TWI388621B - 樹脂組成物及其應用 - Google Patents

樹脂組成物及其應用 Download PDF

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TWI388621B
TWI388621B TW97100410A TW97100410A TWI388621B TW I388621 B TWI388621 B TW I388621B TW 97100410 A TW97100410 A TW 97100410A TW 97100410 A TW97100410 A TW 97100410A TW I388621 B TWI388621 B TW I388621B
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Taiwan
Prior art keywords
resin
resin composition
composition according
benzoxazine
circuit board
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TW97100410A
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English (en)
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TW200930759A (en
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Lichun Chen
Jengi Chen
Bill Weng
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Iteq Corp
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Priority to TW97100410A priority Critical patent/TWI388621B/zh
Priority to US12/348,483 priority patent/US7786029B2/en
Publication of TW200930759A publication Critical patent/TW200930759A/zh
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Publication of TWI388621B publication Critical patent/TWI388621B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2418—Coating or impregnation increases electrical conductivity or anti-static quality
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2418—Coating or impregnation increases electrical conductivity or anti-static quality
    • Y10T442/2451—Phosphorus containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2475—Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2926—Coated or impregnated inorganic fiber fabric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2926—Coated or impregnated inorganic fiber fabric
    • Y10T442/2992—Coated or impregnated glass fiber fabric

