JPH031472U - - Google Patents
Info
- Publication number
- JPH031472U JPH031472U JP5936289U JP5936289U JPH031472U JP H031472 U JPH031472 U JP H031472U JP 5936289 U JP5936289 U JP 5936289U JP 5936289 U JP5936289 U JP 5936289U JP H031472 U JPH031472 U JP H031472U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed
- circuit component
- wiring structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に係るプリント基板配線構体
の平面図、第２図は第１図の斜視図、第３図は同
じく要部断面図、第４図は従来のプリント配線体
の斜視図、及び第５図は第４図の側面図である。 １０……プリント配線構体、１１……プリント
基板、１２……空芯コイル（回路部品）、１３…
…半田、１４……透孔、１５……リード、１６…
……本体。
の平面図、第２図は第１図の斜視図、第３図は同
じく要部断面図、第４図は従来のプリント配線体
の斜視図、及び第５図は第４図の側面図である。 １０……プリント配線構体、１１……プリント
基板、１２……空芯コイル（回路部品）、１３…
…半田、１４……透孔、１５……リード、１６…
……本体。
Claims (1)
- 回路部品の実装位置に透孔を形成したプリント
基板に、前記回路部品の本体を部分的に挿通させ
て配置し、その導出リードをプリント基板の表面
に形成した配線パターンと電気機械的に結合した
ことを特徴とするプリント配線構体。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5936289U JPH031472U (ja) | 1989-05-23 | 1989-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5936289U JPH031472U (ja) | 1989-05-23 | 1989-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031472U true JPH031472U (ja) | 1991-01-09 |
Family
ID=31585793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5936289U Pending JPH031472U (ja) | 1989-05-23 | 1989-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031472U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6270756U (ja) * | 1985-10-24 | 1987-05-06 | ||
| WO2008047713A1 (en) * | 2006-10-17 | 2008-04-24 | Shinto Holdings Co., Ltd. | Inductor |
| WO2022167390A1 (de) * | 2021-02-05 | 2022-08-11 | Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg | Befestigungsanordnung eines leiterplattenmontierten bauelements |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245810B2 (ja) * | 1979-10-08 | 1987-09-29 | Daikin Kogyo Co Ltd |
-
1989
- 1989-05-23 JP JP5936289U patent/JPH031472U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245810B2 (ja) * | 1979-10-08 | 1987-09-29 | Daikin Kogyo Co Ltd |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6270756U (ja) * | 1985-10-24 | 1987-05-06 | ||
| JPH0347487Y2 (ja) * | 1985-10-24 | 1991-10-09 | ||
| WO2008047713A1 (en) * | 2006-10-17 | 2008-04-24 | Shinto Holdings Co., Ltd. | Inductor |
| JP2008103430A (ja) * | 2006-10-17 | 2008-05-01 | Sigma Denshi Kk | インダクタ |
| KR101138031B1 (ko) * | 2006-10-17 | 2012-04-20 | 티엠피 가부시끼가이샤 | 인덕터 |
| WO2022167390A1 (de) * | 2021-02-05 | 2022-08-11 | Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg | Befestigungsanordnung eines leiterplattenmontierten bauelements |