JP4924698B2 - 電子部品実装構造 - Google Patents
電子部品実装構造 Download PDFInfo
- Publication number
- JP4924698B2 JP4924698B2 JP2009257947A JP2009257947A JP4924698B2 JP 4924698 B2 JP4924698 B2 JP 4924698B2 JP 2009257947 A JP2009257947 A JP 2009257947A JP 2009257947 A JP2009257947 A JP 2009257947A JP 4924698 B2 JP4924698 B2 JP 4924698B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- capacitor
- multilayer substrate
- hole conductor
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
Claims (2)
- 素体の互いに対向する両端面にそれぞれ第一端子電極が形成された第一コンデンサ、及び前記第一端子電極にそれぞれ電気的に接続された金属端子を有する第一電子部品と、
素体の互いに対向する両端面にそれぞれ第二端子電極が形成された第二コンデンサをそれぞれ有する複数の第二電子部品と、
前記第一電子部品及び前記複数の第二電子部品とそれぞれ電気的に接続される表面実装電極部、基板内に設けられる内部導体部、及び前記基板内に設けられて前記表面実装電極部と前記内部導体部とをそれぞれ電気的に接続するスルーホール導体部を有する多層基板と、を備え、
前記第一電子部品は、前記第一コンデンサと前記多層基板の実装面とが離間するように、前記表面実装電極部と前記金属端子とが電気的に接続され、
前記複数の第二電子部品は、前記第一コンデンサと前記多層基板の前記実装面との間に配置されると共に、前記表面実装電極部と前記複数の第二端子電極とが電気的に接続され、
前記多層基板の積層方向から見て、前記複数の第二電子部品は、それぞれの全域にわたって前記第一コンデンサと重なり、
前記第一コンデンサは、前記第二コンデンサよりも大きい静電容量を有し、
前記第一電子部品は、前記第一端子電極同士が所定の方向に対向するように、前記多層基板に実装され、
前記複数の第二電子部品は、それぞれの前記第二端子電極同士が前記所定の方向に対向するように、前記多層基板に実装され、
前記第一電子部品に対する前記スルーホール導体部と前記第二電子部品に対する前記スルーホール導体部とが互いに隣接し且つ異極性であって、互いの相互インダクタンスによって磁束を打ち消しあうことにより、ESLを低減し、
前記第一コンデンサに流れる電流の向きと複数の前記第二コンデンサに流れる電流の向きとが平行で且つ互いに逆向きであって、互いの相互インダクタンスによって磁束を打ち消しあうことにより、ESLを低減していることを特徴とする電子部品実装構造。 - 前記多層基板は、パッケージとして構成され、内部空間を有するソケットを介してマザーボードと電気的に接続されており、
前記第一電子部品及び前記第二電子部品は、前記内部空間に配置されることを特徴とする請求項1記載の電子部品実装構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009257947A JP4924698B2 (ja) | 2009-11-11 | 2009-11-11 | 電子部品実装構造 |
US12/941,265 US8325489B2 (en) | 2009-11-11 | 2010-11-08 | Electronic component mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009257947A JP4924698B2 (ja) | 2009-11-11 | 2009-11-11 | 電子部品実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011103385A JP2011103385A (ja) | 2011-05-26 |
JP4924698B2 true JP4924698B2 (ja) | 2012-04-25 |
Family
ID=43974029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009257947A Active JP4924698B2 (ja) | 2009-11-11 | 2009-11-11 | 電子部品実装構造 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8325489B2 (ja) |
JP (1) | JP4924698B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5994958B2 (ja) * | 2014-09-30 | 2016-09-21 | 株式会社村田製作所 | 半導体パッケージおよびその実装構造 |
JP6613670B2 (ja) * | 2015-07-15 | 2019-12-04 | 富士通株式会社 | 電子部品、及び部品内蔵基板 |
US20170330691A1 (en) * | 2016-05-12 | 2017-11-16 | Denso Corporation | Capacitor Module |
KR102595463B1 (ko) * | 2018-02-22 | 2023-10-30 | 삼성전기주식회사 | 전자 부품 |
KR102683289B1 (ko) * | 2018-12-17 | 2024-07-10 | 삼성전기주식회사 | 인쇄회로기판 |
US12022618B2 (en) * | 2021-04-22 | 2024-06-25 | Western Digital Technologies, Inc. | Printed circuit board with stacked passive components |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0728111B2 (ja) * | 1986-03-20 | 1995-03-29 | 株式会社日立製作所 | 電気回路 |
JPH04278596A (ja) * | 1991-03-06 | 1992-10-05 | Mitsubishi Electric Corp | チップ形電子部品の実装用補助装置 |
JPH066092A (ja) * | 1992-06-16 | 1994-01-14 | Ibiden Co Ltd | 部品実装方法 |
JPH06334294A (ja) * | 1993-05-18 | 1994-12-02 | Mitsubishi Electric Corp | プリント配線構造 |
JPH07321440A (ja) * | 1994-05-26 | 1995-12-08 | Mitsubishi Electric Corp | 半導体装置 |
DE69936008T2 (de) * | 1998-01-07 | 2008-01-10 | Tdk Corp. | Keramischer Kondensator |
JP2000340920A (ja) * | 1999-05-31 | 2000-12-08 | Kyocera Corp | 回路基板および集積回路装置 |
JP4130525B2 (ja) * | 2000-09-18 | 2008-08-06 | 株式会社東芝 | コンデンサの実装構造 |
JP4476465B2 (ja) * | 2000-10-04 | 2010-06-09 | 三菱電機株式会社 | 電力変換装置 |
JP4863559B2 (ja) * | 2001-03-13 | 2012-01-25 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
US6704189B2 (en) * | 2002-04-09 | 2004-03-09 | Tdk Corporation | Electronic device with external terminals and method of production of the same |
JP4186589B2 (ja) * | 2002-10-30 | 2008-11-26 | 松下電器産業株式会社 | シート形電子部品モジュール |
US7317622B2 (en) * | 2002-12-31 | 2008-01-08 | Intel Corporation | Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt |
JP2004282171A (ja) * | 2003-03-12 | 2004-10-07 | Fujitsu Ltd | 広帯域直流成分除去回路及びその組立方法 |
US6958899B2 (en) * | 2003-03-20 | 2005-10-25 | Tdk Corporation | Electronic device |
US7123465B2 (en) * | 2004-09-24 | 2006-10-17 | Silicon Bandwidth, Inc. | Decoupling capacitor for an integrated circuit and method of manufacturing thereof |
US7697262B2 (en) * | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
JP2007220751A (ja) * | 2006-02-14 | 2007-08-30 | Tdk Corp | セラミックコンデンサの実装構造及びセラミックコンデンサ |
JP2008186962A (ja) * | 2007-01-29 | 2008-08-14 | Murata Mfg Co Ltd | 多層配線基板 |
JP5176775B2 (ja) * | 2008-06-02 | 2013-04-03 | 株式会社村田製作所 | セラミック電子部品及びその製造方法 |
-
2009
- 2009-11-11 JP JP2009257947A patent/JP4924698B2/ja active Active
-
2010
- 2010-11-08 US US12/941,265 patent/US8325489B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2011103385A (ja) | 2011-05-26 |
US20110110060A1 (en) | 2011-05-12 |
US8325489B2 (en) | 2012-12-04 |
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