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Description

樹脂組成物及其應用
本發明是有關於一種組成物，且特別是有關於一種樹脂組成物。
印刷電路板發展至今已有數十年之歷史。伴隨著各種新型電子產品之開發，印刷電路板的使用亦越趨廣泛。
在目前的印刷電路板前段製程中，主要係於一包含樹脂層與銅箔之覆銅積層板上進行蝕刻、鑽孔等步驟，以形成印刷電路板上的導電線路以及層與層之間的導通孔。為提高印刷電路板製程之良率，對於前述覆銅積層板中之樹脂層的熱性質與機械性質皆有特定之要求。因此，開發各種不同性質之樹脂組成物，為目前業界努力的方向之一。
本發明實施例提出一種樹脂組成物。
依照本發明一實施例，提出一種樹脂組成物。此樹脂組成物包含溶劑與分散於溶劑中的固形物。固形物不含酚醛樹脂，此固形物包含含磷型環氧樹脂與苯并噁嗪樹脂。苯并噁嗪樹脂與含磷型環氧樹脂的重量比約為0.6：1~3.0：1。
依照本發明另一實施例，提出一種電路板基材。此電路板基材包含增強材料與包覆增強材料之樹脂硬化物。其中，樹脂硬化物係由前述實施例所述之樹脂組成物固化而成。
依照本發明再一實施例，提出一種覆銅積層板。此覆銅積層板包含前述實施例所述之電路板基材以及一銅箔。銅箔位於電路板基材中的樹脂硬化物上。
本發明上述實施例所述之樹脂組成物與覆銅積層板，具有優於習知樹脂組成物及其所製作之覆銅積層板之耐熱特性與介電損失特性，可進一步提高產品的出貨品質。
第1圖係繪示依照本發明一實施例所述之覆銅積層板的剖面構造示意圖。在第1圖中，覆銅積層板100包含電路板基材110、銅箔120a與銅箔120b。電路板基材110包含增強材料112與樹脂硬化物114，其中，樹脂硬化物114包覆增強材料112。銅箔120a與銅箔120b分別位於電路板基材110相對之兩面上。
前述之樹脂硬化物係由一樹脂組成物固化而成。此樹脂組成物包含溶劑與分散於溶劑中的固形物。固形物組成中不含酚醛樹脂，以提高其所製成之樹脂硬化物的出貨品質如韌性或熱性質。固形物的組成可包含含磷型環氧樹脂與苯并噁嗪樹脂(Benzoxazine resin)，其中，苯并噁嗪樹脂與含磷型環氧樹脂的重量比約為0.6：1~3.0：1。具體而言，含磷型環氧樹脂的含量約為固形物的20~50 wt%，苯并噁嗪樹脂的含量約為固形物的30~60 wt%。
上述含磷型環氧樹脂具有如下式I之結構，。式I中的A與B的化學結構如下式II所示。
上述苯并噁嗪樹脂的重量平均分子量約為800~1800。苯并噁嗪樹脂為一聚合物，其結構中可具有如下式III或式IV所示之結構。
上述之樹脂組成物可更包含一無機填充物，此無機填充物例如可為二氧化矽、氫氧化鋁、氫氧化鎂、滑石粉或雲母。上述無機填充物的添加量少於樹脂組成物中的固形物的26 wt%，以提供適當黏度之樹脂組成物，使利於後續電路板基材110的製作。
此外，為提高樹脂組成物中固形物於溶劑中的分散效果，亦可更包含一分散劑，此分散劑例如可為矽烷偶合劑。除此之外，此樹脂組成物亦可更包含固化促進劑，以提高樹脂組成物的固化效果，此固化促進劑例如可為2－甲基咪唑(2－Methylimidazole；2－MI(Z))、2－苯基咪唑(2－Phenylimida zole；2－PI(Z))或2－乙基－4－甲基咪唑(2－ethyl－4－methylimida zole；2－E4MI(Z))。
製作實例
依照本發明上述樹脂組成物實施例所述，進行樹脂組成物的配製。首先，將含磷型環氧樹脂、苯并噁嗪樹脂、固化促進劑2－MI與溶劑二甲基甲醯胺(N,N－Dimethyl formamide；DMF)混合。其中，苯并噁嗪樹脂的重量平均分子量約為1000~1400，樹脂結構中具有如上式III所示之結構。含磷環氧樹脂係選用晉一化工公司編號LX6302系列之產品。
接著利用攪拌機進行攪拌，並的量加入分散劑矽烷偶合劑及無機填充物並持續進行攪拌，以完成樹脂組成物的製作。其中，樹脂組成物的固形物含量約為65 wt%。
上述樹脂組成物製作完成後，可進行後續覆銅積層板的製作，製作方式如下所述。首先，將一玻纖布浸泡於樹脂組成物中。接著，再將浸泡樹脂組成物之玻纖布進行烘烤。之後，再將前述烘烤完成之玻纖布與銅箔進行熱壓合，以製成雙面覆銅積層板或多層覆銅積層板。。
上述樹脂組成物/覆銅積層板製作完成後，進一步進行吸水率、熱性質、剝離強度、介電性質、燃燒特性與韌性測試，性質測試方式如下所述。
吸水率之測試係為將製備完成之覆銅積層板置於121℃與1.1 kgf/cm2 的壓力鍋下1小時，再測試其重量變化。
熱性質測試包含耐熱性、熱裂解溫度(thermal decomposition temperature；Td)、玻璃轉移溫度(glass transition temperature；Tg)與熱膨脹特性測試。耐熱性測試係為將多層覆銅積層板置於288℃之錫爐下，測試多層板分層爆板發生的時間。熱裂解溫度係依IPC－TM650規範，以TGA測試材料於5 wt%重量損失產生時的溫度。玻璃轉移溫度係依IPC－TM650規範，以DSC進行測試。熱膨脹特性係依IPC－TM650規範，以TMA進行測試，測試試驗材料覆銅積層板由50℃升溫至260℃時的厚度增加率。
剝離強度係依IPC－TM650規範，利用萬能拉力機測試覆銅積層板中銅箔與電路板基材之接著性。介電性質係依IPC－TM650規範進行測試。燃燒特性係依UL94垂直燃燒方式測試。
韌性測試的方式係為將類似十字型螺絲起子的冶具架設於萬能拉力機，萬能拉力機的load cell為1 kN，治具距離覆銅積層板10 mm。接著以20 mm/min的速度下降冶具。當冶具下降15 mm時停止，並以肉眼觀察材料的凹痕。
第2圖係繪示了前述韌性測試所產生之凹痕示意圖。若由凹痕中可看到十字型，則表示材料具韌性。至於韌性之量化程度，則以十字凹痕產生時所造成之龜裂面積的大小進行判斷。首先，如第2圖所示，依十字凹痕劃出面積A之區域。接著，將面積A之區域中的龜裂面積除以面積A，若所得出之數值≦20%，則視為韌性佳，以「O」，反之，則以「X」表示韌性差。
性質分析
表一係列出上述製作實例中固形物之組成成份(E1~E6)，同時亦提供含酚醛樹脂之習知樹脂組成物之固形物之組成(R1~R3)做為比較例。表二係列出包含表一固形物組成之樹脂組成物及其所製作之覆銅積層板經前述之性質測試方式測得之各項性質。
表二 樹脂組成物/覆銅積層板之性質
請同時參考表一與表二，本發明製作實例E1~E5所製作之覆銅積層板具有低於比較例R1~R3的吸水率，可製作品質較佳的覆銅積層板。製作實例E6的吸水率雖高於比較例R1~R2，但仍比R3來得低。
在耐熱測試上，不含酚醛樹脂的製作實例E1~E6所製作之多層板分層爆板發生的時間≧3分鐘，優於比較例R1~R3的耐熱特性。且，由製作實例E2與E3，以及E4與E5的比較中，可發現以二氧化矽做為無機填充物，可獲得較氫氧化鋁較佳的耐熱特性。
在熱裂解溫度、玻璃轉移溫度與熱膨脹特性的測試中，製作實例E1~E5具有較比較例R1~R3來得高的熱裂解溫度與玻璃轉移溫度，以及低於比較例R1~R3之熱膨脹率，具有較佳的熱安定性。藉由熱安定性的提高，可使其所製作之覆銅積層板承受較高的製程溫度與操作溫度。由表一與表二中亦知悉，隨著苯并樹脂與環氧樹脂的比例的下降(製作實例E6)，熱安定性亦出現下降的情形，但乃優於比較例R3。
在介電性質的測試上，本發明製作實例E1~E6所製作之覆銅積層板具有低於比較例R1~R3之介電損失係數Df。當前述低介電損失係數之覆銅積層板應用於高頻訊號傳輸時，可避免訊號損失與訊號受干擾之情形發生。
在剝離強度測試上，製作實例E1~E6所製作之樹脂組成物與銅箔的接合強度亦優於比較例R1~R3。在燃燒特性上，製作實例E1~E6可達到V－0之等級。
在韌性測試上，由圖示之結果可知，本發明製作實例E1~E6與比較例R1~R3所製作的覆銅積層板在測試過程中所產生的凹痕皆可看到十字型，具有一定程度之韌性。若進一步比較製作實例E1~E6與比較例R1~R3之十字型可發現，E4~E5的十字型所構成之區域中的龜裂面積相對較小。由此可推知，當苯并噁嗪樹脂與含磷型環氧樹脂的重量比調整至約0.77時，可使其所製作之覆銅積層板之韌性提高至「佳」之等級。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100．．．覆銅積層板
110．．．電路板基材
112．．．增強材料
114．．．樹脂硬化物
120a、120b．．．銅箔
A．．．面積
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之詳細說明如下：第1圖係繪示依照本發明一實施例所述之覆銅積層板的剖面構造示意圖。
第2圖係繪示本發明實施例所述之韌性測試過程中所產生之凹痕示意圖。
100．．．覆銅積層板
110．．．電路板基材
112．．．增強材料
114．．．樹脂硬化物
120a、120b．．．銅箔

