HK1051702A1 - Flame retardant phosphorus element-containing epoxy resin compositions - Google Patents

Flame retardant phosphorus element-containing epoxy resin compositions

Info

Publication number
HK1051702A1
HK1051702A1 HK03103889A HK03103889A HK1051702A1 HK 1051702 A1 HK1051702 A1 HK 1051702A1 HK 03103889 A HK03103889 A HK 03103889A HK 03103889 A HK03103889 A HK 03103889A HK 1051702 A1 HK1051702 A1 HK 1051702A1
Authority
HK
Hong Kong
Prior art keywords
epoxy resin
phosphorus element
halogenated
containing epoxy
flame retardant
Prior art date
Application number
HK03103889A
Other languages
English (en)
Inventor
Joseph Gan
Alan Goodson
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of HK1051702A1 publication Critical patent/HK1051702A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK03103889A 1999-12-13 2003-05-31 Flame retardant phosphorus element-containing epoxy resin compositions HK1051702A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17042199P 1999-12-13 1999-12-13
PCT/US2000/033647 WO2001042359A1 (en) 1999-12-13 2000-12-11 Flame retardant phosphorus element-containing epoxy resin compositions

Publications (1)

Publication Number Publication Date
HK1051702A1 true HK1051702A1 (en) 2003-08-15

Family

ID=22619787

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03103889A HK1051702A1 (en) 1999-12-13 2003-05-31 Flame retardant phosphorus element-containing epoxy resin compositions

Country Status (11)

