫描曝光方法 |
US10474027B2 (en) | 2017-11-13 | 2019-11-12 | Macronix International Co., Ltd. | Method for forming an aligned mask |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5729331A (en) * | 1993-06-30 | 1998-03-17 | Nikon Corporation | Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus |
JP3505813B2 (ja) * | 1994-11-01 | 2004-03-15 | 株式会社ニコン | 走査型露光装置及び走査露光方法 |
DE19757074A1 (de) | 1997-12-20 | 1999-06-24 | Zeiss Carl Fa | Projektionsbelichtungsanlage und Belichtungsverfahren |
JP2000331909A (ja) * | 1999-05-19 | 2000-11-30 | Nikon Corp | 走査型露光装置 |
JP4362999B2 (ja) * | 2001-11-12 | 2009-11-11 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
TW200307184A (en) * | 2002-05-23 | 2003-12-01 | Sanei Giken Co Ltd | Scan exposure method and scan exposure apparatus |
JP2004335864A (ja) * | 2003-05-09 | 2004-11-25 | Nikon Corp | 露光装置及び露光方法 |
JP4984810B2 (ja) | 2006-02-16 | 2012-07-25 | 株式会社ニコン | 露光方法、露光装置及びフォトマスク |
CN101385123B (zh) * | 2006-02-16 | 2010-12-15 | 株式会社尼康 | 投影光学系统、曝光装置及方法、光罩及显示器的制造方法 |
JP4952182B2 (ja) * | 2006-03-20 | 2012-06-13 | 株式会社ニコン | 走査型露光装置、マイクロデバイスの製造方法、走査露光方法、及びマスク |
-
2008
- 2008-10-30 US US12/261,741 patent/US8917378B2/en not_active Expired - Fee Related
- 2008-11-17 CN CN201210359535.9A patent/CN102890431B/zh active Active
- 2008-11-17 WO PCT/JP2008/071188 patent/WO2009081676A1/en active Application Filing
- 2008-11-17 CN CN2008801115965A patent/CN101918897B/zh active Active
- 2008-11-17 KR KR1020107008137A patent/KR101605567B1/ko active IP Right Grant
- 2008-11-17 EP EP08865814A patent/EP2238514A1/en not_active Withdrawn
- 2008-12-03 JP JP2008309172A patent/JP5412814B2/ja active Active
- 2008-12-19 TW TW097149567A patent/TWI440990B/zh active
-
2013
- 2013-07-08 HK HK13107916.1A patent/HK1182184A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI440990B (zh) | 2014-06-11 |
WO2009081676A1 (en) | 2009-07-02 |
EP2238514A1 (en) | 2010-10-13 |
KR101605567B1 (ko) | 2016-03-22 |
US20090257033A1 (en) | 2009-10-15 |
CN102890431B (zh) | 2015-09-09 |
US8917378B2 (en) | 2014-12-23 |
TW200942978A (en) | 2009-10-16 |
CN101918897A (zh) | 2010-12-15 |
KR20100094451A (ko) | 2010-08-26 |
CN102890431A (zh) | 2013-01-23 |
CN101918897B (zh) | 2012-11-14 |
JP2009151298A (ja) | 2009-07-09 |
JP5412814B2 (ja) | 2014-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1259005A1 (zh) | 曝光設備、曝光方法以及裝置製造方法 | |
HK1249936B (zh) | 曝光裝置、曝光方法和器件製造方法 | |
HK1244893A1 (zh) | 曝光裝置和方法以及設備製造方法 | |
HK1243498A1 (zh) | 曝光裝置、曝光方法及組件製造方法 | |
HK1244065A1 (zh) | 曝光設備、曝光方法和器件製造方法 | |
HK1222716A1 (zh) | 曝光裝置、曝光方法、及元件製造方法 | |
HK1218186A1 (zh) | 暴光設備、暴光方法以及器件製造方法 | |
HK1218675A1 (zh) | 曝光裝置、曝光方法以及元件製造方法 | |
HK1169861A1 (zh) | 曝光裝置、曝光方法以及器件製造方法 | |
HK1136878A1 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
HK1206437A1 (zh) | 曝光裝置、曝光方法、以及組件製造方法 | |
HK1218185A1 (zh) | 載台裝置、曝光裝置和設備製造方法 | |
HK1181124A1 (zh) | 曝光設備、曝光方法以及器件製造方法 | |
HK1224085A1 (zh) | 曝光設備和用於生產裝置的方法 | |
HK1173232A1 (zh) | 曝光方法及裝置、以及組件製造方法 | |
HK1155821A1 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
HK1150888A1 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
EP1990828A4 (en) | EXPOSURE DEVICE, EXPOSURE METHOD AND METHOD FOR PRODUCING COMPONENTS | |
HK1137077A1 (en) | Exposure apparatus, exposure method and device manufacturing method | |
EP2034515A4 (en) | MAINTENANCE METHOD, EXPOSURE METHOD AND DEVICE AND COMPONENT MANUFACTURING METHOD | |
EP2037486A4 (en) | EXPOSURE METHOD AND DEVICE, MAINTENANCE METHOD AND COMPONENT MANUFACTURING METHOD | |
EP2034514A4 (en) | EXPOSURE METHOD AND APPARATUS, MAINTENANCE METHOD, AND METHOD OF MANUFACTURING THE DEVICE THEREFOR | |
HK1182184A1 (zh) | 曝光方法及裝置、以及元件製造方法 | |
EP1978546A4 (en) | EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD | |
EP2043134A4 (en) | MAINTENANCE METHOD, EXPOSURE METHOD, AND DEVICE AND DEVICE MANUFACTURING METHOD |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20211115 |