HK1069008A1 - Electrical assembly - Google Patents

Electrical assembly

Info

Publication number
HK1069008A1
HK1069008A1 HK05101478.4A HK05101478A HK1069008A1 HK 1069008 A1 HK1069008 A1 HK 1069008A1 HK 05101478 A HK05101478 A HK 05101478A HK 1069008 A1 HK1069008 A1 HK 1069008A1
Authority
HK
Hong Kong
Prior art keywords
electrical assembly
electrical
assembly
Prior art date
Application number
HK05101478.4A
Other languages
English (en)
Inventor
Masaaki Togashi
Taisuke Ahiko
Akitoshi Yoshii
Atsushi Takeda
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003078509A external-priority patent/JP3847265B2/ja
Priority claimed from JP2003133302A external-priority patent/JP3906995B2/ja
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of HK1069008A1 publication Critical patent/HK1069008A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
HK05101478.4A 2003-03-20 2005-02-22 Electrical assembly HK1069008A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003078509A JP3847265B2 (ja) 2003-03-20 2003-03-20 電子部品
JP2003133302A JP3906995B2 (ja) 2003-05-12 2003-05-12 セラミックコンデンサ

Publications (1)

Publication Number Publication Date
HK1069008A1 true HK1069008A1 (en) 2005-05-06

Family

ID=32993009

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05101478.4A HK1069008A1 (en) 2003-03-20 2005-02-22 Electrical assembly

Country Status (5)

Country Link
US (1) US6958899B2 (ko)
KR (1) KR100586863B1 (ko)
CN (1) CN100440393C (ko)
HK (1) HK1069008A1 (ko)
TW (1) TWI229879B (ko)

