US20080041758A1 - Wafer carrier - Google Patents
Wafer carrier Download PDFInfo
- Publication number
- US20080041758A1 US20080041758A1 US11/504,594 US50459406A US2008041758A1 US 20080041758 A1 US20080041758 A1 US 20080041758A1 US 50459406 A US50459406 A US 50459406A US 2008041758 A1 US2008041758 A1 US 2008041758A1
- Authority
- US
- United States
- Prior art keywords
- wafer carrier
- container
- wall
- wafer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
Definitions
- the invention relates to a wafer carrier, and in particular to a wafer carrier having a top plate or a coated layer within the carrier preventing release of organic materials.
- Semiconductor manufacturing includes many processes such as oxidation, diffusion, lithography, etching, CVD, and others. Each product wafer produced by CMOS process has many critical layers functioning to avoid yield loss. Currently, in order to prevent external contamination, wafers are put into wafer carriers for transportation during the semiconductor processes.
- FIG. 1 is a diagram showing a conventional wafer carrier.
- a conventional wafer carrier 10 comprises a container 11 to hold two wafers 121 , 122 .
- the wafers 121 , 122 are arranged inside the wafer carrier 10 , protected from external contamination.
- the container 11 comprising poly carbonate (PC)
- PC poly carbonate
- the invention provides a wafer carrier.
- the wafer carrier includes a container and a plate, wherein the container carries at least one wafer, and the plate is disposed in the vicinity of the upper portion of the container.
- FIG. 1 depicts a conventional wafer carrier
- FIG. 2 depicts an embodiment of a wafer carrier
- FIG. 3A depicts another embodiment of the wafer carrier
- FIG. 3B is a cross-section along A-A line in FIG. 3A .
- FIG. 2 is a diagram of an embodiment showing a wafer carrier.
- the wafer carrier 20 comprises a container 22 holding two wafers 221 , 222 and a plate 21 , having an inner wall (not shown).
- the wafer carrier 20 is a front opening unified pod (FOUP).
- the container 22 is for carrying twenty-five wafers, to execute semiconductor processes and usually holds product wafers 221 , 222 . Since the container 22 comprises poly carbonate (PC), the container 22 may release organic material or powder which may interact with the product wafers, inducing serious yield loss of the product wafers.
- PC poly carbonate
- the top wafer 221 receives more debris than other wafers. This circumstance can result in serious yield loss of the top wafer 221 , particularly in some critical layers of the wafer such as gate-oxide, poly layer deposition, etc.
- the plate 21 is disposed in the vicinity of the upper portion of the container 22 to protect the product wafers from contamination by the organic materials of the container 22 , especially the top wafer 221 .
- the plate 21 is mounted in the upper portion of the container 22 .
- the plate 21 is longer than the diameter of the wafer to fully cover the top wafer 221 .
- the plate 21 may comprise quartz, PVDF, silicon, ceramic, or any other suitable materials not releasing organic materials.
- FIG. 3A is a diagram of another embodiment of a wafer carrier.
- a wafer carrier 30 comprises a container 11 ′ holding two wafers 321 , 322 , having an inner wall (not shown).
- FIG. 3B is a cross-section along A-A line in FIG. 3A .
- the container 11 ′ is a two-layered structure and comprises an inner wall 31 and a layer 32 .
- the inner wall 31 of the container 11 ′ is made of poly carbonate, the inner wall 31 may release organic materials, damaging the product wafers 321 , 322 .
- the layer 32 on the inner wall 31 the organic debris from the inner wall 31 is properly controlled.
- the layer 32 is coated at least on the inner wall 31 , at the upper portion of the container 11 ′, preferably the layer 32 is fully coated on the inner wall 31 of the interior of the container 11 ′.
- the layer 32 is a TiO 2 film.
- OH. Hydroxyl Radical
- the TiO 2 layer is coated by chemical vapor deposition process or sputter process.
- the inner wall 31 is fully covered by the layer 32 , whereby organic materials of the inner wall 31 can be decomposed, avoiding yield loss of the product wafers.
- the container 11 ′ fully protects the product wafers from top to bottom.
- the invention provides a wafer carrier having a plate on the inner top portion of the carrier or an inner layer coated within the carrier preventing organic material release therefrom. Additionally, through the arrangement of the wafer carrier of the invention, organic contamination is effectively restrained so that the production yield is improved during all kinds of processes.
Abstract
A wafer carrier. The wafer carrier includes a container and a plate, wherein the container has an inner wall and the plate is disposed in the vicinity of the inner wall of an upper portion of the container.
Description
- The invention relates to a wafer carrier, and in particular to a wafer carrier having a top plate or a coated layer within the carrier preventing release of organic materials.
