TW200848257A - Prepreg and laminate - Google Patents

Abstract

A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.

Description

200848257 IX. Description of the Invention: [Technical Field] The present invention relates to a prepreg for a resin composition comprising a refractory resin for a printed wiring board, and a laminate comprising the above prepreg each And metal-clad laminates. [Prior Art] "Semiconductor (10) is widely used in electronic devices, communication devices, and personal computers. High integration, high functionality and high density packaging of semiconductors are evolving. Li f is growing faster and faster. In particular, the technology of mobile devices represented by mobile phones has rapidly advanced in recent years. Technological innovations aimed at achieving a society where computing is done are significant. The semiconductor package is developed from the QFP to the area-mounted semi-V makeup, such as BGA and CSP. In addition, high-performance semiconductor packages are available, such as the MCP spear SIP. Therefore, the form of semiconductor packaging is becoming diversified. Therefore, a laminate for a semiconductor package is required more strongly (the board needs to have heat resistance, high rigidity, low thermal expansion, low water absorption, and other properties. Conventionally, it is widely used to cure an epoxy resin by using dicyandiamide. The obtained FR-4 type laminated board is used as a laminated board for printed wiring boards. However, this technique cannot sufficiently satisfy the demand for high heat resistance. Cyanate resin is known as a high heat resistant resin for printed wiring boards. For the laminate for semiconductor packaging, a composition comprising a resin composition containing a bisphenol A type cyanate resin and a different thermosetting resin or a thermoplastic resin as a base composition is widely used. 97104159 5 200848257 The above bisphenol A The cyanate resin has excellent properties in terms of electrical properties, mechanical properties, chemical resistance and adhesion. However, in some cases, k-water absorption or heat resistance after moisture absorption, bisphenol A type cyanic acid Ester resins are not sufficient under severe conditions. Therefore, in order to further improve the properties, cyanate resins having different structures have been studied. The cyanate resin of the same structure, in many cases, a phenolic type cyanate resin (see, for example, jp-A-u-124433). The phenolic type cyanate resin is easily cured insufficient under normal curing conditions, and thus The obtained cured product has problems such as a high water absorption coefficient and a decrease in heat resistance after moisture absorption. A prepolymer of a phenolic type cyanate resin and a bisphenol A type cyanate resin is not used as a modified phenolic type cyanate resin. Techniques (see, for example, JPU000-1 91776). Although the above prepolymers have been improved in curability, other performance improvements have been insufficient. In addition, the use of naphthoprene-type cyanate esters has been studied (see, For example, jp - A-2 〇〇 6 - 1 936 〇 7) Naphthol aralkyl type cyanate resin maintains heat resistance due to its rigid resin skeleton structure. Further, by reducing reaction inhibition factors, their curability (curability) is improved. Thus, a resin composition having a low water absorption coefficient and excellent heat resistance after moisture absorption is obtained. Further, a laminate for a printed wiring board used in an electronic device usually has to be resistant. Traditionally, in order to impart fire resistance, a combination of a flame retardant containing a desert (#, for example, jp_a_u_〇21452) has been used. However: ❿, due to the recent concern about environmental issues, a resin containing no halogen compound is required. Phosphorus compounds have been studied as halogen-free flame retardants. However, there is a danger of producing toxic compounds such as phosphines during combustion. Flame retardants containing, shi Xichen 97104159 6 200848257 (sU/ccme) Metal hydrates are known as other flame retardants. The use of loss-containing flame retardants as flame retardants has also been studied (see, see, for example, JP-A-_-3481 (7). However, different resistances are required. The fire resistance is obtained. Aluminum hydroxide or the like is a known metal hydrate. It is known that aluminum hydroxide releases water of crystallization upon heating and acts as a flame retardant due to the reaction. However, when a metal hydrate, such as aluminum hydroxide, is used alone as a flame retardant, in many cases it is necessary to incorporate 5 〇 by weight of the metal hydrate to achieve UL94 V 〇 (see, for example, JP-A-2001- 226465). When a large amount of gibbsite, which is a general structure of aluminum hydroxide, is added, the resistance to chemicals such as alkali or acid tends to be extremely low. Etching, decontamination, plating, and the like are performed in the step of manufacturing a printed wiring board, and these treatments are carried out under severe alkali or acid conditions. Therefore, it is required to improve the insulating layer having poor chemical resistance. Furthermore, in the assembly method of the semiconductor package, in baking, wire-bonding, die attachment, and die tree

Hot working is carried out at 120 to 200 ° C in the steps of mold resin curing and the like. From an environmental point of view, the use of error-free solder in the solder ball connection replaces the conventional lead solder to increase the reflow temperature by 20 to 30 °C. Therefore, a laminate for semiconductor packaging is always required to have higher heat resistance. Since the dehydration starting temperature of Sanshui Mingshi is slightly higher than 200 °C, the laminate using Sanshui Mingshi as a flame retardant has poorer processing in some cases at temperatures higher than 200 °C. ^ Heat resistance. For laminated boards which require high reliability for semiconductor packaging, it is required to develop a laminate having excellent heat resistance and containing no halogen compound 97104159 7 200848257. The laminated materials for high-performance printed wiring boards for semiconductor package I have the above-mentioned properties. The prior art alone improves individual performance. But θ • Extremely demanding materials with all the required properties in an excellent balance. BRIEF SUMMARY OF THE INVENTION [0009] It is an object of the present invention to provide prepregs and laminates for printed wiring board materials, each of which maintains high fire resistance and excellent resistance in the absence of self-contained compounds. Chemical, high glass transfer/dishness, excellent solder heat resistance and excellent heat resistance after moisture absorption. ^ The inventors have found that 'in the case of a cyanate resin and a halogen-free epoxy tree with a specific structure, it is possible to incorporate a water-insoluble acid and an oil-based mineral and a stone-ceramic powder as a flame retardant. Provided is a dentate-free refractory resin composition which obtains improved curability by reducing a reaction inhibition factor caused by a molecular structure of a cyanate resin, or similarly, maintains heat resistance due to a rigid resin skeleton structure (High glass transition temperature) and excellent chemical resistance and heat resistance after moisture absorption. Based on the above findings, the inventors have completed the present invention. That is, the present invention provides a prepreg comprising a resin composition and a base material (E), the resin composition containing the naphthol aralkyl type cyanate resin (A) represented by the formula (1), Tooth epoxy resin (B), bauxite (c), and linalool powder (1), wherein, with respect to 1 part by weight of the Chuafang aromatic base vinegar resin (A) and the halogen-free epoxy resin The total amount of (b), the amount of the bauxite (C) is 50 to 300 parts by weight, and the halophenol aralkyl type cyanate resin (A) and the halogen-free epoxy resin per part by weight Resin (B) 97104159 8 200848257 5 to 30 parts by weight,