Claims (17)

  1. 一種樹脂組成物，包含：一溶劑；以及一固形物，分散於該溶劑中，其中該固形物不含酚醛樹脂，且該固形物包含：一含磷型環氧樹脂；以及一苯并噁嗪樹脂，該苯并噁嗪樹脂與該含磷型環氧樹脂的重量比約為0.6：1~3.0：1。
  2. 如申請專利範圍第1項所述之樹脂組成物，其中該含磷型環氧樹脂的含量約為該固形物的20~50 wt%，該苯并噁嗪樹脂的含量約為該固形物的30~60 wt%。
  3. 如申請專利範圍第1項所述之樹脂組成物，其中該含磷型環氧樹脂具有如下所示之結構。
  4. 如申請專利範圍第1項所述之樹脂組成物，其中該苯并噁嗪樹脂與該含磷型環氧樹脂的重量比約為0.77。
  5. 如申請專利範圍第1項所述之樹脂組成物，其中該苯并噁嗪樹脂的重量平均分子量約為800~1800。
  6. 如申請專利範圍第1項所述之樹脂組成物，其中該苯并噁嗪的重量平均分子量約為1000~1400。
  7. 如申請專利範圍第1項所述之樹脂組成物，其中該苯并噁嗪樹脂為一聚合物，該聚合物中包含如下所示之結構。
  8. 如申請專利範圍第1項所述之樹脂組成物，其中該苯并噁嗪樹脂為一聚合物，該聚合物中包含如下所示之結構。
  9. 如申請專利範圍第1項所述之樹脂組成物，更包含一無機填充物。
  10. 如申請專利範圍第9項所述之樹脂組成物，其中該無機填充物的添加量少於該固形物的26 wt%。
  11. 如申請專利範圍第9項所述之樹脂組成物，其中該無機填充物為二氧化矽、氫氧化鋁、氫氧化鎂、滑石粉或雲母。
  12. 如申請專利範圍第1項所述之樹脂組成物，更包含一分散劑，該分散劑係為一矽烷偶合劑。
  13. 如申請專利範圍第1項所述之樹脂組成物，更包含一固化促進劑，該固化促進劑係選自於由2－甲基咪唑、2－苯基咪唑及2－乙基－4－甲基咪唑所構成之族群。
  14. 一種電路板基材，包含：一增強材料；以及一樹脂硬化物，包覆該增強材料，該樹脂硬化物係由申請專利範圍第1~13項中任一項所述之樹脂組成物固化而成。
  15. 如申請專利範圍第14項所述之電路板基材，其中該增強材料係為玻纖布。
  16. 一種覆銅積層板，包含：一電路板基材，該電路板基材包含：一增強材料；以及一樹脂硬化物，包覆該增強材料，該樹脂硬化物係由申請專利範圍第1~13項中任一項所述之樹脂組成物固化而成；以及一銅箔，位於該電路板基材中的該樹脂硬化物上。
  17. 如申請專利範圍第16項所述之覆銅積層板，其中該增強材料為玻纖布。
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