- Semiconductor manufacturing includes many processes such as oxidation, diffusion, lithography, etching, CVD, and others. Each product wafer produced by CMOS process has many critical layers functioning to avoid yield loss. Currently, in order to prevent external contamination, wafers are put into wafer carriers for transportation during the semiconductor processes.
-
FIG. 1 is a diagram showing a conventional wafer carrier. As shown, aconventional wafer carrier 10 comprises acontainer 11 to hold twowafers wafers wafer carrier 10, protected from external contamination. However, thecontainer 11, comprising poly carbonate (PC), may release organic material or powder to chemically interact with the product wafers, inducing serious yield loss within some critical layers such as gate-oxide layers, poly layers, and others. - To ensure the product yield of the product wafers, it is important to develop a wafer carrier generating no harmful organic materials.
- Accordingly, the invention provides a wafer carrier. The wafer carrier includes a container and a plate, wherein the container carries at least one wafer, and the plate is disposed in the vicinity of the upper portion of the container.
- The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
-
FIG. 1 depicts a conventional wafer carrier; -
FIG. 2 depicts an embodiment of a wafer carrier; -
FIG. 3A depicts another embodiment of the wafer carrier; and -
FIG. 3B is a cross-section along A-A line inFIG. 3A . - A wafer carrier is described in greater detail in the following.
FIG. 2 is a diagram of an embodiment showing a wafer carrier. In this embodiment, thewafer carrier 20 comprises acontainer 22 holding twowafers plate 21, having an inner wall (not shown). Thewafer carrier 20 is a front opening unified pod (FOUP). Moreover, thecontainer 22 is for carrying twenty-five wafers, to execute semiconductor processes and usually holdsproduct wafers container 22 comprises poly carbonate (PC), thecontainer 22 may release organic material or powder which may interact with the product wafers, inducing serious yield loss of the product wafers. Because thewafer 221 is placed in the highest position of thecontainer 22, thetop wafer 221 receives more debris than other wafers. This circumstance can result in serious yield loss of thetop wafer 221, particularly in some critical layers of the wafer such as gate-oxide, poly layer deposition, etc. - Thus, the
plate 21 is disposed in the vicinity of the upper portion of thecontainer 22 to protect the product wafers from contamination by the organic materials of thecontainer 22, especially thetop wafer 221. As shown inFIG. 2 , theplate 21 is mounted in the upper portion of thecontainer 22. Preferably, theplate 21 is longer than the diameter of the wafer to fully cover thetop wafer 221. Furthermore, theplate 21 may comprise quartz, PVDF, silicon, ceramic, or any other suitable materials not releasing organic materials. -
FIG. 3A is a diagram of another embodiment of a wafer carrier. Referring toFIGS. 3A , awafer carrier 30 comprises acontainer 11′ holding twowafers FIG. 3B is a cross-section along A-A line inFIG. 3A . Referring toFIG. 3B , thecontainer 11′ is a two-layered structure and comprises aninner wall 31 and alayer 32. As mentioned before, since theinner wall 31 of thecontainer 11′ is made of poly carbonate, theinner wall 31 may release organic materials, damaging the product wafers 321,322. By coating thelayer 32 on theinner wall 31, the organic debris from theinner wall 31 is properly controlled. - Moreover, the
layer 32 is coated at least on theinner wall 31, at the upper portion of thecontainer 11′, preferably thelayer 32 is fully coated on theinner wall 31 of the interior of thecontainer 11′. Additionally, in this embodiment, thelayer 32 is a TiO2 film. When water exists on the surface of TiO2 with sufficient light, Hydroxyl Radical (OH.) can be produced, decomposing organic matter that attaches to TiO2. Preferably, the TiO2 layer is coated by chemical vapor deposition process or sputter process. In other words, theinner wall 31 is fully covered by thelayer 32, whereby organic materials of theinner wall 31 can be decomposed, avoiding yield loss of the product wafers. When fully covered with thelayer 32, thecontainer 11′ fully protects the product wafers from top to bottom. - As previously described, the invention provides a wafer carrier having a plate on the inner top portion of the carrier or an inner layer coated within the carrier preventing organic material release therefrom. Additionally, through the arrangement of the wafer carrier of the invention, organic contamination is effectively restrained so that the production yield is improved during all kinds of processes.
- While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims (20)
1. A wafer carrier, comprising:
a container having an inner wall; and
a plate disposed in the vicinity of the inner wall of an upper portion of the container.
2. The wafer carrier as claimed in claim 1 , wherein the container is a front opening unified pod.
3. The wafer carrier as claimed in claim 2 , wherein the container contains up to twenty-five wafers.
4. The wafer carrier as claimed in claim 2 , wherein the plate comprises quartz.
5. The wafer carrier as claimed in claim 2 , wherein the plate comprises PVDF.
6. The wafer carrier as claimed in claim 2 , wherein the plate comprises silicon.
7. The wafer carrier as claimed in claim 2 , wherein the plate comprises ceramic.
8. The wafer carrier as claimed in claim 1 , wherein the container comprises poly carbonate.
9. A wafer carrier, comprising:
a container having an inner wall; and
a layer coated on at least an upper portion of the inner wall.