The total amount of anthrone powder (D) is

Wherein R represents a hydrogen atom or a methyl group, and η is an integer of from 1 to 50. The present invention provides a prepreg, wherein the number of cyanate (CN) groups of the (tetra) aralkyl type cyanate resin (Α) in the resin composition: halogen-free epoxy resin (B) t The number of epoxy (Ep) groups is in the range of 〇7 to 2.5. P) The present invention further provides a laminate by curing the above prepreg. The present invention also provides a laminate by lamination. The prepreg sheet* is a metal foil, and a metal foil-clad laminate obtained by curing the prepreg sheet of the metal foil is cured. Advantageous Effects of Invention The cured product of the prepreg obtained according to the present invention has excellent chemical resistance and high Glass transition temperature, excellent solder heat resistance and excellent heat resistance after moisture absorption' and high fire resistance without using a halogen-containing flame retardant. Therefore, the prepreg of the present invention is suitable as a heat resistant material as needed. A material for high-functionalizable printed wiring boards that is highly reliable and highly reliable under the harsh conditions requiring high chemical resistance. Its industrial applicability is very high. v Detailed Description of the Invention For use in the present invention Naphthol aralkyl type cyanate Resin (A) No. 97104159 9 200848257 Specific limitation 'As long as it is a naphthol aralkyl type cyanate resin represented by the formula (1), a prepolymer obtained by heating can also be used. Formula (1) The naphthol aryl-type cyanate resin (A) is obtained by condensing cyanic acid with a naphthol aralkyl resin by using naphthol (such as naphthalene or /3) -naphthol) is obtained by reacting p-xylylene glycol, α,α, dimethyloxy-p-xylene or L4-bis(2-hydroxy-l-propyl)benzene or the like. The method for producing the naphthol aralkyl type cyanate resin (Α) of (1) is not particularly limited. It can be produced by any cyanate ester synthesis method. Specifically, for example, it can be made by formula (2) The naphthol aralkyl resin shown is obtained by reacting cyanoquinone with an alkalinized human in an inert organic solvent. Further, it can be similar to a naphthol aralkyl resin and a base in an aqueous solution. The salt of the compound is then synthesized by reacting the salt with a cyanogen halide in a two-phase interface reaction.

Η (2) wherein R represents a hydrogen atom or a methyl group and an integer of β ! to 5 。. The (tetra)anthracene resin (ruthenium) used in the present invention is not particularly limited as long as it is a compound having at least two epoxy groups in the molecule and having no dentate atom in the molecular structure. Examples thereof include bisphenol α-diester, double-aged F-type epoxy resin, benzene-type epoxy resin, acetal epoxy resin, bisphenol novolac epoxy resin, trifunctional phenolic lipid, and tetrafunctional Epoxy resin, naphthalene epoxy resin, biphenyl type epoxy = 97104159 10 200848257 Grease, aralkyl novolac epoxy resin, cycloaliphatic epoxy resin, polyol epoxy resin, glycidylamine, shrinkage A glyceride, a compound obtained by epoxidizing a double bond of butadiene or the like, and a compound obtained by reacting a sulfhydryl group containing ruthenium ruthenium with epichlorohydrin. In particular, an aralkyl novolac type epoxy resin is preferred in terms of improvement in fire resistance. The aralkyl novolac type epoxy resin means a compound which can be represented by the formula (3). Examples thereof include a phenol phenyl aralkyl type epoxy resin, a phenol biphenyl aralkyl type epoxy resin, and a naphthol aralkyl type epoxy resin. The halogen-free epoxy resin (B) can be used alone or in combination as needed. CKG I Arr I Rx r

O-G

I

--(3) CH2-Ar.-

I

Rx wherein G represents a haloglyceryl group, and each of Ar2 and Ar2 represents an aryl group having a monocyclic or oxime aromatic hydrocarbon as a substituent, such as a phenyl group, a naphthyl group or a biphenyl group.

