HK1060215A1 - Pod load interface equipment adapted for implementation in a front-opening interface mechanical standard (films) system - Google Patents
Pod load interface equipment adapted for implementation in a front-opening interface mechanical standard (films) systemInfo
- Publication number
- HK1060215A1 HK1060215A1 HK04103060A HK04103060A HK1060215A1 HK 1060215 A1 HK1060215 A1 HK 1060215A1 HK 04103060 A HK04103060 A HK 04103060A HK 04103060 A HK04103060 A HK 04103060A HK 1060215 A1 HK1060215 A1 HK 1060215A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- link
- along
- carriage
- travel path
- drive
- Prior art date
Links
- 238000010276 construction Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/30—Vessels; Containers
- H01J61/35—Vessels; Containers provided with coatings on the walls thereof; Selection of materials for the coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J65/00—Lamps without any electrode inside the vessel; Lamps with at least one main electrode outside the vessel
- H01J65/04—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels
- H01J65/042—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field
- H01J65/046—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field the field being produced by using capacitive means around the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/78654—Monocrystalline silicon transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supplying Of Containers To The Packaging Station (AREA)
- Warehouses Or Storage Devices (AREA)
- Circuits Of Receivers In General (AREA)
- Communication Control (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Buffer Packaging (AREA)
- Container Filling Or Packaging Operations (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/612,757 US6501070B1 (en) | 1998-07-13 | 2000-07-10 | Pod load interface equipment adapted for implementation in a fims system |
PCT/US2001/021804 WO2002005328A2 (en) | 2000-07-10 | 2001-07-10 | Pod load interface equipment adapted for implementation in a fims system |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1060215A1 true HK1060215A1 (en) | 2004-07-30 |
Family
ID=24454532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04103060A HK1060215A1 (en) | 2000-07-10 | 2004-04-30 | Pod load interface equipment adapted for implementation in a front-opening interface mechanical standard (films) system |
Country Status (10)
Country | Link |
---|---|
US (5) | US6501070B1 (xx) |
EP (1) | EP1356500B1 (xx) |
JP (3) | JP2004509454A (xx) |
KR (1) | KR101163216B1 (xx) |
CN (1) | CN1249775C (xx) |
AT (1) | ATE381115T1 (xx) |
AU (1) | AU2001280508A1 (xx) |
DE (1) | DE60131895T2 (xx) |
HK (1) | HK1060215A1 (xx) |
WO (1) | WO2002005328A2 (xx) |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
JP4691281B2 (ja) * | 2001-09-03 | 2011-06-01 | ローツェ株式会社 | シリンダ及びそれを用いたロードポート並びに生産方式 |
US6652212B2 (en) * | 2000-05-02 | 2003-11-25 | Ckd Corporation | Cylinder, load port using it, and production system |
US7147424B2 (en) * | 2000-07-07 | 2006-12-12 | Applied Materials, Inc. | Automatic door opener |
US6676356B2 (en) * | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
US6581986B2 (en) * | 2000-11-21 | 2003-06-24 | Tri Teq Lock And Security, L.L.C. | Bayonet locking system and method for vending machines and the like |
US6789328B2 (en) * | 2001-04-17 | 2004-09-14 | Brooks Automation, Inc. | Semiconductor load port alignment device |
