DE602008000591D1 - Prepreg und Laminat - Google Patents

Prepreg und Laminat

Info

Publication number
DE602008000591D1
DE602008000591D1 DE602008000591T DE602008000591T DE602008000591D1 DE 602008000591 D1 DE602008000591 D1 DE 602008000591D1 DE 602008000591 T DE602008000591 T DE 602008000591T DE 602008000591 T DE602008000591 T DE 602008000591T DE 602008000591 D1 DE602008000591 D1 DE 602008000591D1
Authority
DE
Germany
Prior art keywords
prepreg
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008000591T
Other languages
English (en)
Inventor
Yoshihiro Kato
Masayoshi Ueno
Takeshi Nobukuni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of DE602008000591D1 publication Critical patent/DE602008000591D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE602008000591T 2007-02-07 2008-02-05 Prepreg und Laminat Active DE602008000591D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007028117 2007-02-07
JP2007186929A JP5263705B2 (ja) 2007-02-07 2007-07-18 プリプレグ及び積層板

Publications (1)

Publication Number Publication Date
DE602008000591D1 true DE602008000591D1 (de) 2010-03-18

Family

ID=39835029

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008000591T Active DE602008000591D1 (de) 2007-02-07 2008-02-05 Prepreg und Laminat

Country Status (5)

Country Link
JP (1) JP5263705B2 (de)
KR (1) KR101494834B1 (de)
CN (1) CN101240111B (de)
DE (1) DE602008000591D1 (de)
TW (1) TWI408052B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5024205B2 (ja) * 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP5381016B2 (ja) * 2008-10-30 2014-01-08 日立化成株式会社 熱硬化性樹脂組成物、及びこれを用いたプリプレグ，積層板
CN102414262A (zh) * 2009-02-25 2012-04-11 三菱瓦斯化学株式会社 预浸料和层压体
JP5223781B2 (ja) * 2009-06-01 2013-06-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
JP5526820B2 (ja) * 2010-01-29 2014-06-18 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ及び積層板
US20130045650A1 (en) * 2010-03-02 2013-02-21 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and laminated sheet
GB201005444D0 (en) * 2010-03-31 2010-05-19 3M Innovative Properties Co Epoxy adhesive compositions comprising an adhesion promoter
WO2011126070A1 (ja) * 2010-04-08 2011-10-13 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび積層板
CN107254144B (zh) * 2010-06-02 2020-02-18 三菱瓦斯化学株式会社 树脂组合物和使用其的预浸料以及层压板
CN101967264A (zh) * 2010-08-31 2011-02-09 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板
CN102558472A (zh) * 2010-12-24 2012-07-11 广东生益科技股份有限公司 萘酚酚醛型氰酸酯树脂及其合成方法
JP5958827B2 (ja) * 2011-01-20 2016-08-02 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
CN103429633A (zh) * 2011-03-07 2013-12-04 三菱瓦斯化学株式会社 树脂组合物以及使用其的预浸料和层叠板
EP2762451B1 (de) * 2011-09-26 2019-09-04 Mitsubishi Gas Chemical Company, Inc. Molybdänverbindungspulver, prepreg und laminat
KR101945076B1 (ko) * 2011-11-07 2019-02-01 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 이것을 사용한 프리프레그 및 적층판
US9944787B2 (en) * 2012-03-30 2018-04-17 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and laminate
JP2014005338A (ja) * 2012-06-22 2014-01-16 Dic Corp 硬化性組成物、硬化物、及びプリント配線基板
WO2014059654A1 (zh) * 2012-10-19 2014-04-24 广东生益科技股份有限公司 氰酸酯树脂组合物及使用其制作的预浸料、层压材料与覆金属箔层压材料
KR102075187B1 (ko) * 2012-10-19 2020-02-07 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 적층판, 및 프린트 배선판
JP2013237844A (ja) * 2013-06-12 2013-11-28 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板
CN103497488B (zh) * 2013-10-11 2016-05-25 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
CN105237949B (zh) * 2014-06-12 2017-11-03 广东生益科技股份有限公司 一种热固性环氧树脂组合物及其用途
CN104320911A (zh) * 2014-08-27 2015-01-28 无锡长辉机电科技有限公司 一种电路板吸湿性爆板的解决方法
JP6264250B2 (ja) * 2014-09-30 2018-01-24 信越化学工業株式会社 合成樹脂組成物に配合するシリコーンゴム粒子の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245349B2 (ja) * 1983-09-13 1990-10-09 Sumitomo Bakelite Co Insatsukairoyosekisoban
JPH064310B2 (ja) * 1986-01-27 1994-01-19 松下電工株式会社 電気用積層板
JPH11124433A (ja) * 1997-10-22 1999-05-11 Mitsubishi Gas Chem Co Inc フェノールノボラック型シアン酸エステルプレポリマー
KR100617287B1 (ko) * 2001-07-17 2006-08-30 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 캡슐화용 에폭시 수지 조성물 및 반도체 장치
KR100470178B1 (ko) * 2003-06-03 2005-02-04 주식회사 엘지화학 동박 적층판용 수지 조성물
JP2006131743A (ja) * 2004-11-05 2006-05-25 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、プリント配線板
JP4843944B2 (ja) * 2005-01-13 2011-12-21 三菱瓦斯化学株式会社 樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2006348187A (ja) * 2005-06-16 2006-12-28 Mitsubishi Gas Chem Co Inc 樹脂組成物並びにそれを用いたプリプレグおよび銅張積層板

Also Published As

Publication number Publication date
TWI408052B (zh) 2013-09-11
KR101494834B1 (ko) 2015-02-23
CN101240111A (zh) 2008-08-13
TW200848257A (en) 2008-12-16
KR20080074037A (ko) 2008-08-12
JP5263705B2 (ja) 2013-08-14
JP2008214602A (ja) 2008-09-18
CN101240111B (zh) 2011-12-28

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Legal Events

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