HK1182184A1 - 曝光方法及裝置、以及元件製造方法 - Google Patents

曝光方法及裝置、以及元件製造方法

Info

Publication number
HK1182184A1
HK1182184A1 HK13107916.1A HK13107916A HK1182184A1 HK 1182184 A1 HK1182184 A1 HK 1182184A1 HK 13107916 A HK13107916 A HK 13107916A HK 1182184 A1 HK1182184 A1 HK 1182184A1
Authority
HK
Hong Kong
Prior art keywords
exposure
producing device
exposure apparatus
producing
exposure method
Prior art date
Application number
HK13107916.1A
Other languages
English (en)
Inventor
奈良圭
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1182184A1 publication Critical patent/HK1182184A1/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277Electrolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK13107916.1A 2007-12-20 2013-07-08 曝光方法及裝置、以及元件製造方法 HK1182184A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US833607P 2007-12-20 2007-12-20
US12/261,741 US8917378B2 (en) 2007-12-20 2008-10-30 Exposure method, exposure apparatus, and method for producing device with plurality of projection optical systems and pattern having first partial pattern area and second partial area having overlaid area with first partial pattern area

Publications (1)

Publication Number Publication Date
HK1182184A1 true HK1182184A1 (zh) 2013-11-22

Family

ID=40339663

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13107916.1A HK1182184A1 (zh) 2007-12-20 2013-07-08 曝光方法及裝置、以及元件製造方法

Country Status (8)

Country Link
US (1) US8917378B2 (zh)
EP (1) EP2238514A1 (zh)
JP (1) JP5412814B2 (zh)
KR (1) KR101605567B1 (zh)
CN (2) CN102890431B (zh)
HK (1) HK1182184A1 (zh)
TW (1) TWI440990B (zh)
WO (1) WO2009081676A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8253923B1 (en) * 2008-09-23 2012-08-28 Pinebrook Imaging Technology, Ltd. Optical imaging writer system
CN102419334A (zh) * 2011-09-13 2012-04-18 浙江中控太阳能技术有限公司 一种能同时检测平面镜平整度和清洁度的装置及方法
CN103869602A (zh) * 2012-12-14 2014-06-18 京东方科技集团股份有限公司 一种掩膜板及其实现曝光接合的方法
CN103969958B (zh) * 2013-01-25 2016-03-30 上海微电子装备有限公司 一种多曝光视场拼接系统和方法
JP5344105B1 (ja) 2013-03-08 2013-11-20 ウシオ電機株式会社 光配向用偏光光照射装置及び光配向用偏光光照射方法
US9229332B2 (en) 2013-09-18 2016-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods for high-throughput and small-footprint scanning exposure for lithography
CN104749902B (zh) * 2013-12-31 2017-02-15 上海微电子装备有限公司 掩模板面型整形装置
JP5773095B1 (ja) * 2015-02-10 2015-09-02 ウシオ電機株式会社 光照射装置および光照射方法
CN106802538B (zh) * 2017-03-16 2019-01-29 无锡影速半导体科技有限公司 超大板直写式光刻机扫描曝光方法
US10474027B2 (en) 2017-11-13 2019-11-12 Macronix International Co., Ltd. Method for forming an aligned mask

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729331A (en) * 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
JP3505813B2 (ja) * 1994-11-01 2004-03-15 株式会社ニコン 走査型露光装置及び走査露光方法
DE19757074A1 (de) 1997-12-20 1999-06-24 Zeiss Carl Fa Projektionsbelichtungsanlage und Belichtungsverfahren
JP2000331909A (ja) * 1999-05-19 2000-11-30 Nikon Corp 走査型露光装置
JP4362999B2 (ja) * 2001-11-12 2009-11-11 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
TW200307184A (en) * 2002-05-23 2003-12-01 Sanei Giken Co Ltd Scan exposure method and scan exposure apparatus
JP2004335864A (ja) * 2003-05-09 2004-11-25 Nikon Corp 露光装置及び露光方法
JP4984810B2 (ja) 2006-02-16 2012-07-25 株式会社ニコン 露光方法、露光装置及びフォトマスク
CN101385123B (zh) * 2006-02-16 2010-12-15 株式会社尼康 投影光学系统、曝光装置及方法、光罩及显示器的制造方法
JP4952182B2 (ja) * 2006-03-20 2012-06-13 株式会社ニコン 走査型露光装置、マイクロデバイスの製造方法、走査露光方法、及びマスク

Also Published As

Publication number Publication date
TWI440990B (zh) 2014-06-11
WO2009081676A1 (en) 2009-07-02
EP2238514A1 (en) 2010-10-13
KR101605567B1 (ko) 2016-03-22
US20090257033A1 (en) 2009-10-15
CN102890431B (zh) 2015-09-09
US8917378B2 (en) 2014-12-23
TW200942978A (en) 2009-10-16
CN101918897A (zh) 2010-12-15
KR20100094451A (ko) 2010-08-26
CN102890431A (zh) 2013-01-23
CN101918897B (zh) 2012-11-14
JP2009151298A (ja) 2009-07-09
JP5412814B2 (ja) 2014-02-12

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20211115