JP2005520321A (ja) * | 2001-07-16 | 2005-07-07 | アシスト テクノロジーズ インコーポレイテッド | ツールのフロントエンド加工物処理のための統合システム |
US6621694B2 (en) * | 2001-09-07 | 2003-09-16 | Harris Corporation | Vibration tolerant electronic assembly and related methods |
US7344349B2 (en) * | 2001-11-30 | 2008-03-18 | Right Mfg. Co., Ltd. | Pod cover removing-installing apparatus |
US20080206028A1 (en) * | 2001-11-30 | 2008-08-28 | Tatsuhiko Nagata | Pod cover removing-installing apparatus |
JP2003303869A (ja) * | 2002-04-05 | 2003-10-24 | Sankyo Seiki Mfg Co Ltd | 基板搬送装置における蓋部材開閉装置 |
WO2003088351A1 (fr) * | 2002-04-12 | 2003-10-23 | Tokyo Electron Limited | Structure d'orifice dans un dispositif de traitement de semi-conducteur |
US6595075B1 (en) * | 2002-05-06 | 2003-07-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for testing cassette pod door |
US7677859B2 (en) * | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
JP4091380B2 (ja) * | 2002-08-29 | 2008-05-28 | 東京エレクトロン株式会社 | 被処理体基板を収容した複数種類のカセットに対応可能なロードポート |
US6984839B2 (en) * | 2002-11-22 | 2006-01-10 | Tdk Corporation | Wafer processing apparatus capable of mapping wafers |
US20050169730A1 (en) * | 2003-04-30 | 2005-08-04 | Ravinder Aggarwal | Semiconductor processing tool front end interface with sealing capability |
US7674083B2 (en) * | 2003-05-15 | 2010-03-09 | Tdk Corporation | Clean device with clean box-opening/closing device |
US7621714B2 (en) * | 2003-10-23 | 2009-11-24 | Tdk Corporation | Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US20050113976A1 (en) | 2003-11-10 | 2005-05-26 | Blueshift Technologies, Inc. | Software controller for handling system |
US20070269297A1 (en) | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
TWI246109B (en) * | 2004-04-26 | 2005-12-21 | Quanta Display Inc | Apparatus for rotating and positioning a substrate-carrying cassette |
JP2005340614A (ja) * | 2004-05-28 | 2005-12-08 | Tdk Corp | クリーンシステム用ロードポート |
WO2006009723A2 (en) * | 2004-06-15 | 2006-01-26 | Brooks Automation, Inc. | Substrate processing apparatus with removable component module |
FR2874744B1 (fr) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | Interface sous vide entre une boite de mini-environnement et un equipement |
US7720558B2 (en) * | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
TWI251858B (en) * | 2004-09-17 | 2006-03-21 | Ind Tech Res Inst | Six-linkage positioning mechanism |
JP4373316B2 (ja) * | 2004-10-14 | 2009-11-25 | ミライアル株式会社 | 薄板支持容器用クランプ装置 |
CN100361270C (zh) * | 2005-06-17 | 2008-01-09 | 东南大学 | 外电极荧光灯管及其制备工艺 |
US8821099B2 (en) * | 2005-07-11 | 2014-09-02 | Brooks Automation, Inc. | Load port module |
DE102006008997A1 (de) | 2006-02-23 | 2007-10-11 | Integrated Dynamics Engineering Inc., Randolph | Verfahren und Vorrichtung zum Aufnehmen und/oder Transportieren von Substraten |
JP4338205B2 (ja) * | 2006-03-29 | 2009-10-07 | Tdk株式会社 | ポッドクランプユニット、ポッドクランプユニットを有するロードポート、ポッド及びロードポートを有するミニエンバイロンメントシステム |
US7750909B2 (en) * | 2006-05-16 | 2010-07-06 | Sony Corporation | Ordering artists by overall degree of influence |
DE102006029003A1 (de) * | 2006-06-24 | 2008-01-03 | Vistec Semiconductor Systems Gmbh | Waferhandhabungsvorrichtung |
US20080041758A1 (en) * | 2006-08-16 | 2008-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer carrier |
JP4713424B2 (ja) * | 2006-08-24 | 2011-06-29 | 川崎重工業株式会社 | オープナ側ドア駆動機構 |
US9117859B2 (en) | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