Rx and Ry each represent a hydrogen atom, an alkyl group or an aryl group, and the melon is an integer of from 1 to 5, and η is an integer of from 1 to 50. In the month of this issue, the car's good resin composition does not contain Cai Dufang-based nitrite resin U) and no (tetra) oxy resin (B), so that the resin composition naphthol aralkyl type cyanate The ratio (CN/Ep) between the number of cyanate (CN) groups of the ester resin (A) and the number of epoxy (Ep) groups of the epoxy-free (B) is from 0.7 to 2.5. When the CN/Ep is less than 0.7, the richness of the laminate is lowered. When it exceeds 2 · 5 o', the curability sometimes decreases. A feature of the invention is the inclusion of bauxite (c). The bauxite system has been preferably used as a flame retardant for a printed circuit board which does not use a tooth-containing flame retardant. However, there is a problem in that the chemical resistance of the laminate is poor. It has been found that when the cyanate resin (A)-containing tree-containing composition used in the present invention is added with alumina or alkali which is hardly soluble in acid or alkali ( c) When the laminate is maintained in fire resistance and has improved chemical resistance. It has been further confirmed that the bauxite has improved weld heat resistance because the amount of crystal water of the bauxite is less than that of gibbsite, and the initial temperature of dewatering of the bauxite is higher than that of gibbsite. r has no particular limitation on the average particle diameter (D5〇) of the bauxite used in the present invention. The average particle diameter (D5〇) is preferably from 2 to 5 μf in view of dispersibility. The amount of the bauxite added is 5 Torr to 3 Torr by weight per 1 part by weight of the total amount of the cyanate resin (A) and the halogen-free epoxy resin (B). In order to reduce the coefficient of thermal expansion of the laminate in the thickness direction, it is more preferable to increase the amount of bauxite. However, when the amount of bauxite is too large, the resin varnish has a degree of 4 degrees and a direction, which may impair the handling properties and, in some cases, the mold processability. Therefore, the amount of the bauxite is particularly preferably from 8 to 25 parts by weight. The resin composition of the fork of the I #本明明 may further contain an inorganic filler different from the above-described alumina (C). Specific examples thereof include cerium oxide such as natural cerium oxide, fused vermiculite, amorphous cerium oxide and hollow silica; molybdenum compounds such as molybdenum oxide and zinc molybdate; zinc borate; stannic acid Zinc; alumina; clay; kaolin; talc; forged/burned clay; calcined kaolin; calcined talc; mica; short glass fiber (glass fine powder such as E glass or D glass) and hollow glass (hollowglass). The average particle diameter of the inorganic filler other than the water-containing mineral (C) is not specifically limited. The average particle diameter (D50) of the inorganic filler is preferably 0.297104159 12 200848257 to 5 μm in view of dispersibility. The inorganic filler is incorporated so that the total amount of the bauxite (c) and the total amount is 3 相对 per 100 parts by weight of the cyanium citrate tree (the total amount of the illusion and the non-Southern epoxy resin (B). Part by weight or less. When the amount of the inorganic filler is too large, (4) the processability is sometimes lowered. The total amount of the inorganic filler and the aqueous soil (C) is particularly preferably 25 parts by weight or less. Regarding the inorganic filler to be used in combination with the alumina (c), a decane coupling agent or a wetting and dispersing agent may be used in combination. There is no 2S limitation on the decane coupling agent as long as it is selected from ordinary decane used for surface treatment of inorganic compounds. a coupling agent. Specific examples thereof include an aminonaphthalene coupling agent such as hexamethylenepropyltrimethyl decane and hydrazine-β-(aminoethyl)-aminopropyltrimethoxyi-alkyl; epoxy decane a crosslinking agent such as y-glycidoxypropyltrimethoxydecane; a vinyl decane coupling agent such as methacryloxypropyltrimethoxydecane; a cationic decane coupling agent such as N- In case (n-vinylbenzylaminoethyl)-aminopropyltrimethoxydecane hydrochloride, · and phenyl Alkane coupling agents These decane coupling agents may be used singly or in combination as needed. The wetting and dispersing agents are not particularly limited as long as they are selected from dispersion stabilizers for coatings. Examples thereof include acid group-containing copolymer bases. Wet and powder, such as Disperbyk-11〇, 111 and 180 and BYK-W996, W9010 and W903 supplied by Big Chemie Japan. The fluorenone powder (D) used in the present invention includes polymethyl sesquiterpene ( Fine powder of polymethylsilsesquioxane), wherein the oxy-oxygen bond is three-dimensional network cross-linking; vinyl-containing dimethyl polyoxane and methyl hydrogen = methylhydr〇genp〇lySil〇xane a fine powder of an addition polymer; a 5-methyl polyoxo-oxygenated coating of ruthenium-vinyl group by polyfluorenyl sesquioxane (wherein the siloxane linkage is a three-dimensional network 97104159 13 200848257 ^ large cross-linking) a powder obtained by the surface of a fine powder of an addition polymer of succinylmethylpolyoxane; coated with a non-machine by polymethyl sesquioxane (wherein the siloxane chain is crosslinked by three-dimensional network) a powder obtained from the surface of the carrier; and the like. The powder retards the burning time and acts as a flame retardant agent for improving the fire resistance. It has been found that when compared with 100 parts by weight of the naphthol aralkyl type cyanate resin (A) and the halogen-free epoxy resin When the total amount of (B) is added to the r fluorenone powder in an amount of 5 parts by weight or more, a remarkable fire resistance effect can be obtained. The n-arylene cation type cyanate resin is replaced with respect to each hydrazine per part ( A) The amount of the anthrone powder to be added is 5 to 30 parts by weight, preferably 5 to 20 parts by weight, based on the total amount of the halogen-free epoxy resin (B). The resin composition of the prepreg of the present invention can be further Contains a bismaleimide compound. The bismaleimide compound is not particularly limited as long as it is a compound having two maleimine groups in the molecule. Specific examples thereof include bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)- Phenyl}propane, bis(3,5-dimethyl-4-maleimidophenyl)methane, bis(3-ethyl-5-mercapto-4-maleimidophenyl) Decane and bis(3,5-diethyl-4-maleimidophenyl)decane. Further, prepolymers of these bismaleimide compounds and prepolymers of such bismaleimide compounds and amine compounds can also be used. These bismaleic acid ‘imine compounds can be used singly or in combination as needed. The bismaleimide* compound is more preferably a bis(4-maleimidophenyl) fluorene, 2,2-bis{4-(4-maleimidophenoxy)-phenyl} Propane or bis(3-ethyl-5-97104159 14 200848257 mercapto-4-maleimidophenyl)decane. The resin composition of the prepreg of the present invention may further contain various high polymer compounds such as different thermosetting resins, thermoplastic resins and low polymers and elastomers thereof, different refractory compounds or additives as long as they are not damaged, and the resin composition The inherent nature of the object. There are no specific restrictions on them as long as they are selected from those commonly used. Examples of the refractory compound include a nitrogen-containing compound (e.g., melamine or benzoguanamine) and a compound containing an oxazine ring. Additives (shell examples include UV absorbers, antioxidants, photopolymerization initiators, fluorescent whitening agents, photosensitizers, dyes, pigments, thickeners, lubricants, antifoaming agents, dispersants, leveling agents, additions) A brightener and a polymerization inhibitor. They may be used in combination as needed. The base material (E) used in the present invention may be selected from known base materials for various printed wiring board materials. Examples thereof include glass, fiber (for example) E glass 'D glass, S glass and NE glass), inorganic fibers other than glass, and organic fibers (such as polyimine, polyamide, and polyester). The base material can be selected as needed according to the intended use or properties. The base material is usually in the form of a braid (WQVen fabric), a nonwoven fabric (n〇nw_faboc), a roving, a chopped strand mat or a felt. The thickness of the base material is not particularly limited. The thickness of the base material is usually about GG1 to Q. 3mm. == In the bottom material, considering the strength and water absorption, the broken glass fiber: the base material is better. The resin composition of the pre-slip of a month can be properly controlled as needed. Curing speed. The curing accelerator is not provided as long as it is selected from the group consisting of naphthol aralkyl type oleic acid vinegar resin 97104159 15 200848257 (A) or halogen-free epoxy resin (β) including organic metal salts, such as copper, And a curing accelerator for the third amine. Specific examples thereof, and nickel, imidazole and derivatives thereof, 2, the method for producing the prepreg of the present invention is not particularly limited, as long as the pot is ^ will be = naphthalene A method of producing a prepreg by combining a resin group f as a basic component and a base material (1) as a basic component of a cyanic acid (4) oxycyanate (4) (4) oxy resin: a product: = /C) and Naa (8). E.g,

