JP6260109B2 - ロードポート装置 - Google Patents
ロードポート装置 Download PDFInfo
- Publication number
- JP6260109B2 JP6260109B2 JP2013103767A JP2013103767A JP6260109B2 JP 6260109 B2 JP6260109 B2 JP 6260109B2 JP 2013103767 A JP2013103767 A JP 2013103767A JP 2013103767 A JP2013103767 A JP 2013103767A JP 6260109 B2 JP6260109 B2 JP 6260109B2
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- JP
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- Prior art keywords
- door
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- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007246 mechanism Effects 0.000 claims description 47
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 7
- 239000002245 particle Substances 0.000 description 20
- 230000003028 elevating effect Effects 0.000 description 10
- 230000008859 change Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Description
12…ドア保持部材
13…往復移動手段
14,19…ガイド(案内手段)
15…ドア昇降軸(主軸)
17…駆動手段
30…フープ(収納容器)
31…ドア
32a…取付面
50…締付け機構
130…リンク機構
131,232…主動リンク
131d…リンクの一端
131e…リンクの他端
132…従動リンク
132a…リンクの他端
132b…リンクの一端
133…駆動ブロック(駆動部材)
134…従動ブロック
190…第2案内部
191…第1案内部
230…平行リンク機構(リンク機構)
231…リンク
231a…リンクの一端
231b…リンクの他端
Claims (4)
- 複数の半導体ウェーハを収容可能な収納容器を支持し、その収納容器のドアを第1方向から当該第1方向と異なる第2方向へと相互に移動させることで開閉するロードポート装置において、
前記収納容器のドアを保持するドア保持部材と、
このドア保持部材に一端が回動可能に連結された主動リンクを有するリンク機構と、
第1方向から第2方向に屈曲して延在し、前記主動リンクの一端を案内する案内手段と、
前記主動リンクの他端が回動可能に連結される駆動部材を少なくとも1つ有し、前記ドア保持部材を往復移動可能とする往復移動手段と、
第2方向に延在し、その延在方向に前記駆動部材を移動させるための主軸と、
前記駆動部材を前記主軸に沿って駆動させる駆動手段と、を備え、
前記リンク機構は、前記主動リンクの他端が第2方向へ移動している状態で、前記主動リンクの一端が前記案内手段に沿って第1方向から第2方向または第2方向から第1方向へ移動することを許容するように構成されるとともに、
前記往復移動手段は、前記駆動部材と離間して前記主軸によって第2方向に移動自在に支持された従動部材をさらに有し、
前記リンク機構は、一端が前記主動リンクに回動可能に連結され、他端が前記従動部材に回動可能に連結された従動リンクをさらに有し、
前記ドア保持部材は、前記従動部材に第1方向へ移動可能に支持されていることを特徴とするロードポート装置。 - 前記リンク機構及び案内手段は、前記ドアの閉止に向けて前記主動リンクの他端が第2方向に移動しつつ、一端が第1方向に移動する際にトグル作用を発揮する締付け機構を構成するものであることを特徴とする請求項1に記載のロードポート装置。
- 前記第1方向が、収納容器におけるドアの取付面にほぼ直交する方向であることを特徴
とする請求項2記載のロードポート装置。 - 一面に前記案内手段及び前記主軸が固定された板状のベース部材をさらに備え、
このベース部材において、第2方向に延在し、前記ドア保持部材が挿通する部材挿通開口が形成されており、
前記ドア保持部材は、この部材挿通開口を介して前記ベース部材の一面側から他面側に延びて、前記一面側で前記主動リンクの一端に連結されるとともに前記他面側でドアを保持することを特徴とする請求項3記載のロードポート装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013103767A JP6260109B2 (ja) | 2013-05-16 | 2013-05-16 | ロードポート装置 |
TW103100808A TWI609449B (zh) | 2013-05-16 | 2014-01-09 | Loading device |
KR1020140007012A KR102150915B1 (ko) | 2013-05-16 | 2014-01-21 | 로드 포트 장치 |
CN201410030705.8A CN104167382B (zh) | 2013-05-16 | 2014-01-22 | 装载端口装置 |
EP20140157765 EP2804206A1 (en) | 2013-05-16 | 2014-03-05 | Load port device |