JP2008060513A (ja) * | 2006-09-04 | 2008-03-13 | Tokyo Electron Ltd | 処理装置及び処理方法 |
US7740437B2 (en) | 2006-09-22 | 2010-06-22 | Asm International N.V. | Processing system with increased cassette storage capacity |
US7585142B2 (en) | 2007-03-16 | 2009-09-08 | Asm America, Inc. | Substrate handling chamber with movable substrate carrier loading platform |
KR100801631B1 (ko) * | 2007-08-29 | 2008-02-11 | (주)메머드 | 핌스로더의 맵핑장치 |
KR100952183B1 (ko) * | 2007-09-28 | 2010-04-09 | 한전원자력연료 주식회사 | 용접치구 자동 장입 및 인출 장치 |
WO2009066573A1 (ja) * | 2007-11-21 | 2009-05-28 | Kabushiki Kaisha Yaskawa Denki | 搬送ロボット、それを備えた局所クリーン化された筐体、及びそれを備えた半導体製造装置 |
JP5532861B2 (ja) * | 2008-11-28 | 2014-06-25 | Tdk株式会社 | 密閉容器の蓋閉鎖方法及び密閉容器の蓋開閉システム |
EP2320454A1 (en) * | 2009-11-05 | 2011-05-11 | S.O.I.Tec Silicon on Insulator Technologies | Substrate holder and clipping device |
DE102009053032B4 (de) * | 2009-11-12 | 2019-07-18 | Kuka Deutschland Gmbh | Manipulator mit einer frei tragende Arme aufweisenden Gewichtsausgleichsvorrichtung |
JP5952526B2 (ja) * | 2011-02-04 | 2016-07-13 | 株式会社ダイヘン | ワーク搬送システム |
CN102299050A (zh) * | 2011-08-01 | 2011-12-28 | 上海宏力半导体制造有限公司 | 一种晶圆位置探测装置 |
KR101226746B1 (ko) * | 2012-03-06 | 2013-01-25 | 유정호 | 풉 자동 개폐 장치 |
EP2948980B1 (en) | 2013-01-22 | 2021-08-25 | Brooks Automation, Inc. | Substrate transport |
JP6260109B2 (ja) * | 2013-05-16 | 2018-01-17 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
CN103295946B (zh) * | 2013-06-04 | 2016-08-10 | 上海华力微电子有限公司 | 炉管设备的前开口接口机械标准装置 |
JP6119436B2 (ja) * | 2013-06-04 | 2017-04-26 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
JP2015038944A (ja) * | 2013-08-19 | 2015-02-26 | 株式会社ディスコ | 加工装置 |
JP6455239B2 (ja) * | 2015-03-06 | 2019-01-23 | シンフォニアテクノロジー株式会社 | ドア開閉装置 |
JP6451453B2 (ja) * | 2015-03-31 | 2019-01-16 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
JP6554872B2 (ja) * | 2015-03-31 | 2019-08-07 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
US10515834B2 (en) * | 2015-10-12 | 2019-12-24 | Lam Research Corporation | Multi-station tool with wafer transfer microclimate systems |
WO2017149526A2 (en) | 2016-03-04 | 2017-09-08 | May Patents Ltd. | A method and apparatus for cooperative usage of multiple distance meters |
TWI631644B (zh) * | 2017-07-24 | 2018-08-01 | 億力鑫系統科技股份有限公司 | 連動裝置及具有該連動裝置的處理設備 |
KR101924185B1 (ko) | 2018-06-15 | 2018-11-30 | 주식회사 싸이맥스 | 클램프가 장착된 로드포트모듈 |
US11705358B2 (en) * | 2018-10-29 | 2023-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for automated processing ports |
CN109698157B (zh) * | 2018-12-27 | 2021-08-24 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 晶圆片盒的固定装置 |
TWI705229B (zh) * | 2019-01-14 | 2020-09-21 | 亦立科技有限公司 | 晶圓厚度偵測裝置及其方法 |
CN110217741B (zh) * | 2019-05-07 | 2020-12-25 | 芯导精密(北京)设备有限公司 | 一种开盒机 |
JP7419693B2 (ja) * | 2019-07-22 | 2024-01-23 | Tdk株式会社 | ウエハマッピング装置およびロードポート装置 |
JP7443885B2 (ja) | 2020-03-30 | 2024-03-06 | Tdk株式会社 | マッピング装置およびロードポート装置 |
CN112566435B (zh) * | 2020-11-26 | 2022-04-05 | 上海佳堃自动化科技有限公司 | 一种恒流直驱式led开关电源 |
US20220258363A1 (en) * | 2021-02-12 | 2022-08-18 | Hine Automation, Llc | Devices and Methods for Improved Detection of Anomalous Substrates in Automated Material-Handling Systems |
CN113192872B (zh) * | 2021-04-29 | 2022-05-27 | 长鑫存储技术有限公司 | 晶圆盒、晶圆传送系统及晶圆传送方法 |
KR102372513B1 (ko) | 2021-05-10 | 2022-03-10 | 주식회사 위존 | Fims 시스템 |
KR102372514B1 (ko) | 2021-05-10 | 2022-03-10 | 주식회사 위존 | Fims 시스템의 풉 고정장치 |
