DE60200478D1 - Flammhemmende Epoxyharze, die mit Phosphor und Silizium modifiziert sind - Google Patents

Flammhemmende Epoxyharze, die mit Phosphor und Silizium modifiziert sind

Info

Publication number
DE60200478D1
DE60200478D1 DE60200478T DE60200478T DE60200478D1 DE 60200478 D1 DE60200478 D1 DE 60200478D1 DE 60200478 T DE60200478 T DE 60200478T DE 60200478 T DE60200478 T DE 60200478T DE 60200478 D1 DE60200478 D1 DE 60200478D1
Authority
DE
Germany
Prior art keywords
phosphorus
silicon
flame retardant
epoxy resins
retardant epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60200478T
Other languages
English (en)
Other versions
DE60200478T2 (de
Inventor
Chongsoo Park
Jacho Choi
Bonggoo Choi
Tackyoo Shin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kukdo Chemical Co Ltd
Original Assignee
Kukdo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kukdo Chemical Co Ltd filed Critical Kukdo Chemical Co Ltd
Application granted granted Critical
Publication of DE60200478D1 publication Critical patent/DE60200478D1/de
Publication of DE60200478T2 publication Critical patent/DE60200478T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/395—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Reinforced Plastic Materials (AREA)
DE60200478T 2001-10-29 2002-10-08 Flammhemmende Epoxyharze, die mit Phosphor und Silizium modifiziert sind Expired - Lifetime DE60200478T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2001-0066642A KR100425376B1 (ko) 2001-10-29 2001-10-29 인 및 실리콘 변성 난연성 에폭시수지
KR2001066642 2001-10-29

Publications (2)

Publication Number Publication Date
DE60200478D1 true DE60200478D1 (de) 2004-06-17
DE60200478T2 DE60200478T2 (de) 2005-05-12

Family

ID=19715452

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60200478T Expired - Lifetime DE60200478T2 (de) 2001-10-29 2002-10-08 Flammhemmende Epoxyharze, die mit Phosphor und Silizium modifiziert sind

Country Status (9)