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* Cited by examiner, † Cited by third party
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US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7697262B2 (en) 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
JP2007220751A (ja) * 2006-02-14 2007-08-30 Tdk Corp セラミックコンデンサの実装構造及びセラミックコンデンサ
US7352563B2 (en) * 2006-03-13 2008-04-01 Avx Corporation Capacitor assembly
US7911315B2 (en) * 2006-07-28 2011-03-22 Honeywell International Inc. Miniature pressure sensor assembly for catheter
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
JP4479747B2 (ja) * 2007-05-30 2010-06-09 Ｔｄｋ株式会社 積層コンデンサ
JP4475338B2 (ja) * 2008-02-14 2010-06-09 Ｔｄｋ株式会社 積層コンデンサ
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
DE102008050452B4 (de) * 2008-10-08 2010-09-16 Mtu Aero Engines Gmbh Kontaktierungsanordnung für einen Kondensator, Leistungsmodul und Verfahren zum Herstellen eines Leistungsmoduls
JP5045649B2 (ja) * 2008-11-17 2012-10-10 株式会社村田製作所 セラミックコンデンサ及びそれを備えた電子部品
JP4752901B2 (ja) * 2008-11-27 2011-08-17 株式会社村田製作所 電子部品及び電子部品内蔵基板
JP4862900B2 (ja) * 2009-01-28 2012-01-25 Ｔｄｋ株式会社 積層コンデンサ及び積層コンデンサの製造方法
JP4924698B2 (ja) * 2009-11-11 2012-04-25 Ｔｄｋ株式会社 電子部品実装構造
US9805872B2 (en) 2015-12-09 2017-10-31 Kemet Electronics Corporation Multiple MLCC modules
KR101058697B1 (ko) * 2010-12-21 2011-08-22 삼성전기주식회사 적층 세라믹 커패시터의 회로 기판 실장 구조, 실장 방법과 이를 위한 회로 기판의 랜드 패턴, 수평 방향으로 테이핑한 적층 세라믹 커패시터의 포장체 및 수평 방향 정렬방법
JP5776583B2 (ja) * 2011-03-18 2015-09-09 株式会社村田製作所 積層セラミックコンデンサ
KR20120131726A (ko) * 2011-05-26 2012-12-05 삼성전기주식회사 적층형 캐패시터 및 그 제조방법
KR101548770B1 (ko) * 2011-06-23 2015-09-01 삼성전기주식회사 칩 타입 적층 커패시터
DE102011107193A1 (de) 2011-07-13 2013-01-17 Epcos Ag Elektrische Vorrichtung
JP5899699B2 (ja) 2011-08-10 2016-04-06 Tdk株式会社 積層型コンデンサ
US20130107419A1 (en) * 2011-10-28 2013-05-02 Kemet Electronics Corporation Multilayered ceramic capacitor with improved lead frame attachment
US8988857B2 (en) * 2011-12-13 2015-03-24 Kemet Electronics Corporation High aspect ratio stacked MLCC design
JP5794222B2 (ja) * 2012-02-03 2015-10-14 株式会社村田製作所 セラミック電子部品
JP5796568B2 (ja) * 2012-02-03 2015-10-21 株式会社村田製作所 セラミック電子部品
US9570236B2 (en) * 2012-03-29 2017-02-14 Taiyo Yuden Co., Ltd. Electronic component and method for manufacturing the same
DE102012104033A1 (de) * 2012-05-08 2013-11-14 Epcos Ag Keramischer Vielschichtkondensator
KR101309479B1 (ko) 2012-05-30 2013-09-23 삼성전기주식회사 적층 칩 전자부품, 그 실장 기판 및 포장체
JP5729363B2 (ja) * 2012-08-29 2015-06-03 株式会社村田製作所 品質評価装置、品質評価方法及び評価用基板
KR101792280B1 (ko) * 2012-12-10 2017-11-01 삼성전기주식회사 스택형 적층 세라믹 전자 부품, 스택형 적층 세라믹 전자 부품 모듈 및 그 제조 방법
JP6032212B2 (ja) * 2013-03-19 2016-11-24 株式会社村田製作所 積層電子部品およびその実装構造体
US9208774B2 (en) * 2013-04-12 2015-12-08 Apple Inc. Adaptive vibration damping mechanism to eliminate acoustic noise in electronic systems
US9445532B2 (en) * 2013-05-09 2016-09-13 Ford Global Technologies, Llc Integrated electrical and thermal solution for inverter DC-link capacitor packaging
JP2015008270A (ja) * 2013-05-27 2015-01-15 株式会社村田製作所 セラミック電子部品
KR101477405B1 (ko) * 2013-07-05 2014-12-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101508539B1 (ko) * 2013-07-09 2015-04-07 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102122932B1 (ko) * 2013-08-08 2020-06-15 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터 실장 기판
JP6137069B2 (ja) * 2013-10-01 2017-05-31 株式会社村田製作所 コンデンサの実装構造体及びコンデンサ
JP2016535445A (ja) * 2013-10-29 2016-11-10 ケメット エレクトロニクス コーポレーション 改良されたリード設計を有するセラミックコンデンサー
JP2015099815A (ja) * 2013-11-18 2015-05-28 株式会社東芝 電子機器
JP6295662B2 (ja) * 2013-12-27 2018-03-20 Tdk株式会社 電子部品
KR20150118386A (ko) * 2014-04-14 2015-10-22 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP2015228482A (ja) * 2014-05-09 2015-12-17 株式会社村田製作所 積層セラミック電子部品の実装構造体
US10204737B2 (en) 2014-06-11 2019-02-12 Avx Corporation Low noise capacitors
JP6446877B2 (ja) 2014-07-16 2019-01-09 Tdk株式会社 薄膜キャパシタ
JP6519112B2 (ja) 2014-07-24 2019-05-29 Tdk株式会社 薄膜キャパシタ
KR101973418B1 (ko) * 2014-09-23 2019-04-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101630065B1 (ko) * 2014-09-23 2016-06-13 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
US9997295B2 (en) * 2014-09-26 2018-06-12 Murata Manufacturing Co., Ltd. Electronic component
JP6620404B2 (ja) * 2015-03-03 2019-12-18 Tdk株式会社 電子部品
KR101681429B1 (ko) * 2015-10-08 2016-11-30 삼성전기주식회사 전자 부품 및 그 실장 기판
US10224149B2 (en) 2015-12-09 2019-03-05 Kemet Electronics Corporation Bulk MLCC capacitor module
JP2017182496A (ja) * 2016-03-30 2017-10-05 ソニー株式会社 制御装置、制御方法およびプログラム
JP6780394B2 (ja) * 2016-09-12 2020-11-04 Tdk株式会社 電子部品
CN108091488B (zh) * 2016-11-22 2020-12-29 Tdk株式会社 电子部件
JP6878851B2 (ja) 2016-11-22 2021-06-02 Tdk株式会社 セラミック電子部品
US10381158B2 (en) * 2016-11-22 2019-08-13 Tdk Corporation Electronic device
JP7039955B2 (ja) 2017-11-21 2022-03-23 Tdk株式会社 電子部品
JP2018206813A (ja) * 2017-05-30 2018-12-27 株式会社村田製作所 積層セラミック電子部品
JP7195730B2 (ja) * 2017-09-11 2022-12-26 Tdk株式会社 電子部品
KR102067176B1 (ko) * 2017-10-19 2020-01-15 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
JP7004151B2 (ja) * 2017-12-28 2022-01-21 Tdk株式会社 電子部品
JP7091782B2 (ja) * 2018-03-30 2022-06-28 Tdk株式会社 電子部品
KR102538898B1 (ko) * 2018-06-08 2023-06-01 삼성전기주식회사 전자 부품
KR102194707B1 (ko) 2018-08-16 2020-12-23 삼성전기주식회사 전자 부품
KR102211743B1 (ko) 2018-08-29 2021-02-03 삼성전기주식회사 전자 부품
KR102142516B1 (ko) 2018-09-04 2020-08-07 삼성전기주식회사 전자 부품
KR102097032B1 (ko) * 2018-09-13 2020-04-03 삼성전기주식회사 전자 부품 및 그 실장 기판
KR102148830B1 (ko) * 2018-11-16 2020-08-27 삼성전기주식회사 전자 부품
JP7103254B2 (ja) * 2019-02-07 2022-07-20 株式会社村田製作所 コイル部品
JP2021068853A (ja) * 2019-10-28 2021-04-30 株式会社村田製作所 支持端子付きコンデンサチップ
JP7351177B2 (ja) * 2019-10-28 2023-09-27 Tdk株式会社 セラミック電子部品
CN111326370A (zh) * 2020-02-29 2020-06-23 布鲁斯凯技术公司 继电器控制系统
JP2021141126A (ja) * 2020-03-03 2021-09-16 Koa株式会社 面実装型抵抗器
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JP2022156320A (ja) * 2021-03-31 2022-10-14 Tdk株式会社 積層電子部品
KR20230111732A (ko) 2022-01-19 2023-07-26 제엠제코(주) 다층 세라믹 반도체 장치

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Also Published As

Publication number Publication date
US20040183147A1 (en) 2004-09-23
TW200426863A (en) 2004-12-01
KR100586863B1 (ko) 2006-06-07
CN100440393C (zh) 2008-12-03
CN1532860A (zh) 2004-09-29
US6958899B2 (en) 2005-10-25
TWI229879B (en) 2005-03-21
KR20040082995A (ko) 2004-09-30

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130319