TWI774407B (zh) * | 2021-06-03 | 2022-08-11 | 鴻勁精密股份有限公司 | 門具機構、作業裝置及作業機 |
CN116338264B (zh) * | 2023-05-06 | 2024-01-19 | 苏州光宝科技股份有限公司 | 一种电池测试防爆箱 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4815912A (en) * | 1984-12-24 | 1989-03-28 | Asyst Technologies, Inc. | Box door actuated retainer |
JPH07115773B2 (ja) | 1986-01-29 | 1995-12-13 | 株式会社ニコン | 基板搬送装置 |
US4762228A (en) | 1986-02-10 | 1988-08-09 | Amaray International Corporation | Video tape reel box with self opening top |
US4895357A (en) * | 1989-01-31 | 1990-01-23 | Eastman Kodak Company | Lighttight film-delivery box and actuator apparatus therefor |
US5382806A (en) | 1991-05-07 | 1995-01-17 | Kensington Laboratories, Inc. | Specimen carrier platform and scanning assembly |
US5443348A (en) * | 1993-07-16 | 1995-08-22 | Semiconductor Systems, Inc. | Cassette input/output unit for semiconductor processing system |
JPH0732286A (ja) * | 1993-07-20 | 1995-02-03 | Tokico Ltd | 工業用ロボット |
JPH07153818A (ja) | 1993-11-30 | 1995-06-16 | Daihen Corp | 半導体ウエハ認識装置 |
DE59611078D1 (de) | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
US5810537A (en) * | 1995-10-18 | 1998-09-22 | Bye/Oasis Engineering Inc. | Isolation chamber transfer apparatus |
JPH09186217A (ja) * | 1996-01-05 | 1997-07-15 | Canon Inc | ウエハ搬入搬出装置 |
US5870488A (en) | 1996-05-07 | 1999-02-09 | Fortrend Engineering Corporation | Method and apparatus for prealigning wafers in a wafer sorting system |
US5944475A (en) * | 1996-10-11 | 1999-08-31 | Asyst Technologies, Inc. | Rotated, orthogonal load compatible front-opening interface |
US5951770A (en) * | 1997-06-04 | 1999-09-14 | Applied Materials, Inc. | Carousel wafer transfer system |
US6321680B2 (en) * | 1997-08-11 | 2001-11-27 | Torrex Equipment Corporation | Vertical plasma enhanced process apparatus and method |
JPH1187460A (ja) * | 1997-09-09 | 1999-03-30 | Dainippon Screen Mfg Co Ltd | 基板収納容器供給装置 |
WO1999028952A2 (en) * | 1997-11-28 | 1999-06-10 | Fortrend Engineering Corporation | Wafer-mapping load port interface |
US6082951A (en) * | 1998-01-23 | 2000-07-04 | Applied Materials, Inc. | Wafer cassette load station |
JPH11354602A (ja) * | 1998-06-03 | 1999-12-24 | Mecs Corp | ポッドオープナーの蓋ラッチ装置 |
US6030208A (en) * | 1998-06-09 | 2000-02-29 | Semitool, Inc. | Thermal processor |
JPH11354622A (ja) * | 1998-06-12 | 1999-12-24 | Matsushita Electric Ind Co Ltd | カセットボックス扉開閉装置及びカセットボックス扉開閉方法 |
JP2000016583A (ja) * | 1998-07-03 | 2000-01-18 | Shinko Electric Co Ltd | 半導体ウエハー搬送容器装着装置 |
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
US6281516B1 (en) * | 1998-07-13 | 2001-08-28 | Newport Corporation | FIMS transport box load interface |
US6502869B1 (en) | 1998-07-14 | 2003-01-07 | Asyst Technologies, Inc. | Pod door to port door retention system |
US6188323B1 (en) | 1998-10-15 | 2001-02-13 | Asyst Technologies, Inc. | Wafer mapping system |
JP4310556B2 (ja) * | 1998-10-23 | 2009-08-12 | ローツェ株式会社 | ウエハ搬送装置に於けるウエハ認識装置 |
JP3965809B2 (ja) * | 1998-12-01 | 2007-08-29 | 神鋼電機株式会社 | ウェハキャリア用蓋体の着脱移動装置、及び被移動体の水平移動装置 |
TW501194B (en) * | 2000-08-23 | 2002-09-01 | Tokyo Electron Ltd | Processing system for object to be processed |
-
2000
- 2000-07-10 US US09/612,757 patent/US6501070B1/en not_active Expired - Lifetime
-
2001
- 2001-07-10 EP EP01958901A patent/EP1356500B1/en not_active Expired - Lifetime
- 2001-07-10 AU AU2001280508A patent/AU2001280508A1/en not_active Abandoned