Country Link
US (1) US6534601B1 (de)
EP (1) EP1306400B1 (de)
JP (1) JP3574803B2 (de)
KR (1) KR100425376B1 (de)
CN (1) CN1169857C (de)
AT (1) ATE266689T1 (de)
DE (1) DE60200478T2 (de)
ES (1) ES2220866T3 (de)
TW (1) TWI239973B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004111121A1 (ja) * 2003-06-12 2004-12-23 Fuji Electric Holdings Co., Ltd. 反応性難燃剤及びそれを用いた難燃性樹脂加工品
WO2006057498A1 (en) * 2004-11-26 2006-06-01 Lg Chem, Ltd. Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
CN100343336C (zh) * 2005-07-07 2007-10-17 中国科学院广州化学研究所 一种含磷和环氧基的有机硅阻燃剂及其制备方法
KR100781582B1 (ko) * 2006-10-11 2007-12-05 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물 및 이를 이용한인쇄회로기판
TWI342322B (en) * 2007-03-28 2011-05-21 Grand Tek Advance Material Science Co Ltd Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad laminate
TWI347330B (en) * 2007-04-23 2011-08-21 Ind Tech Res Inst Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphor
JP5587542B2 (ja) * 2008-02-01 2014-09-10 新日鉄住金化学株式会社 リン含有エポキシ樹脂およびリン含有エポキシ樹脂組成物、その製造方法と該樹脂および該樹脂組成物を用いた硬化性樹脂組成物および硬化物
CN101250318B (zh) * 2008-03-25 2011-07-20 中国科学院广州化学研究所 一种印制电路覆铜板用的环氧基料及其制备方法
JP2012507599A (ja) * 2008-10-29 2012-03-29 アイシーエル−アイピー アメリカ インコーポレイテッド リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板
KR101102978B1 (ko) * 2008-10-31 2012-01-25 동진실업 주식회사 무용제 친환경 벽지와 그 제조방법
US7915436B2 (en) * 2008-11-03 2011-03-29 3M Innovative Properties Company Phosphorus-containing silsesquioxane derivatives as flame retardants
CN102300916B (zh) * 2008-12-08 2014-11-12 3M创新有限公司 用于环氧树脂体系的无卤素阻燃剂
CN101643650B (zh) * 2009-08-24 2012-10-10 广东生益科技股份有限公司 含磷阻燃剂及其制备方法
CN101698700B (zh) * 2009-11-03 2011-06-08 厦门大学 一种硅氮磷三者协同阻燃环氧树脂
JP5719574B2 (ja) * 2010-11-25 2015-05-20 新日鉄住金化学株式会社 リン含有フェノール樹脂、該樹脂組成物及び硬化物
KR101252063B1 (ko) 2011-08-25 2013-04-12 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
CN103435780A (zh) * 2013-09-02 2013-12-11 山东天一化学股份有限公司 一种磷溴复合阻燃环氧树脂的制备方法
CN103897385B (zh) * 2014-03-21 2016-01-20 华南理工大学 一种阻燃扩链尼龙6组合物及其制备方法
CN106476383B (zh) * 2016-10-09 2018-03-13 台州市黄岩恒龙工艺品有限公司 夹木砧板及其制造工艺
CN107266685B (zh) * 2017-05-08 2020-06-23 西南科技大学 一种含磷、硅聚合型阻燃剂及其制备方法
JP6964762B2 (ja) * 2017-12-27 2021-11-10 廣東生益科技股▲ふん▼有限公司Shengyi Technology Co., Ltd. リン含有シリコン活性エステル、その調製方法、難燃性樹脂組成物、プリプレグ、および金属張積層板
WO2020132929A1 (zh) * 2018-12-26 2020-07-02 广东生益科技股份有限公司 含磷硅阻燃剂、其制备方法、阻燃树脂组合物、预浸料和覆金属箔层压板
CN110358054B (zh) * 2019-07-11 2020-07-31 兰州大学 一种含氟有机磷酸改性线性酚醛环氧树脂的制备方法及应用
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체
US11739880B2 (en) 2021-05-19 2023-08-29 Samuel Gottfried High temperature protection wrap for plastic pipes and pipe appliances

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817537B2 (ja) * 1979-06-25 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JPS60126293A (ja) * 1983-12-09 1985-07-05 Sanko Kaihatsu Kagaku Kenkyusho:Kk 環状有機りん化合物及びその製造方法
JPS6241317A (ja) * 1985-08-13 1987-02-23 Nippon Ester Co Ltd 耐炎性ポリエステル複合繊維
EP0675131B1 (de) * 1994-03-24 1999-12-01 Shell Internationale Researchmaatschappij B.V. Flammhemmende Epoxyharzzusammensetzung
TW528769B (en) * 1998-06-19 2003-04-21 Nat Science Council Flame retardant advanced epoxy resins and cured epoxy resins, and preparation thereof
US6291627B1 (en) * 1999-03-03 2001-09-18 National Science Council Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
EP1059329A1 (de) * 1999-06-09 2000-12-13 Matsushita Electric Works, Ltd. Flammhemmende Harzzusammensetzung
JP3412585B2 (ja) * 1999-11-25 2003-06-03 松下電工株式会社 プリント配線板及び多層プリント配線板の製造に用いられるプリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板

Also Published As

Publication number Publication date
ATE266689T1 (de) 2004-05-15
EP1306400A1 (de) 2003-05-02
ES2220866T3 (es) 2004-12-16
DE60200478T2 (de) 2005-05-12
CN1415642A (zh) 2003-05-07
CN1169857C (zh) 2004-10-06
EP1306400B1 (de) 2004-05-12
KR100425376B1 (ko) 2004-03-30
JP3574803B2 (ja) 2004-10-06
KR20030034854A (ko) 2003-05-09
US6534601B1 (en) 2003-03-18
TWI239973B (en) 2005-09-21
JP2003137968A (ja) 2003-05-14

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