Country Link
US (1) US6645631B2 (xx)
EP (1) EP1268665B1 (xx)
JP (2) JP5485487B2 (xx)
KR (1) KR100721697B1 (xx)
CN (1) CN1423678B (xx)
AT (1) ATE308585T1 (xx)
AU (1) AU2089601A (xx)
DE (1) DE60023752T2 (xx)
HK (1) HK1051702A1 (xx)
TW (1) TWI261059B (xx)
WO (1) WO2001042359A1 (xx)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4972247B2 (ja) * 1999-12-28 2012-07-11 日立化成工業株式会社 難燃性熱硬化樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板
KR100538176B1 (ko) * 2000-07-18 2005-12-21 교세라 케미카르 가부시키가이샤 할로겐 프리 난연성 에폭시수지조성물, 할로겐 프리빌드업 다층판용 난연성 에폭시수지조성물, 프리프레그,동장 적층판, 프린트배선판, 동박부착 수지필름,캐리어부착 수지필름, 빌드업형 적층판 및 빌드업형 다층판
EP1270632A4 (en) * 2000-09-12 2004-10-27 Mitsui Chemicals Inc PHOSPHORUS-CONTAINING EPOXY RESIN, FLAME-RETARDANT AND HIGH-HEAT-RESISTANT EPOXY RESIN COMPOSITION OF THIS RESIN AND LAMINATE
JP2003040968A (ja) * 2001-07-26 2003-02-13 Toto Kasei Co Ltd 新規含燐エポキシ樹脂及び該エポキシ樹脂を含有する難燃性樹脂組成物
US20060099458A1 (en) * 2001-02-15 2006-05-11 Hanson Mark V 1, 4-Hydroquinone functionalized phosphinates and phosphonates
US6733698B2 (en) 2001-02-15 2004-05-11 Pabu Services, Inc. Mixture of mono-, bis- and tris-(hydroxyaryl) phosphine oxides useful to make polyglycidyl ethers or in epoxy compositions
US6887950B2 (en) 2001-02-15 2005-05-03 Pabu Services, Inc. Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
US6641923B2 (en) * 2001-07-31 2003-11-04 Ppg Industries Ohio, Inc. Weldable coating compositions having improved intercoat adhesion
CN1659217A (zh) * 2002-05-30 2005-08-24 陶氏环球技术公司 无卤阻燃热塑性树脂组合物
JP2004051938A (ja) * 2002-05-30 2004-02-19 Sumitomo Chem Co Ltd エポキシ樹脂組成物およびその用途
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
KR20040072440A (ko) * 2003-02-12 2004-08-18 주식회사 금강고려화학 환경친화형 반도체소자 봉지용 에폭시수지 조성물
CN1788053A (zh) * 2003-04-17 2006-06-14 互应化学工业株式会社 阻燃环氧树脂组合物、包含该组合物的预浸料、层压体和印制线路板
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
US6887574B2 (en) * 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
DE602004014769D1 (de) * 2003-06-12 2008-08-14 Fuji Electric Holdings Reaktive flammschutzmittel und flammgeschützte harzprodukte
KR100569759B1 (ko) * 2004-01-16 2006-04-11 주식회사 엘지화학 비할로겐계 난연성 수지 조성물, 이를 이용한 프리프레그및 적층판
EP1716201B1 (en) * 2004-02-18 2016-09-07 Huntsman Advanced Materials (Switzerland) GmbH Fire retardant compositions using siloxanes
WO2005082982A1 (ja) * 2004-02-27 2005-09-09 Toray Industries, Inc. 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、一体化成形品、繊維強化複合材料板、および電気・電子機器用筐体
WO2005118604A1 (en) * 2004-05-28 2005-12-15 Dow Global Technologies Inc. Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
TWI374137B (en) * 2004-09-28 2012-10-11 Huntsman Adv Mat Switzerland Organic compounds
TW200626659A (en) * 2004-11-05 2006-08-01 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same
DE602005017509D1 (de) * 2004-11-26 2009-12-17 Lg Chemical Ltd Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
KR100648463B1 (ko) * 2005-09-26 2006-11-27 삼성전기주식회사 난연성 수지 조성물
JP5502326B2 (ja) * 2005-12-22 2014-05-28 ダウ グローバル テクノロジーズ エルエルシー 硬化性エポキシ樹脂組成物およびそれから作られた積層体