10. The wafer carrier as claimed in claim 9 , wherein the layer is a TiO2 film.
11. The wafer carrier as claimed in claim 9 , wherein the container comprises poly carbonate.
12. The wafer carrier as claimed in claim 9 , wherein the container is a front opening unified pod.
13. The wafer carrier as claimed in claim 12 , wherein the container contains up to twenty-five wafers.
14. The wafer carrier as claimed in claim 9 , wherein the layer is coated by chemical vapor deposition process.
15. The wafer carrier as claimed in claim 9 , wherein the layer is coated by sputtering process.
16. A wafer carrier, comprising:
a container, having an inner wall, holding a wafer; and a plate disposed in the container and located between the inner wall and the wafer.
17. The wafer carrier as claimed in claim 16 , wherein the plate comprises quartz.
18. The wafer carrier as claimed in claim 16 , wherein the plate comprises PVDF.
19. The wafer carrier as claimed in claim 16 , wherein the plate comprises silicon.
20. The wafer carrier as claimed in claim 17 , wherein the container comprises poly carbonate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/504,594 US20080041758A1 (en) | 2006-08-16 | 2006-08-16 | Wafer carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/504,594 US20080041758A1 (en) | 2006-08-16 | 2006-08-16 | Wafer carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080041758A1 true US20080041758A1 (en) | 2008-02-21 |
Family
ID=39100360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/504,594 Abandoned US20080041758A1 (en) | 2006-08-16 | 2006-08-16 | Wafer carrier |
Country Status (1)
Country | Link |
---|---|
US (1) | US20080041758A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012151431A2 (en) | 2011-05-03 | 2012-11-08 | Entergris, Inc. | Wafer container with particle shield |
Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1855430A (en) * | 1930-01-29 | 1932-04-26 | T D Wood | Expanding tool |
US1997845A (en) * | 1934-04-25 | 1935-04-16 | Adams Brothers Inc Ltd | Meter coupling |
US2589572A (en) * | 1948-03-08 | 1952-03-18 | Hiawatha James Hedgepeth | Meter base spreader |
US2706613A (en) * | 1951-11-30 | 1955-04-19 | Benjamin F Harris | Device for spreading meter connections |
US2795437A (en) * | 1955-05-17 | 1957-06-11 | Mueller Co | Removable guide and support sleeve for meter nuts |
US2958125A (en) * | 1957-03-25 | 1960-11-01 | Wachs E H Co | Collar setter and puller for pipes of large diameter |
US3414961A (en) * | 1966-05-12 | 1968-12-10 | Reed Mfg Co | Telescoping pipe joint tool |
US3571896A (en) * | 1968-12-03 | 1971-03-23 | Tyler Pipe Ind Inc | Pipe joint make-or-break tool |
US4178668A (en) * | 1978-01-06 | 1979-12-18 | Leroy George | Pipe tool |
US4236290A (en) * | 1979-02-27 | 1980-12-02 | Mcpherson Billie J | Fan puller |
US4598452A (en) * | 1984-07-26 | 1986-07-08 | Super Tool Co., Ltd. | Tool for connecting a pair of pipes through a coupling pipe |
USD288673S (en) * | 1984-05-29 | 1987-03-10 | Precision Meters, Inc. | Water meter |
US4748730A (en) * | 1987-03-09 | 1988-06-07 | George William L | Tool for making up a bell and spigot pipe joint |
US5052721A (en) * | 1989-03-31 | 1991-10-01 | Gorman Jr Philip P | Water meter service coupling |
US5570987A (en) * | 1993-12-14 | 1996-11-05 | W. L. Gore & Associates, Inc. | Semiconductor wafer transport container |
US5788082A (en) * | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
US6029331A (en) * | 1998-02-02 | 2000-02-29 | Simmons; Edward N. | Brake shoe spreader/holder |
US6247599B1 (en) * | 2000-01-14 | 2001-06-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container equipped with metal shield |
US6398032B2 (en) * | 1998-05-05 | 2002-06-04 | Asyst Technologies, Inc. | SMIF pod including independently supported wafer cassette |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
US6536592B1 (en) * | 2000-10-05 | 2003-03-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Transportable container having an indicator |
USD472835S1 (en) * | 2002-06-10 | 2003-04-08 | Arthur A. Hendey | Water meter |
US6701595B2 (en) * | 2001-06-28 | 2004-03-09 | Dennis S. Janovici | Clamp connection and release device |