US14/199,051 US9685359B2 (en) | 2013-05-16 | 2014-03-06 | Load port device |
HK15104617.8A HK1204146A1 (en) | 2013-05-16 | 2015-05-15 | Load port device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013103767A JP6260109B2 (ja) | 2013-05-16 | 2013-05-16 | ロードポート装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014225547A JP2014225547A (ja) | 2014-12-04 |
JP6260109B2 true JP6260109B2 (ja) | 2018-01-17 |
Family
ID=50230943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013103767A Active JP6260109B2 (ja) | 2013-05-16 | 2013-05-16 | ロードポート装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9685359B2 (ja) |
EP (1) | EP2804206A1 (ja) |
JP (1) | JP6260109B2 (ja) |
KR (1) | KR102150915B1 (ja) |
CN (1) | CN104167382B (ja) |
HK (1) | HK1204146A1 (ja) |
TW (1) | TWI609449B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6226190B2 (ja) * | 2014-02-20 | 2017-11-08 | Tdk株式会社 | パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置 |
CN104681471B (zh) * | 2015-03-12 | 2017-09-15 | 京东方科技集团股份有限公司 | 湿法刻蚀设备 |
JP6687840B2 (ja) * | 2016-03-29 | 2020-04-28 | シンフォニアテクノロジー株式会社 | ロードポート |
JP6882656B2 (ja) * | 2016-07-08 | 2021-06-02 | シンフォニアテクノロジー株式会社 | ロードポート及びロードポートを備える基板搬送システム |
CN106516748B (zh) * | 2016-12-14 | 2019-01-08 | 南京熊猫电子股份有限公司 | 一种卡匣辅助支撑装置控制方法 |
CN108538692B (zh) * | 2017-03-02 | 2020-06-19 | 北京北方华创微电子装备有限公司 | 升降门装置和晶片传输系统 |
CN109755164A (zh) * | 2017-11-07 | 2019-05-14 | 富士迈半导体精密工业(上海)有限公司 | 晶圆装卸及充气系统 |
JP6856692B2 (ja) * | 2019-03-28 | 2021-04-07 | 平田機工株式会社 | ロードポート |
CN114121745B (zh) * | 2021-11-26 | 2022-10-11 | 上海果纳半导体技术有限公司 | 一种用于晶圆装载盒门体的摆放系统 |
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-
2013
- 2013-05-16 JP JP2013103767A patent/JP6260109B2/ja active Active
-
2014
- 2014-01-09 TW TW103100808A patent/TWI609449B/zh active
- 2014-01-21 KR KR1020140007012A patent/KR102150915B1/ko active IP Right Grant
- 2014-01-22 CN CN201410030705.8A patent/CN104167382B/zh active Active
- 2014-03-05 EP EP20140157765 patent/EP2804206A1/en not_active Withdrawn
- 2014-03-06 US US14/199,051 patent/US9685359B2/en active Active
-
2015
- 2015-05-15 HK HK15104617.8A patent/HK1204146A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN104167382A (zh) | 2014-11-26 |
EP2804206A1 (en) | 2014-11-19 |
TWI609449B (zh) | 2017-12-21 |
US9685359B2 (en) | 2017-06-20 |
KR20140135594A (ko) | 2014-11-26 |
JP2014225547A (ja) | 2014-12-04 |
CN104167382B (zh) | 2018-08-07 |
HK1204146A1 (en) | 2015-11-06 |
US20140338288A1 (en) | 2014-11-20 |
TW201445662A (zh) | 2014-12-01 |
KR102150915B1 (ko) | 2020-09-02 |
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