TW200732448A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen adhesive containing polyphosphate compounds
TW200732412A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen composition having phosphor-containing epoxy resin
US7687722B2 (en) * 2006-10-03 2010-03-30 Endicott Interconnect Technologies, Inc. Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
KR100781582B1 (ko) * 2006-10-11 2007-12-05 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물 및 이를 이용한인쇄회로기판
US8840967B2 (en) 2006-10-11 2014-09-23 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing printed circuit board including flame retardant insulation layer
TWI342322B (en) * 2007-03-28 2011-05-21 Grand Tek Advance Material Science Co Ltd Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad laminate
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
KR101026531B1 (ko) 2007-08-30 2011-04-01 한국화학연구원 할로겐프리형 난연성 접착제 조성물
JP2010540724A (ja) * 2007-09-28 2010-12-24 ダウ グローバル テクノロジーズ インコーポレイティド エポキシ樹脂組成
TWI388621B (zh) * 2008-01-04 2013-03-11 Iteq Corp 樹脂組成物及其應用
KR101512623B1 (ko) 2008-01-23 2015-04-21 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 경화제 조성물, 및 이러한 경화제 조성물을 함유하는 에폭시 수지 조성물
JP5438035B2 (ja) * 2008-02-21 2014-03-12 ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー 高ｔｇ用途のためのハロゲンを含まないベンゾキサジンをベースとする硬化型組成物
EP2410014B1 (en) * 2008-02-26 2013-09-04 Dow Global Technologies LLC Brominated polymers as flame retardant additives and polymer systems containing same
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
TWI381017B (zh) * 2008-06-09 2013-01-01 Taiwan Union Technology Corp Composition and Manufacturing Method of Halogen - free Printed Circuit Board with Low Dielectric Loss
CN101307170B (zh) * 2008-07-10 2011-08-10 天津市凯华绝缘材料有限公司 一种阻燃含磷环氧粉末组合物
JP2012507599A (ja) * 2008-10-29 2012-03-29 アイシーエル−アイピー アメリカ インコーポレイテッド リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板
CN101418205B (zh) * 2008-12-10 2012-05-09 华烁科技股份有限公司 一种无卤阻燃胶粘剂及其在半固化片和多层印制板方面的应用
SG172874A1 (en) * 2009-01-06 2011-08-29 Dow Global Technologies Llc Metallic compounds in non-brominated flame retardant epoxy resins
JP5136573B2 (ja) * 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
US7842401B2 (en) * 2009-03-24 2010-11-30 Iteq Corporation Halogen-free varnish and prepreg thereof
JP5720118B2 (ja) * 2009-06-01 2015-05-20 三菱レイヨン株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
TWI422620B (zh) * 2009-06-18 2014-01-11 Kangnam Chemical Co Ltd 製造阻燃及經磷改質之硬化劑的方法
GB2472423B (en) * 2009-08-05 2012-01-11 Gurit Uk Ltd Fire-retardant composite materials
CN101643570B (zh) * 2009-08-24 2011-08-10 广东生益科技股份有限公司 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板
CN101684191B (zh) * 2009-08-27 2012-03-07 广东生益科技股份有限公司 无卤高频树脂组合物及用其制成的预浸料与层压板
CN101691449B (zh) * 2009-09-04 2011-05-18 广东生益科技股份有限公司 提高苯氧基磷腈化合物阻燃效率的方法及其制成的预浸料、层压板与印制电路用层压板
KR101091305B1 (ko) 2009-10-09 2011-12-07 유니플러스 일렉트로닉스 컴퍼니 리미티드 추가 절연층들을 쌓아 올리기 위한 고열전도도 및 저손실계수를 갖는 점착성 바니시를 마련하는 방법
