JPH029420U - - Google Patents

Info

Publication number
JPH029420U
JPH029420U JP8814788U JP8814788U JPH029420U JP H029420 U JPH029420 U JP H029420U JP 8814788 U JP8814788 U JP 8814788U JP 8814788 U JP8814788 U JP 8814788U JP H029420 U JPH029420 U JP H029420U
Authority
JP
Japan
Prior art keywords
electronic component
lead wire
package portion
bent
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8814788U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8814788U priority Critical patent/JPH029420U/ja
Publication of JPH029420U publication Critical patent/JPH029420U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第1〜8図は本考案の実施例を示し、第1図は
はリード線の溝をスリツト状に形成した場合の電
子部品の斜視図、第2図はその電子部品をプリン
ト基盤に装着した状態での断面図、第3図及び第
4図は溝をスリツト状に形成した場合の別例図、
第5図はリード線の溝を凹み形成した場合の実施
例を示す斜視図、第6図は溝を凹み形成した場合
の別例図、第7図は第6図の―視断面図、第
8図はリード線の溝を刻設して形成した場合の実
施例を示す断面図、第9図は従来の電子部品の斜
視図、第10図はその装着状態を示す断面図であ
る。 1……電子部品、2……パツケージ部、3……
リード線、4,4a,4b……溝、5……プリン
ト基板、6……回路パターン、7……半田。

Claims (1)

    【実用新案登録請求の範囲】
  1. パツケージ部における左右両側面のうち両方又
    は一方の側面から突出したリード線を、前記パツ
    ケージ部における下面に向けて屈曲して成る電子
    部品において、前記リード線に、その基端近傍か
    ら先端に向けて延びる溝を形成したことを特徴と
    する電子部品。
JP8814788U 1988-07-01 1988-07-01 Pending JPH029420U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8814788U JPH029420U (ja) 1988-07-01 1988-07-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8814788U JPH029420U (ja) 1988-07-01 1988-07-01

Publications (1)

Publication Number Publication Date
JPH029420U true JPH029420U (ja) 1990-01-22

Family

ID=31312724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8814788U Pending JPH029420U (ja) 1988-07-01 1988-07-01

Country Status (1)

Country Link
JP (1) JPH029420U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185349A (ja) * 1992-01-14 1993-07-27 Toyo Glass Co Ltd ガラス製品の表面加工装置
US8315035B2 (en) 2009-01-28 2012-11-20 Tdk Corporation Multilayer capacitor and method of manufacturing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185349A (ja) * 1992-01-14 1993-07-27 Toyo Glass Co Ltd ガラス製品の表面加工装置
US8315035B2 (en) 2009-01-28 2012-11-20 Tdk Corporation Multilayer capacitor and method of manufacturing same

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