US6779667B2 (en) * | 2001-08-27 | 2004-08-24 | Entegris, Inc. | Modular carrier for semiconductor wafer disks and similar inventory |
US7073999B2 (en) * | 2002-06-06 | 2006-07-11 | Tokyo Electron Limited | Receiving container body for object to be processed |
US7073667B2 (en) * | 2003-10-24 | 2006-07-11 | Entegris, Inc. | Photochromic substrate container |
US7121414B2 (en) * | 2001-12-28 | 2006-10-17 | Brooks Automation, Inc. | Semiconductor cassette reducer |
-
2006
- 2006-08-16 US US11/504,594 patent/US20080041758A1/en not_active Abandoned
Patent Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1855430A (en) * | 1930-01-29 | 1932-04-26 | T D Wood | Expanding tool |
US1997845A (en) * | 1934-04-25 | 1935-04-16 | Adams Brothers Inc Ltd | Meter coupling |
US2589572A (en) * | 1948-03-08 | 1952-03-18 | Hiawatha James Hedgepeth | Meter base spreader |
US2706613A (en) * | 1951-11-30 | 1955-04-19 | Benjamin F Harris | Device for spreading meter connections |
US2795437A (en) * | 1955-05-17 | 1957-06-11 | Mueller Co | Removable guide and support sleeve for meter nuts |
US2958125A (en) * | 1957-03-25 | 1960-11-01 | Wachs E H Co | Collar setter and puller for pipes of large diameter |
US3414961A (en) * | 1966-05-12 | 1968-12-10 | Reed Mfg Co | Telescoping pipe joint tool |
US3571896A (en) * | 1968-12-03 | 1971-03-23 | Tyler Pipe Ind Inc | Pipe joint make-or-break tool |
US4178668A (en) * | 1978-01-06 | 1979-12-18 | Leroy George | Pipe tool |
US4236290A (en) * | 1979-02-27 | 1980-12-02 | Mcpherson Billie J | Fan puller |
USD288673S (en) * | 1984-05-29 | 1987-03-10 | Precision Meters, Inc. | Water meter |
US4598452A (en) * | 1984-07-26 | 1986-07-08 | Super Tool Co., Ltd. | Tool for connecting a pair of pipes through a coupling pipe |
US4748730A (en) * | 1987-03-09 | 1988-06-07 | George William L | Tool for making up a bell and spigot pipe joint |
US5052721A (en) * | 1989-03-31 | 1991-10-01 | Gorman Jr Philip P | Water meter service coupling |
US5570987A (en) * | 1993-12-14 | 1996-11-05 | W. L. Gore & Associates, Inc. | Semiconductor wafer transport container |
US5788082A (en) * | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
US6029331A (en) * | 1998-02-02 | 2000-02-29 | Simmons; Edward N. | Brake shoe spreader/holder |
US6398032B2 (en) * | 1998-05-05 | 2002-06-04 | Asyst Technologies, Inc. | SMIF pod including independently supported wafer cassette |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
US6247599B1 (en) * | 2000-01-14 | 2001-06-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container equipped with metal shield |
US6536592B1 (en) * | 2000-10-05 | 2003-03-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Transportable container having an indicator |
US6701595B2 (en) * | 2001-06-28 | 2004-03-09 | Dennis S. Janovici | Clamp connection and release device |
US6779667B2 (en) * | 2001-08-27 | 2004-08-24 | Entegris, Inc. | Modular carrier for semiconductor wafer disks and similar inventory |
US7121414B2 (en) * | 2001-12-28 | 2006-10-17 | Brooks Automation, Inc. | Semiconductor cassette reducer |
US7073999B2 (en) * | 2002-06-06 | 2006-07-11 | Tokyo Electron Limited | Receiving container body for object to be processed |
USD472835S1 (en) * | 2002-06-10 | 2003-04-08 | Arthur A. Hendey | Water meter |
US7073667B2 (en) * | 2003-10-24 | 2006-07-11 | Entegris, Inc. | Photochromic substrate container |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012151431A2 (en) | 2011-05-03 | 2012-11-08 | Entergris, Inc. | Wafer container with particle shield |
EP2705528A2 (en) * | 2011-05-03 | 2014-03-12 | Entegris, Inc. | Wafer container with particle shield |
CN103765569A (en) * | 2011-05-03 | 2014-04-30 | 恩特格里公司 | Wafer container with particle shield |
JP2014513442A (en) * | 2011-05-03 | 2014-05-29 | インテグリス・インコーポレーテッド | Wafer container with particle shield |
EP2705528A4 (en) * | 2011-05-03 | 2014-11-26 | Entegris Inc | Wafer container with particle shield |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TAIW Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, YEN-FEI;CHOU, HUI-WEN;KU, WEN-YU;AND OTHERS;REEL/FRAME:018206/0413;SIGNING DATES FROM 20060710 TO 20060717 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |