DE602005017509D1 - Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit - Google Patents

Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit

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Publication number
DE602005017509D1
DE602005017509D1 DE200560017509 DE602005017509T DE602005017509D1 DE 602005017509 D1 DE602005017509 D1 DE 602005017509D1 DE 200560017509 DE200560017509 DE 200560017509 DE 602005017509 T DE602005017509 T DE 602005017509T DE 602005017509 D1 DE602005017509 D1 DE 602005017509D1
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Germany
Prior art keywords
prepreg
copper
resin composition
epoxy resin
halogen flame
Prior art date
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Active
Application number
DE200560017509
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English (en)
Inventor
Mok Yong Jung
Eunhae Koo
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LG Chem Ltd
Original Assignee
LG Chem Ltd
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Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Publication of DE602005017509D1 publication Critical patent/DE602005017509D1/de
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
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    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/31504—Composite [nonstructural laminate]
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    • Y10T428/31529—Next to metal

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
DE200560017509 2004-11-26 2005-11-17 Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit Active DE602005017509D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20040098230 2004-11-26
PCT/KR2005/003901 WO2006057498A1 (en) 2004-11-26 2005-11-17 Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same

Publications (1)

Publication Number Publication Date
DE602005017509D1 true DE602005017509D1 (de) 2009-12-17

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DE200560017509 Active DE602005017509D1 (de) 2004-11-26 2005-11-17 Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit

Country Status (8)

Country Link
US (1) US7521120B2 (de)
EP (1) EP1814949B1 (de)
JP (1) JP2008517136A (de)
KR (1) KR100705269B1 (de)
CN (1) CN101044204A (de)
DE (1) DE602005017509D1 (de)
TW (1) TW200631977A (de)
WO (1) WO2006057498A1 (de)

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SG122893A1 (en) * 2004-11-16 2006-06-29 Hitachi Chemical Co Ltd Prepreg and laminate and printed wiring board using the same
CN101104727B (zh) * 2007-06-12 2010-04-14 广东生益科技股份有限公司 一种无卤素树脂组合物及其高密度互连用涂树脂铜箔
TWI432509B (zh) * 2008-12-22 2014-04-01 Iteq Corp 無鹵黏合膠片及其所用之樹脂
US8088490B2 (en) * 2009-10-25 2012-01-03 Iteq Corporation Varnish, prepreg, and substrate thereof
KR101033044B1 (ko) * 2009-12-30 2011-05-09 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 다이 접착 필름
JP5214658B2 (ja) * 2010-03-31 2013-06-19 新日鉄住金化学株式会社 エポキシ樹脂、エポキシ樹脂組成物および硬化物
CN102399415B (zh) * 2010-09-14 2014-03-26 联茂电子股份有限公司 预浸体组合物及应用该预浸体组合物所制成的胶片和基板
TW201235402A (en) * 2011-01-07 2012-09-01 Ajinomoto Kk Resin composition for release film
KR101431903B1 (ko) * 2012-09-04 2014-08-27 주식회사 엘지화학 스티렌계 수지용 난연제 및 난연 조성물
CN104583309B (zh) * 2013-08-23 2017-10-03 台光电子材料(昆山)有限公司 树脂组成物及应用其之铜箔基板及印刷电路板
CN104448237B (zh) * 2014-11-05 2017-09-12 广东一通科技股份有限公司 一种适用于钢管的硅氮磷协同阻燃环氧树脂粉末涂料及其制备方法
KR20180100348A (ko) * 2015-12-30 2018-09-10 사이텍 인더스트리스 인코포레이티드 용락 저항성이 있는 다기능성 표면 재료
KR102041665B1 (ko) * 2017-01-05 2019-11-06 주식회사 두산 동박 적층판용 접착제
CN109503027B (zh) * 2018-10-22 2022-01-11 湖南兆健建材有限公司 一种阻燃透明混凝土
CN110317432A (zh) * 2019-07-11 2019-10-11 山东金宝电子股份有限公司 一种高导热金属基覆铜板涂胶及其制备方法
CN113927974A (zh) * 2021-10-14 2022-01-14 江西省宏瑞兴科技股份有限公司 一种环氧树脂组合物覆铜板及其制备方法
CN114058154A (zh) * 2021-11-12 2022-02-18 广德龙泰电子科技有限公司 一种适用于pcb无铅制程的覆铜板胶液及应用
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CN101044204A (zh) 2007-09-26
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