The sheet may be produced by dipping a resin varnish containing the above resin composition into the base material F (4) or applying it to the base material (8), for example, by heating in a dryer (10) to 2G () t: i to 6 〇 ^ 钟 to semi-cure the impregnated or applied resin varnish. The resin composition in the prepreg sheet (IV) Μ 1 day The total amount of the inorganic filler is preferably from 2% by weight to 90% by weight based on the total weight of the prepreg. The organic solvent used for the above resin varnish is not particularly limited as long as it is a non-phenol aralkyl type cyanate resin (A) and a halogen-free epoxy resin (Β). These include ketones such as acetone, methyl ethyl ketone, decyl isobutyl ketone and cyclohexanone, aromatic hydrocarbons such as benzene, toluene and dinonylbenzene, and decylamines such as dimethylformamide and dimethyl. Acetamide. The laminate of the present invention is obtained by using the above prepreg laminate molding. Specifically, the laminate of the present invention is prepared as follows: one piece of the prepreg as above or two or more is stacked A prepreg prepared as above is provided with a metal foil such as copper foil or aluminum foil on one surface or both surfaces of the prepreg or the stacked prepreg as needed, and the obtained assembly is laminated. The metal foil is not particularly limited as long as it is selected from metal foils which can be used for the material of the printed wiring board 97104159 16 200848257. As for the molding conditions, a general manner for laminating sheets and multilayer boards for printed wiring boards can be employed. For example, using multiple layers Press, multi-layer vacuum press, Continuous molding, autoclave molding machine or the like, the temperature is usually from 1 Torr to 3 Torr, the pressure is usually from 2 to 1 〇〇 kgf/cm 2 , and the heating time is usually 〇 〇 5 to 5 hours. Further, post-curing can be carried out at 150 to 3 Torr (rc) as needed. [Embodiment] (Embodiment) Hereinafter, the present invention will be explained in detail with reference to Synthesis Examples, Examples and Comparative Examples, but the present invention It is not limited by these embodiments.

(Synthesis Example 1) Synthesis of α-naphthol aralkyl type cyanate resin

--(4) 1 〇 3 g (0H 〇 · 47 mol) of the j-naphthol aralkyl resin represented by the above formula (4) (SN485, 0 Η equivalent · · 219 g / eq •, softened Point: 86C 'supplied by Nippon Steel Chemical Co., Ltd.) / Combined with 500 liters of chloroform, and 〇 7 molar triethylamine was mixed with the resulting solution. The resulting mixture was added dropwise to a solution of 〇·93 mol gasified cyanide in 3 g of chloroform at -10 C for 1-5 hours. The mixture was stirred for 30 minutes. Further, a mixed solution of 〇1 molar triethylamine and 30 g of a gas-like mixture was added dropwise to the mixture, and the resulting mixture was stirred for 3 Torr to complete the reaction at 97104159 17 200848257. The resulting triethylamine hydrochloride was separated by filtration. The filtrate thus obtained was washed with 500 ml of 0.1 N hydrochloric acid. It was then washed 4 times with 500 ml of water. Then, the chloroform layer of the chloroform/water mixed solution was extracted via a liquid separation treatment. Sodium sulfate was added to the chloroform solution and subjected to dehydration treatment. The sodium sulfate was separated by filtration. Then, evaporation was carried out at 75 ° C and at 9 Torr. The vacuum degassing was carried out under reduced pressure to obtain a brown solid α-naphthene-based gas ester resin represented by the formula (5). The absorption of the cyanate group was confirmed in the vicinity of 2264 cm 1 in the infrared absorption spectrum. Further, the structure was confirmed by 13 C-NMR and 1 η-NMR. The percentage of conversion from the OH group to the OCN group is 99 Å/〇 or more.