US8088490B2 (en) * 2009-10-25 2012-01-03 Iteq Corporation Varnish, prepreg, and substrate thereof
US8980376B2 (en) 2009-11-06 2015-03-17 Dow Global Technologies Llc Storage stable epoxy resin compositions for electrical laminates
EP2507283B1 (en) 2009-12-02 2013-10-23 Dow Global Technologies LLC Epoxy resin compositions
CN102648247B (zh) 2009-12-02 2015-10-14 陶氏环球技术有限责任公司 涂料组合物
JP5922582B2 (ja) 2009-12-02 2016-05-24 ブルー キューブ アイピー エルエルシー コンポジット組成物
SG182286A1 (en) 2009-12-30 2012-08-30 Dow Global Technologies Llc Thermosetting monomers and compositions containing phosphorus and cyanato groups
CN102858786A (zh) 2010-01-29 2013-01-02 陶氏环球技术有限责任公司 包含磷和氰氧基基团的热固性单体以及组合物
WO2011094004A2 (en) 2010-01-29 2011-08-04 Dow Global Technologies Llc Compositions having phosphorus-containing compounds
CN102834429B (zh) * 2010-02-12 2014-10-22 陶氏环球技术有限责任公司 含磷的环氧树脂
CN102250447B (zh) * 2010-05-21 2014-10-22 台燿科技股份有限公司 无卤素的阻燃性环氧树脂组合物及由其制成的预浸材和印刷电路板
CN101914265B (zh) * 2010-07-24 2012-08-29 日立化成电子材料（广州）有限公司 一种无卤含磷阻燃高频环氧树脂类组合物及其在粘结片和覆铜板中的应用
KR20130133754A (ko) 2010-07-30 2013-12-09 다우 글로벌 테크놀로지스 엘엘씨 경화성 조성물
CN102372903B (zh) * 2010-08-18 2014-04-16 合正科技股份有限公司 无卤无磷热固型树脂组成物
CN101928444A (zh) * 2010-08-20 2010-12-29 广东生益科技股份有限公司 无卤热固性树脂组合物、使用其制作的半固化片及覆金属箔层压板
CN102382420B (zh) * 2010-09-06 2013-01-16 宏昌电子材料股份有限公司 印刷电路覆铜板用高cti环氧树脂组合物
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
TWI418593B (zh) * 2010-11-10 2013-12-11 Iteq Corp 無鹵環氧樹脂組合物及應用該無鹵環氧樹脂組合物所製成之膠片與基板
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
US20120129414A1 (en) * 2010-11-24 2012-05-24 Chung-Hao Chang Thermosetting resin composition and prepreg or laminate using the same
WO2012099713A1 (en) * 2011-01-21 2012-07-26 Dow Global Technologies Llc High performance thermoset useful for electrical laminate, high density interconnect and interconnect substrate applications
US9333454B2 (en) 2011-01-21 2016-05-10 International Business Machines Corporation Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants
JP5552075B2 (ja) * 2011-02-17 2014-07-16 Ｊｆｅケミカル株式会社 熱硬化性樹脂組成物およびその硬化物
CN102134304B (zh) * 2011-03-03 2012-08-29 沈阳化工大学 一种反应型含磷环氧树脂阻燃剂及其制备方法
WO2012151171A1 (en) * 2011-05-02 2012-11-08 Dow Global Technologies Llc Trimethyl borate in epoxy resins
US8900491B2 (en) 2011-05-06 2014-12-02 International Business Machines Corporation Flame retardant filler
US9145488B2 (en) 2011-05-19 2015-09-29 Chemtura Corporation Aluminum phosphorus acid salts as epoxy resin cure inhibitors
DE112012001974B4 (de) * 2011-05-28 2016-03-24 Robert Valentine Kasowski Flammhemmerzusammensetzungen
CN102250383B (zh) * 2011-06-28 2013-02-13 华南理工大学 含苯并噁嗪的无卤阻燃剂及含无卤阻燃剂的聚合物材料
US9186641B2 (en) 2011-08-05 2015-11-17 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
JP5899497B2 (ja) * 2011-08-31 2016-04-06 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、ワニス、プリプレグ、プリプレグの製造方法、金属張積層板、金属張積層板の製造方法、プリント配線板、及びプリント配線板の製造方法
US8741804B2 (en) 2011-10-28 2014-06-03 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field