- 2001-07-10 WO PCT/US2001/021804 patent/WO2002005328A2/en active Search and Examination
- 2001-07-10 JP JP2002509093A patent/JP2004509454A/ja active Pending
- 2001-07-10 KR KR1020037000304A patent/KR101163216B1/ko active IP Right Grant
- 2001-07-10 AT AT01958901T patent/ATE381115T1/de not_active IP Right Cessation
- 2001-07-10 CN CNB018147496A patent/CN1249775C/zh not_active Expired - Lifetime
- 2001-07-10 DE DE60131895T patent/DE60131895T2/de not_active Expired - Lifetime
-
2002
- 2002-12-24 US US10/328,853 patent/US6815661B2/en not_active Expired - Lifetime
- 2002-12-24 US US10/328,749 patent/US6784418B2/en not_active Expired - Lifetime
- 2002-12-30 US US10/335,134 patent/US6765222B2/en not_active Expired - Lifetime
-
2004
- 2004-04-30 HK HK04103060A patent/HK1060215A1/xx not_active IP Right Cessation
- 2004-07-20 US US10/895,484 patent/US7102124B2/en not_active Expired - Lifetime
-
2011
- 2011-08-01 JP JP2011168795A patent/JP6109469B2/ja not_active Expired - Lifetime
-
2014
- 2014-02-10 JP JP2014023758A patent/JP6170843B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1249775C (zh) | 2006-04-05 |
ATE381115T1 (de) | 2007-12-15 |
US20030173511A1 (en) | 2003-09-18 |
KR20030031115A (ko) | 2003-04-18 |
AU2001280508A1 (en) | 2002-01-21 |
DE60131895T2 (de) | 2008-11-27 |
JP2014123759A (ja) | 2014-07-03 |
US6501070B1 (en) | 2002-12-31 |
EP1356500B1 (en) | 2007-12-12 |
WO2002005328A2 (en) | 2002-01-17 |
US20030173510A1 (en) | 2003-09-18 |
US20040256547A1 (en) | 2004-12-23 |
KR101163216B1 (ko) | 2012-07-06 |
US6784418B2 (en) | 2004-08-31 |
JP6109469B2 (ja) | 2017-04-05 |
JP2012009876A (ja) | 2012-01-12 |
WO2002005328A3 (en) | 2003-08-28 |
EP1356500A2 (en) | 2003-10-29 |
US6815661B2 (en) | 2004-11-09 |
JP2004509454A (ja) | 2004-03-25 |
DE60131895D1 (de) | 2008-01-24 |
US7102124B2 (en) | 2006-09-05 |
JP6170843B2 (ja) | 2017-07-26 |
US20030173512A1 (en) | 2003-09-18 |
CN1465091A (zh) | 2003-12-31 |
US6765222B2 (en) | 2004-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1060215A1 (en) | Pod load interface equipment adapted for implementation in a front-opening interface mechanical standard (films) system | |
US5676235A (en) | Linear pallet stop | |
WO2001038123B1 (en) | Apparatus including eddy current braking system | |
KR20190041416A (ko) | 물품 반송 설비 | |
CN110053069A (zh) | 一种多功能机器人吸盘架 | |
CN105575862A (zh) | 一种foup装载门装置 | |
TW331048B (en) | Beam diverting shutter for a laser beam | |
JP2000177580A (ja) | プラットホームドア装置 | |
IT1265297B1 (it) | Complesso di macchine per l'intasamento del pietrisco sotto un binario | |
CN216271912U (zh) | 移料装置 | |
FI971394A (fi) | Jäätelö-sandwich-keräilylaite | |
CN110902355A (zh) | X型道岔式智能切换平台 | |
GB2280883A (en) | Device for preventing swinging of a hung load | |
US3950893A (en) | Control apparatus for hermetically closing an opening in a wall | |
WO2000053849A8 (en) | Guideway transfer switch | |
AU2003299332A1 (en) | Spring switch for a monorail guide circuit | |
US4295146A (en) | Device for moving automatic drawing machine tools | |
CN207420319U (zh) | 一种用于铁路轨边设备的保护箱平移门 | |
CN219799480U (zh) | 一种样本架传输用轨道机构及全自动化学发光免疫分析仪 | |
SE9704023L (sv) | Transportanordning | |
CN215100400U (zh) | 一种调整装置 | |
TW326023B (en) | Chip transport device | |
KR970007123B1 (ko) | 공작물 반송장치 | |
JP3286568B2 (ja) | 直線運動機構 | |
US20200397007A1 (en) | Device for depositing dough |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120710 |