• (5) Q (Synthesis Example 2) Synthesis of α-naphthol aralkyl type cyanate resin 2: It is known that α-naphthyl aryl-based cyanate resin is synthesized in the same manner as in Synthesis Example 1. Only 103 g (0 Η 〇 · 47 mol) α-naphthene aryl resin (SN485, 0 Η equivalent: 219 g/eq·, softening point · 86. 〇, by Nippon Steel Chemical Co., Ltd.) · Provided) Changed to 102 g (OH-based 0.45 mol) α-naphthol aralkyl resin (SN41〇5, 〇H base _ equivalent: 226 g/eq., softening point: 105. 〇, by Nipp〇n Steel

Chemical Co., Ltd. provided) and changed the amount of cyanide gasification from οι to 0. 90 m. 97104159 18 200848257 (Example 1) 35 parts by weight of α-naphthol aralkyl type cyanate resin synthesized in Synthesis Example 1 (cyanate equivalent: 237 g/eq·), 65 parts by weight of benzene biphenyl ~ Alkyl aryl epoxy resin (NC-3000-FH, epoxy equivalent: 320, g/eq. 'Nippon Kayaku Co., Ltd.) and 1.5 parts by weight of wetting and dispersing agent (BYK- W903, supplied by BYK chemie Japan) is soluble in methyl ethyl ketone. Further, 10 parts by weight of anthrone powder (supplied by T〇speari r 120 ' GE Toshiba Silicones), 150 parts by weight of bauxite (BN100, supplied by Kawai Lime Industrial Co., Ltd.), and 〇·02 parts by weight of zinc octoate and The resulting solution was mixed, thereby obtaining a varnish. The varnish was diluted with mercaptoethyl ketone, and the diluted varnish was immersed in an E glass cloth (specific gravity: 2.5 g/cm 3 ) having a thickness of 〇·1 house rice, and the immersion varnish was heated at 160 ° C. It was dried for 4 minutes, thereby obtaining a prepreg having a resin content of 51% by weight. (Example 2) I 64 parts by weight of a naphthol aralkyl type cyanate resin (cyanate equivalent: 237 g/eq·) synthesized in the synthesis example, 18 parts by weight of a phenol phenyl aralkyl type ring Oxygen resin (E-XLC-LL: 240 g/eq·, supplied by Nippon Kayaku Co., Ltd.), 18 parts by weight of naphthol aralkyl type epoxy resin (ESN 175' epoxy equivalent: 268 g/eq·, Tohto Kasei Co·, Ltd. |^ for), 2 zhongli Shishi burning coupling agent (040, available from Dow Corning Tor ay Co., Ltd.) and i parts by weight of wetting and dispersing agent (BYK-W996, BYK) Chemie Japan provides) soluble in mercaptoethyl ketone. In addition, ι 〇 份 石 石 石 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The zinc octoate is mixed with the resulting solution to obtain a varnish. The varnish was diluted with mercaptoethyl ketone, and the diluted varnish was immersed in a thickness of (K 1 mm E glass cloth (specific gravity: 2.5 g/cm 3 ) _), and the immersion varnish was at 160 ° C. The film was dried under heating for 4 minutes, thereby obtaining a prepreg having a resin content of 48% by weight. (Example 3) 50 parts by weight of α-naphthol aralkyl type cyanate f and ester resin synthesized in Synthesis Example 1 ( Cyanate equivalent: 237 g/eq·), 50 parts by weight of phenol novolak type epoxy resin (EPICLON N-770, epoxy equivalent: I90 g/eq., supplied by Dainippon Ink And Chemicals, Incorporated) and 1 part by weight of wetting and A dispersing agent (BYK-W996, supplied by BYK chemie Japan) was dissolved in methyl ethyl ketone. Further, 20 parts by weight of a powder of linaloone (Tospear 1 130, supplied by GE Toshiba Si 1 icones) and 3 parts by weight of molybdic acid were coated. Zinc talc (Kemgard 911C, zinc molybdate carrier: 1 〇I% by weight, supplied by Sherwin Wi 11 iams Chemicals), 120 parts by weight of water-soil (BN100, supplied by Kawai Lime Industrial Co., Ltd.), 15 parts by weight forging Burned talc (BST-200L, supplied by NIPPONTALCCO., LTD.) and 0. 02 parts by weight Zinc octoate is mixed with the obtained solution to obtain a varnish. The varnish is diluted with methyl ethyl ketone, and the diluted varnish is immersed in an E glass cloth (specific gravity: 2.5 g/cm 3 ) having a thickness of 0.1 mm. 'The immersion varnish was dried by heating at 160 ° C for 4 minutes, thereby obtaining a prepreg having a resin content of 50% by weight. (Example 4) 97104159 20 200848257 50 parts by weight of α-naphthalene synthesized in Synthesis Example 1. Phenol aralkyl type cyanate resin (cyanate equivalent: 237 g/eq.), 10 parts by weight of naphthol aralkyl type epoxy resin (ESN-175, epoxy equivalent: 268 g/eq., Tohto Kasei Co ·, provided by Ltd., 30 parts by weight of tris(hydroxyphenyl)decane type epoxy resin (EPPN-501HY, epoxy equivalent: 169g/eq·, supplied by Nippon Kayaku Co., Ltd.), 10 parts by weight of naphthalene Skeleton type epoxy resin (HP-4032D, epoxy equivalent · 140g/eq·, supplied by Dainippon Ink And Chemicals, Incorporated), 2 parts by weight of decane coupling agent (Z6040, Dow (1)

Corning Toray Co., Ltd. supplied) and 2 parts by weight of a wetting and dispersing agent (BYK-W903, supplied by BYK Chemie Japan) were dissolved in mercaptoethyl ketone. Further, 20 parts by weight of an anthrone powder (KMP-590, supplied by Shin-Etsu Chemical Co., Ltd.), 3 parts by weight of talc coated with zinc molybdate (Kemgard 911C' zinc indium titanate, 1% by weight, She rw in Williams Chemicals knows: for), 200 liters of water syllabus (BN100, supplied by Kawai Lime Industrial Co., Ltd.) and 〇· 〇 2 parts by weight of zinc octoate and mixed with the solution to obtain varnish The varnish was diluted with methyl ethyl ketone, and the diluted varnish was immersed in an E glass cloth (specific gravity: 2.5 g/cm 3 ) having a thickness of 〇·丨 mm, and the immersed varnish was dried by heating at 16 (rc). 4 minutes 'A prepreg having a resin content of 5% by weight was thus obtained. (Example 5) 55 parts by weight of a naphthol aralkyl type cyanate resin synthesized in Synthesis Example 1 (cyanate equivalent: 237 g) /eq· ), 2 parts by weight of phenol phenyl aryl-alkyl type epoxy resin (E-XLC-LL, ring gas equivalent: 24 〇g/e (1·, Nipp〇n

Kayaku Co., Ltd. provided, 20 parts by weight of phenol novolac type epoxy resin 97104159 21 200848257 (EPICLON N-770, epoxy equivalent: 190 g/eq., supplied by Dainippon Ink And Chemicals, Incorporated), 5 parts by weight of naphthalene skeleton Epoxy resin (HP-4032D, epoxy equivalent: 140g/eq·, supplied by Dainippon Ink And Chemicals, Incorporated), 2 parts by weight of Shishi burning coupling agent (Z6040, supplied by Dow Corning Toray Co., Ltd.) and 1.5 parts by weight of a wetting and dispersing agent (BYK-W903, supplied by BYK Chemie Japan) was dissolved in mercaptoethyl ketone. Further, 15 parts by weight of anthrone powder (KMP-701, supplied by Shin-Etsu Chemical Co., Ltd.), 3 parts by weight of talc coated with zinc molybdate (Kemgard 911C, zinc molybdate carrier: 10% by weight, Sherwin) Wi 11 iams Chemicals supplied), 150 parts by weight of water Mingtu (supplied by Kawai Lime Industrial Co., Ltd.) and 0.2 part by weight of zinc octoate were mixed with the resulting solution, thereby obtaining a varnish. The varnish was diluted with mercapto ethyl ketone, and the diluted varnish was immersed in an E glass cloth (specific gravity: 2.5 g/cm 3 ) having a thickness of 0.1 mm, and the immersed varnish was heated at 160 ° C. It was dried for 4 minutes, thereby obtaining a prepreg having a resin content of 51 I by weight. (Example 6) 55 parts by weight of α-naphthol aralkyl type cyanate resin synthesized in Synthesis Example 1 (cyanate equivalent: 237 g/eq·), 20 parts by weight of phenol biphenyl aralkyl type Epoxy resin (NC-3000-FH, epoxy equivalent: 320 g/eq·, supplied by Nippon Kayaku Co., Ltd.), 20 parts by weight of tris(phenyl) decane type epoxy resin (EPPN-501HY, Epoxy equivalent: 169 g/eq·, ^ supplied by Nippon Kayaku Co., Ltd.), 5 parts by weight of naphthalene skeleton type epoxy resin (HP-4032D, epoxy equivalent · 140 g/eq·, Dainippon Ink And 97104159 22 200848257

Chemicals, Incorporated supplied), 2 parts by weight of a decane coupling agent (Z6040, supplied by Dow Corning Toray Co., Ltd.), and 1 part by weight of a wetting and dispersing agent (BYK-W903, supplied by BYK chemie Japan) dissolved in hydrazine Ketoethyl ketone. Further, 10 parts by weight of a powder of linaloone (T〇Spear 1 130, supplied by GE Toshiba Silicones), 3 parts by weight of talc coated with zinc citrate (Kemgard 911C, zinc molybdate carrier: 10% by weight, sherwin Wi 11 iams) Provided by Chemicals), 120 parts by weight of bauxite (BN100,

Provided by Kawai Lime Industrial Co., Ltd., 15 parts by weight of spherical synthetic cerium oxide (SC-2050, supplied by ADMATECHS CO·, LTD) and 0. 02 parts by weight of zinc octoate were mixed with the resulting solution, thereby obtaining a varnish. The varnish was diluted with mercaptoethyl ketone, and the diluted varnish was immersed in an E glass cloth (specific gravity: 2.5 g/cm3) having a thickness of 0.1 mm, and the immersed varnish was heated at 16 0 C. It was dried for 4 minutes, thereby obtaining a prepreg having a resin content of 5% by weight. (Example 7) 50 parts by weight of α-naphthol aralkyl type cyanate resin synthesized in Synthesis Example 1 (cyanate equivalent: 237 g/eq·), 50 parts by weight of phenol biphenyl aralkyl type Epoxy resin (NC-3000-FH, epoxy equivalent: 320 g/eq., supplied by Nippon Kayaku Co., Ltd.) and 2 parts by weight of a calcining coupling agent (Z6040, supplied by Dow Corning Toray Co., Ltd.) Soluble in methyl ethyl ketone. Further, 5 parts by weight of an anthrone powder (KMP-590, supplied by Shin-Etsu Chemical Co., Ltd.), 3 parts by weight of talc coated with zinc molybdate (Kemgard 911C' zinc indium titanate: 1% by weight, 80 parts by weight of bauxite from Sherwin Williams Chemicals (BN100, Kawai Lime 97104159 23 200848257

Industrial Co., Ltd. provided) and 〇·〇 2 parts by weight of octanoic acid and mixed with the obtained solution, thereby obtaining a varnish. The varnish was diluted with decylethyl g. The diluted varnish was immersed in an E-glass cloth (ratio weight: 2. 5 g/cm3) having a thickness of 〇·1 mm, and the varnish immersed in 16 〇. . The underarm was heated and dried for 4 minutes, thereby obtaining a prepreg having a resin content of 48% by weight. (Example 8) 45 parts by weight of α-naphthol aralkyl type cyanate f-ester resin synthesized in Synthesis Example 1 (cyanate equivalent: 2378/^9.), 28 parts by weight of phenyl phenylene group &quot ; aralkyl type epoxy resin (NC-3000-FH, epoxy equivalent: 320g/eq., supplied by Nippon Kayaku Co., Ltd.), 27 parts by weight of three (powdered) decane type epoxy resin ( EPPN-501HY, epoxy equivalent: l69g/eq., supplied by Nippon Kayaku Co., Ltd.), 2 parts by weight of decane coupling agent (Z6040, supplied by Dow Corning Toray Co., Ltd.), and ι·5 parts by weight Wet and dispersant (BYK-W903, supplied by BYK chemie Japan) Dissolved in methyl ethyl ketone. Further, 10 parts by weight of a powder of linaloone (KMP-goo, supplied by Shin-Etsu Chemical Co., Ltd.), 3 parts by weight of talc coated with zinc silicate (Kemgard 911C, zinc molybdate carrier: 1 〇 weight %, supplied by Sherwin Williams Chemicals), 250 parts by weight of water forum (BN100, supplied by Kawai Lime Industrial Co., Ltd.) and 0. 02 parts by weight of octanoic acid were mixed with the resulting solution, thereby obtaining a varnish. The varnish was diluted with methyl ethyl ketone, and the diluted varnish was immersed in an E glass cloth (specific gravity: 2·5 g/cm3) having a thickness of ♦ 〇·1 mm, and the immersed 'varnish was at 160 ° C. It was dried by heating for 4 minutes, thereby obtaining a prepreg having a resin content of 51% by weight. 97104159 24 200848257 (Example 9) 70 parts by weight of α-naphthol aralkyl type cyanate resin synthesized in Synthesis Example 1 (cyanate equivalent: 237 g/eq·), 15 parts by weight of phenylbiphenyl. Aralkyl type epoxy resin (NC-3000-FH, epoxy equivalent: 320 g/eq., supplied by NiPP〇n Kayaku Co., Ltd.), 15 parts by weight of phenol novolac type epoxy resin (EPICLON N-770) , epoxy equivalent: I90g / eq ·, supplied by Dainippon Ink And Chemicals, Incorporated) and (1 reset part of the wetting and dispersing agent (BYK-W996, BYK chemie Japan) is dissolved in mercapto ethyl ketone. 15 parts by weight of anthrone powder (Tospear 1 130, supplied by GE Toshiba Si 1 icones), 80 parts by weight of water! Lu (BN100, supplied by Kawai Lime Industrial Co., Ltd.), 20 parts by weight of calcined talc (BST) -200L, supplied by NIPPON TALC CO., LTD.) and (K〇i parts by weight of zinc octoate mixed with the obtained solution to obtain a varnish. The varnish is diluted with mercaptoethyl ketone so that the diluted varnish is immersed in thickness 0. 1 mm E glass cloth (specific gravity: 2·5 g/cm3), I and immersed varnish at 160 ° C It was dried by heating for 4 minutes, thereby obtaining a prepreg having a resin content of 49% by weight. (Example 10) The α-naphthol aralkyl type cyanate obtained in Synthesis Example 1 except the one used in Synthesis Example 7 was used. The resin (cyanate equivalent: 237 g/eq·) was replaced with the α-naphthol aralkyl type cyanate resin obtained in Synthesis Example 2 (cyanate ester when the amount: 244 g/eq.), and was carried out in accordance with The pre-dip sheet was obtained in the same manner as in Example 7. (Example 11) 97104159 25 200848257 The α-naphthol aralkyl type cyanate resin (cyanic acid) obtained in Synthesis Example 1 used in Example 8 was used. The ester equivalent: 237 g/eq·) was changed to the same as in Example 8 except for the α-naphthol aralkyl type cyanate resin (cyanate equivalent 244 g/eq·) obtained in Synthesis Example 2. The prepreg was obtained in a manner. (Comparative Example 1) In addition to 150 parts by weight of bauxite (BN100, used in Example 1)

A prepreg sheet was obtained in the same manner as in Example 1 except that 150 parts by weight of hydrated dihydrate (provided by Ilu CL303, supplied by Sumi tomo Chemical Co. Ltd.) was replaced by 150 liters of Kawai Lime Industrial Co., Ltd. (Comparative Example 2) Except that 80 parts by weight of bauxite (BS1〇(), used in Example 2,

A prepreg sheet was obtained in the same manner as in Example 2 except that 80 parts by weight of gibbsite (aluminum hydroxide CL303, supplied by Sumitomo Chemical c. Ltd.) was replaced by Kawai Lime Industrial Co., Ltd.). (Comparative Example 3) A prepreg sheet was obtained in the same manner as in Example 3 except that 20 parts by weight of (tetra) iridium powder (T〇spearl 130, supplied by GEToshibaSilic〇nes) used in Example 3 was not used. (Comparative Example 4) A pre-soaked portion of the linaloic acid powder L was obtained in the same manner as in Example 4 (Comparative Example 5) 4 except that the chemical solution was used in the same manner as in Example 4 (KMP-590, Shin-Etsu). Td · provided), outside the film. 97104159 26 200848257 In addition to 200 parts by weight of bauxite (BN 100, supplied by Kawai Lime Industrial Co., Ltd.) used in Comparative Example 4, 200 parts by weight of Sanshui I Lu Shi (Sumi tomo Chemical) was used. A prepreg sheet was obtained in the same manner as in Comparative Example 4 except for Co. Ltd., provided. (Comparative Example 6) Except that 55 parts by weight of α-naphthol aralkyl type cyanate resin (cyanate equivalent: 237 g/eq·) used in Example 5 was changed to 55 parts by weight of 2, 2-dual ( Prepolymer of 2-, 2-bis(4-cyanatopheny 1) f'' propane) (BT2070, cyanate equivalent: 139 g/eq., Mitsubishi Gas Chemical Company, Inc. A prepreg sheet was obtained in the same manner as in Example 5 except that it was provided. (Comparative Example 7) Except that 55 parts by weight of α-naphthylarylsulfonate & cyanate resin (cyanate equivalent: 237 g/eq.) used in Example 6 was changed to 55 parts by weight of phenol novolac type. A prepreg was obtained in the same manner as in Example 6 except for cyanate ester (PT-30, cyanate equivalent: 126 g/eq., supplied by Ldnza). (Comparative Example 8) 50 parts by weight of a prepolymer of 2,2-bis(4-cyanoindolephenyl)propene (BT2070, cyanate equivalent: 139 g/eq·, Mitsubishi Gas