TWI421297B (zh) * 2011-11-04 2014-01-01 Elite Material Co Ltd Halogen-free resin composition and its application of copper foil substrate and printed circuit board
CN103131131B (zh) * 2011-11-23 2015-07-15 台光电子材料股份有限公司 无卤素树脂组合物及其应用的铜箔基板及印刷电路板
KR101976890B1 (ko) 2011-12-20 2019-05-09 다우 글로벌 테크놀로지스 엘엘씨 경화된 에폭시 수지 복합체의 제조 방법
CN102775730A (zh) * 2012-02-29 2012-11-14 深圳光启创新技术有限公司 低介电常数低损耗的浸润料及其应用
JP6056849B2 (ja) * 2012-03-23 2017-01-11 三菱瓦斯化学株式会社 プリプレグ及び積層板
US8859098B2 (en) 2012-05-18 2014-10-14 Lord Corporation Acrylic adhesion promoters
US9716055B2 (en) 2012-06-13 2017-07-25 International Business Machines Corporation Thermal interface material (TIM) with thermally conductive integrated release layer
WO2014165426A1 (en) * 2013-04-01 2014-10-09 Basf Corporation Flame retardant systems
CN103382242B (zh) * 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
WO2015001764A1 (ja) * 2013-07-04 2015-01-08 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ及び積層板
US20150148450A1 (en) * 2013-11-24 2015-05-28 Iteq Corporation Halogen-free low-expansion resin composition
CN103724945B (zh) * 2013-12-31 2016-09-07 广东生益科技股份有限公司 一种无卤环氧树脂组合物及其用途
CN103897385B (zh) * 2014-03-21 2016-01-20 华南理工大学 一种阻燃扩链尼龙6组合物及其制备方法
CN104002525A (zh) * 2014-04-18 2014-08-27 南通诺德电子有限公司 高TG无卤LOW Dk/Df覆铜板的制作方法
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
KR102375986B1 (ko) * 2015-03-13 2022-03-17 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 옥사졸리돈 고리 함유 에폭시 수지, 그 제조 방법, 에폭시 수지 조성물, 및 경화물
JP6579309B2 (ja) * 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
TWI721024B (zh) * 2015-11-13 2021-03-11 美商Ｉｃｌ Ｉｐ美國股份有限公司 用於熱固性樹脂之活性酯類固化劑化合物、包含彼之阻燃劑組成物、及由其所製成之物件
CN105368001B (zh) * 2015-11-27 2017-11-17 南亚新材料科技股份有限公司 一种无卤环氧树脂组合物和制备方法及其应用
CN107227001B (zh) 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
CN115340737A (zh) 2016-07-25 2022-11-15 伊索拉美国有限公司 改进的sma树脂制剂
ES2901620T3 (es) * 2016-12-14 2022-03-23 Bromine Compounds Ltd Composiciones de retardante de llama epóxido libres de antimonio
CN106700548B (zh) * 2016-12-30 2019-04-30 广东生益科技股份有限公司 一种含有苯并噁嗪树脂组合物的制备方法及由其制成的预浸料和层压板
CN106832778B (zh) * 2017-02-13 2019-04-02 广州仑利奇合成树脂有限公司 一种无卤阻燃环氧体系及其制备方法
CN108192281B (zh) * 2017-12-27 2020-12-15 江西生益科技有限公司 一种无卤热固性树脂组合物及使用它的预浸料、层压板、覆金属箔层压板和印刷电路板
GB2571786B (en) * 2018-03-09 2021-06-02 Gurit Uk Ltd Manufacture of fire-retardant sandwich panels
GB201809830D0 (en) * 2018-06-15 2018-08-01 Hexcel Composties Ltd Epoxy resin formulations
CN109280456A (zh) * 2018-07-28 2019-01-29 南京艾利克斯电子科技有限公司 一种电子元器件用涂层材料及其制备方法
KR102161362B1 (ko) * 2018-12-24 2020-10-05 주식회사 하이플럭스 내화 조성물
WO2020197561A1 (en) * 2019-03-28 2020-10-01 Safran Cabin Inc. Fire retardant epoxy resin
US11884772B2 (en) 2020-08-21 2024-01-30 The University Of Southern Mississippi Phenylphosphine oxide and oxygen stable epoxy polymers and methods of synthesis
CN114685800A (zh) * 2020-12-29 2022-07-01 洛阳尖端技术研究院 含磷超支化多元醇、含磷超支化环氧树脂及其制备方法、组合物及氰酸酯树脂
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
CN116554128A (zh) * 2023-05-08 2023-08-08 四川大学 一种自固化、高模高强的本征阻燃磺胺环氧树脂及其制备方法

