KR100538176B1 - 할로겐 프리 난연성 에폭시수지조성물, 할로겐 프리빌드업 다층판용 난연성 에폭시수지조성물, 프리프레그,동장 적층판, 프린트배선판, 동박부착 수지필름,캐리어부착 수지필름, 빌드업형 적층판 및 빌드업형 다층판 - Google Patents

할로겐 프리 난연성 에폭시수지조성물, 할로겐 프리빌드업 다층판용 난연성 에폭시수지조성물, 프리프레그,동장 적층판, 프린트배선판, 동박부착 수지필름,캐리어부착 수지필름, 빌드업형 적층판 및 빌드업형 다층판 Download PDF

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Publication number
KR100538176B1
KR100538176B1 KR10-2003-7000691A KR20037000691A KR100538176B1 KR 100538176 B1 KR100538176 B1 KR 100538176B1 KR 20037000691 A KR20037000691 A KR 20037000691A KR 100538176 B1 KR100538176 B1 KR 100538176B1
Authority
KR
South Korea
Prior art keywords
compound
epoxy resin
weight
resin composition
epoxy
Prior art date
Application number
KR10-2003-7000691A
Other languages
English (en)
Other versions
KR20030031121A (ko
Inventor
스즈키데츠아키
가자마신이치
스기야마츠요시
가미야히로키
가네마키노리코
오가와케이
타다유지
Original Assignee
교세라 케미카르 가부시키가이샤
오츠카 가가쿠 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000216726 priority Critical
Priority to JPJP-P-2000-00216726 priority
Priority to JP2000223225 priority
Priority to JPJP-P-2000-00223225 priority
Application filed by 교세라 케미카르 가부시키가이샤, 오츠카 가가쿠 홀딩스 가부시키가이샤 filed Critical 교세라 케미카르 가부시키가이샤
Priority to PCT/JP2001/006134 priority patent/WO2002006399A1/ja
Publication of KR20030031121A publication Critical patent/KR20030031121A/ko
Application granted granted Critical
Publication of KR100538176B1 publication Critical patent/KR100538176B1/ko

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins