JP4862900B2 - 積層コンデンサ及び積層コンデンサの製造方法 - Google Patents
積層コンデンサ及び積層コンデンサの製造方法 Download PDFInfo
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- JP4862900B2 JP4862900B2 JP2009017086A JP2009017086A JP4862900B2 JP 4862900 B2 JP4862900 B2 JP 4862900B2 JP 2009017086 A JP2009017086 A JP 2009017086A JP 2009017086 A JP2009017086 A JP 2009017086A JP 4862900 B2 JP4862900 B2 JP 4862900B2
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- 239000003990 capacitor Substances 0.000 title claims description 80
- 238000004519 manufacturing process Methods 0.000 title description 17
- 239000000758 substrate Substances 0.000 claims description 69
- 239000002184 metal Substances 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 230000000630 rising effect Effects 0.000 claims description 22
- 238000010030 laminating Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 30
- 238000003825 pressing Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 11
- 239000006071 cream Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
図1は、本発明の第1実施形態に係る積層コンデンサを示す斜視図である。また、図2は、図1の分解斜視図であり、図3は、その側面図である。
続いて、本発明の第2実施形態について説明する。図6は、本発明の第2実施形態に係る積層コンデンサを示す斜視図である。また、図7は、図6の分解斜視図であり、図8は、その側面図である。
Claims (4)
- 誘電体層を複数積層してなる素体と、
前記素体の端面を覆うように形成された端子電極と、
前記素体の周りに設けられた金属端子と、を備えた積層コンデンサであって、
前記金属端子は、
前記素体の底面側で前記端子電極に接続された端子接続面と、
前記素体の底面から所定距離だけ離間した状態で、前記端子接続面よりも前記素体の中央側に配置された基板接続面と、
前記基板接続面と前記端子接続面とに連結された連結面と、を有し、
前記連結面は、
前記所定距離よりも短い距離で前記素体の底面から離間した状態で、前記端子接続面と
前記基板接続面との間の位置に配置された中間面と、
前記基板接続面から起立して前記中間面に連結された第1の起立面と、
前記中間面から起立して前記端子接続面に連結された第2の起立面と、を有し、
前記端子接続面、前記基板接続面、前記連結面、前記第1の起立面、及び前記第2の起立面によって形成される段部が、前記誘電体層の積層方向から見て前記素体と重なる領域内に位置し、この段部において、前記中間面における前記第1の起立面側の端部から前記第2の起立面における前記端子接続面側の端部にわたって延在する切抜部が形成されていることを特徴とする積層コンデンサ。 - 前記金属端子は、前記素体の前記端面に沿うように前記端子接続面から起立する起立面を更に有していることを特徴とする請求項1記載の積層コンデンサ。
- 前記金属端子の高さは、前記素体の高さ以下であることを特徴とする請求項1又は2記載の積層コンデンサ。
- 前記金属端子は、前記誘電体層の積層方向から見て重なり部分を有していないことを特徴とする請求項1〜3のいずれか一項記載の積層コンデンサ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009017086A JP4862900B2 (ja) | 2009-01-28 | 2009-01-28 | 積層コンデンサ及び積層コンデンサの製造方法 |
US12/629,646 US8315035B2 (en) | 2009-01-28 | 2009-12-02 | Multilayer capacitor and method of manufacturing same |
KR1020090122207A KR101079568B1 (ko) | 2009-01-28 | 2009-12-10 | 적층 콘덴서 및 적층 콘덴서의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009017086A JP4862900B2 (ja) | 2009-01-28 | 2009-01-28 | 積層コンデンサ及び積層コンデンサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010177370A JP2010177370A (ja) | 2010-08-12 |
JP4862900B2 true JP4862900B2 (ja) | 2012-01-25 |
Family
ID=42353995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009017086A Active JP4862900B2 (ja) | 2009-01-28 | 2009-01-28 | 積層コンデンサ及び積層コンデンサの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8315035B2 (ja) |
JP (1) | JP4862900B2 (ja) |
KR (1) | KR101079568B1 (ja) |
Cited By (1)
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---|---|---|---|---|
DE102016202049A1 (de) | 2015-02-13 | 2016-08-18 | Murata Manufacturing Co., Ltd. | Spulenkomponente |
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JP4014819B2 (ja) * | 2001-05-14 | 2007-11-28 | Necトーキン株式会社 | チップ型コンデンサおよびその製造方法 |
JP4318286B2 (ja) | 2003-03-03 | 2009-08-19 | Tdk株式会社 | 電子部品 |
JP3847265B2 (ja) * | 2003-03-20 | 2006-11-22 | Tdk株式会社 | 電子部品 |
US6958899B2 (en) * | 2003-03-20 | 2005-10-25 | Tdk Corporation | Electronic device |
JP2006024825A (ja) * | 2004-07-09 | 2006-01-26 | Mitsubishi Electric Corp | 電気部品 |
JP2006168320A (ja) | 2004-12-20 | 2006-06-29 | Taiyo Yuden Co Ltd | 電子部品又は積層電子部品用シートの製造方法 |
JP2008130954A (ja) * | 2006-11-24 | 2008-06-05 | Maruwa Co Ltd | 導電脚体付きチップ形積層コンデンサ及びその製造方法並びにチップ形積層コンデンサの導電脚体形成用前駆体 |
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2009
- 2009-01-28 JP JP2009017086A patent/JP4862900B2/ja active Active
- 2009-12-02 US US12/629,646 patent/US8315035B2/en active Active
- 2009-12-10 KR KR1020090122207A patent/KR101079568B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102016202049A1 (de) | 2015-02-13 | 2016-08-18 | Murata Manufacturing Co., Ltd. | Spulenkomponente |
JP2016149498A (ja) * | 2015-02-13 | 2016-08-18 | 株式会社村田製作所 | コイル部品 |
US10347415B2 (en) | 2015-02-13 | 2019-07-09 | Murata Manufacturing Co., Ltd. | Coil component |
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KR101079568B1 (ko) | 2011-11-04 |
US8315035B2 (en) | 2012-11-20 |
KR20100087622A (ko) | 2010-08-05 |
JP2010177370A (ja) | 2010-08-12 |
US20100188798A1 (en) | 2010-07-29 |
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