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124399B2 (xx) * 1973-03-19 1976-07-23
US4066628A (en) 1976-08-02 1978-01-03 Mitsubishi Chemical Industries Ltd. Oxazolidone catalyst
JPS5933125B2 (ja) * 1980-03-17 1984-08-14 信越化学工業株式会社 半導体装置封止用エポキシ樹脂組成物
JPS61166822A (ja) * 1985-01-19 1986-07-28 Toshiba Chem Corp 封止用樹脂組成物
US5066735A (en) 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
ATE107676T1 (de) 1989-03-03 1994-07-15 Siemens Ag Epoxidharz-formmassen.
EP0384940B1 (de) 1989-03-03 1994-06-22 Siemens Aktiengesellschaft Epoxidharzmischungen
JPH02240131A (ja) * 1989-03-15 1990-09-25 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
JPH02240130A (ja) * 1989-03-15 1990-09-25 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
US5112931A (en) 1989-07-17 1992-05-12 Miles Inc. Blocked polyisocyanates for the production of powder coatings with flat finishes
FI902943A0 (fi) 1989-07-19 1990-06-12 Siemens Ag I hetta haerdbara reaktionshartsblandningar.
US5086156A (en) 1989-10-06 1992-02-04 Virginia Tech Intellectual Properties, Inc. Novel phosphorus containing epoxy networks based on trihydrocarbyl phosphine oxides having active substituents
US4973631A (en) 1989-10-06 1990-11-27 Virginia Tech Intellectual Properties Inc. Novel phosphorus containing epoxy networks
JPH03177451A (ja) * 1989-12-04 1991-08-01 Toshiba Chem Corp 封止用樹脂組成物および半導体装置
DK0526488T3 (da) 1990-04-02 1995-04-24 Pfizer Benzylphosphonsyre-tyrosinkinaseinhibitorer
JP3092009B2 (ja) * 1990-05-01 2000-09-25 東都化成株式会社 難燃剤及び該難燃剤を含有した熱硬化性難燃性樹脂組成物
EP0458502B1 (en) 1990-05-21 2003-06-18 Dow Global Technologies Inc. Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
DE4308187A1 (de) 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
FR2703689B1 (fr) * 1993-04-09 1995-06-16 Minnesota Mining & Mfg Composition epoxyde ignifuge pratiquement exempte d'halogene.
TW297034B (xx) 1994-09-09 1997-02-01 Siemens Ag
DE4432188A1 (de) 1994-09-09 1996-03-14 Siemens Ag Epoxidharzformmassen zur Umhüllung von elektronischen Bauelementen
TW294694B (xx) 1994-09-09 1997-01-01 Siemens Ag
GB9421405D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
EP0763566A4 (en) * 1995-03-10 1997-05-28 Toshiba Chem Corp HALOGEN-FREE FLAME RETARDANT EPOXY RESIN COMPOSITION
JPH08337709A (ja) * 1995-04-10 1996-12-24 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
DE69609557T2 (de) 1995-04-10 2001-04-19 Ciba Sc Holding Ag Epoxyharzmassen zur Einkapselung von Halbleitern, deren Herstellung und Verwendung, sowie damit eingekapselte Halbleiterbauteile
US5919843A (en) * 1995-05-24 1999-07-06 Siemens Aktiengesellschaft Epoxy resin moulding compounds having halogen-free flame retardation
US6214455B1 (en) * 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
US5955184A (en) * 1995-09-29 1999-09-21 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same
DE19613064C2 (de) * 1996-04-01 1998-12-17 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, Verfahren zu ihrer Herstellung und ihre Verwendung
DE19613061C2 (de) * 1996-04-01 1998-07-02 Clariant Gmbh Phosphormodifizierte Epoxidharze aus Epoxidharzen und phosphorhaltigen Verbindungen
DE19613067C2 (de) * 1996-04-01 1998-12-03 Clariant Gmbh Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung
US5859097A (en) 1996-07-11 1999-01-12 Shell Oil Company Epoxy resin compositions containing red phosphorus
JP3440775B2 (ja) * 1996-08-22 2003-08-25 株式会社日立製作所 樹脂封止型半導体装置及びその製造方法
EP0825217A1 (en) 1996-08-23 1998-02-25 Akzo Nobel N.V. Adduct of bisepoxy compound and P-guanamine
JP2000516659A (ja) 1996-08-23 2000-12-12 アクゾ ノーベル ナムローゼ フェンノートシャップ エポキシ化合物と環式ホスファイトとの付加生成物
JP3770342B2 (ja) * 1996-11-26 2006-04-26 大日本インキ化学工業株式会社 リン原子含有エポキシ樹脂の製造方法、難燃性エポキシ樹脂組成物及び電気積層板
DE69825561T3 (de) * 1997-01-21 2009-07-09 Dow Global Technologies, Inc., Midland Latente katalysatoren für epoxidharz-härtungssysteme
JPH10330596A (ja) * 1997-05-30 1998-12-15 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
GB9713526D0 (en) 1997-06-26 1997-09-03 Dow Deutschland Inc Flame retardant laminating formulations
JP3613724B2 (ja) * 1997-09-09 2005-01-26 東都化成株式会社 リン含有エポキシ樹脂組成物
JP3533973B2 (ja) * 1998-01-27 2004-06-07 東都化成株式会社 リン含有エポキシ樹脂組成物
US6297306B1 (en) * 1998-05-15 2001-10-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
US6207786B1 (en) * 1998-11-10 2001-03-27 Edison Polymer Innovation Corporation Ternary systems of benzoxazine, epoxy, and phenolic resins
US6291627B1 (en) * 1999-03-03 2001-09-18 National Science Council Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
JP2000273222A (ja) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd 難燃性プリプレグ及び積層板
JP2001002960A (ja) * 1999-06-16 2001-01-09 Sumitomo Durez Co Ltd 難燃性エポキシ樹脂粉体塗料
JP3072099B1 (ja) * 1999-08-17 2000-07-31 東芝ケミカル株式会社 封止用樹脂組成物および半導体封止装置
JP4417494B2 (ja) * 1999-09-17 2010-02-17 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物および樹脂封止型半導体装置
JP4535214B2 (ja) * 1999-10-08 2010-09-01 新日鐵化学株式会社 難燃性液状エポキシ樹脂組成物
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法

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US6645631B2 (en) 2003-11-11
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ATE308585T1 (de) 2005-11-15
US20020119317A1 (en) 2002-08-29
DE60023752T2 (de) 2006-04-20
KR20020082834A (ko) 2002-10-31
KR100721697B1 (ko) 2007-05-28
WO2001042359A1 (en) 2001-06-14
JP5675698B2 (ja) 2015-02-25
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CN1423678A (zh) 2003-06-11
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