Chemical Company, Inc.), 50 parts by weight of a phenyl phenylene aralkyl type epoxy resin (NC-3000-FH, epoxy equivalent: 320 g/e (L, supplied by Nippon Kayaku Co., Ltd.), 10 parts by weight of Shixi_powder' (Tospear 1 120, supplied by GE Toshiba Si 1 icones), 15Q parts by weight of spherical fused vermiculite (SC2050MI^, ADMATECHS CO·, LTD, 97104159 27 200848257), 2 parts by weight of decane A mixture of Z6〇4〇, D〇wc〇rning T (provided by ^ay, Ltd.) and 0.01 part by weight of octanoic acid, thereby obtaining a varnish, the varnish is diluted with mercaptoethyl ketone, and the diluted varnish is obtained. Immersed in an E glass cloth (specific gravity: 2.5 g/cm3) having a thickness of 0.1 mm, and heat-dried the immersed * varnish at 16 ° C for 4 minutes, thereby obtaining a prepreg having a resin content of 50% by weight. [Preparation of Metallic Foil Laminate 1] (The four prepregs obtained in Example 1 were stacked, and an 18 μm thick electrolytic copper foil was placed on the upper and lower surfaces of the stacked prepreg (3EC- III, Mitsui Mining and Smelting Co·, Ltd.), a piece of copper foil on the upper surface, one on the lower surface Copper foil, and the obtained member was laminated and molded at a pressure of 30 kgf/cm 2 and a temperature of 220 ° C for 12 minutes to obtain a copper clad laminate having an insulating layer thickness of 0.4 mm. 2 to 11 and the prepreg obtained in Comparative Examples 丨 to 8, whereby copper-clad I laminated sheets each having an insulating layer thickness of 0.4 mm were respectively obtained. [Preparation of Metal-clad Laminate 2] Eight Examples The prepreg obtained in 1 was stacked, and an 18 μm thick electrolytic copper box (3EC-III, supplied by Mitsui Mining and Smelting Co., Ltd.) was placed on the upper and lower surfaces of the stacked prepreg, on the upper surface. a piece of copper foil, a piece of copper foil on the lower surface, and the resulting element is laminated and molded at a pressure of 30 kgf/cm2 and a temperature of 220 ° C for 12 minutes to obtain an insulation thickness of 0.8 mm. Copper-clad laminate. The prepreg 97104159 28 200848257 sheets obtained in Examples 2 to 11 and Comparative Examples 1 to 8 were similarly processed, whereby copper-clad laminates each having an insulating layer thickness of 〇·8 mm were obtained, respectively. [Preparation of metal foil-clad laminate 3], which will be obtained in two examples 1. Prepreg sheets are stacked, and 18 μm thick electrolytic copper foil (3EC-III, supplied by Mitsui Mining and Smelting Co., Ltd.) is placed on the upper and lower surfaces of the stacked prepreg. Copper foil, a piece of copper foil on the lower surface, and obtained (the component was laminated and molded at a pressure of 30 kgf/cm 2 and a temperature of 220 ° C for 120 ' minutes to obtain a thickness of the insulating layer having a thickness of 〇 2 mm. Copper laminate. The prepregs obtained in Examples 2 to 11 and Comparative Examples 1 to 8 were similarly processed, whereby copper-clad laminates each having an insulating layer thickness of 〇 2 mm were obtained, respectively. The glass transition temperature, the coefficient of thermal expansion, the heat resistance to soldering, and the heat resistance after moisture absorption of the metal-clad laminate 1 were evaluated. In the evaluation of the glass transition temperature and the coefficient of thermal expansion, a metal foil was deposited (the laminate 1 was etched to remove the copper foil, a sample was obtained, and the sample was used. In the evaluation of solder heat resistance, a metal foil-clad laminate was used. In the evaluation of heat resistance after moisture absorption, a copper foil of a metal foil-clad laminate was removed by etching instead of a copper foil on a half of its surface to obtain a sample, and the sample was used. Glass transfer temperature: The sample was measured according to JIS C6481 using a dynamic viscoelastic analyzer (supplied by TA Instruments) 'Coefficient of thermal expansion: using a thermomechanical analyzer (supplied by TA Instruments) from 40 ° C to 34 (TC at 1 (TC/min) The heating rate increases the temperature of the sample. 97104159 29 200848257 Group 60〇 to 120. (: Measure the linear expansion coefficient of the sample in the thickness direction. For the heat of the zen: dry the sample of 5 cm χ 5 cm under ιΐ5^ for 20 hours. Then, the sample was floated in a tan bath (cutting bath) and the time elapsed before the sample was swollen was measured. The symbol of solder heat resistance in Table 1 has the following meaning: Does not swell after 30 minutes or more. χ : The sample swells before 3 minutes has elapsed. Heat resistance after moisture absorption: The sample of the size cm is dried at 115 ° C. for 20 hours. Then the sample is cooked by pressure. Pressure co〇ker testing machine (pc_3 type,

Manufacturing C〇rporation provides) treatment at 121 and 2 atmospheres for 4 hours, then immersing the sample in a 26 °c solder bath for 6 sec and visually detecting the presence of swelling. The symbols of heat resistance after moisture absorption in Table 1 have the following meanings. 〇·· No defects were found. △: Measling appears. x••Swells. The copper foil-clad laminates and the copper foil of 2 were removed by etching, and then the fire resistance of the laminate was evaluated by the following method. Combustion test · According to the UL 94 vertical burning test method. In Table 1, "fire resistance 1" indicates the result of the metal-coated pig laminate 2, and "fire resistance 2" indicates the result of the metal foil-clad laminate 2. The copper foil of the metal foil-clad laminate 3 was removed by etching, and then the testability and acidity of the shell layer were measured by the following method 4. Alkali resistance: a sample of 5 cm χ 5 cm in size (^ at 115. Dry for 20 hours under sputum) (2) 7 (TC immersed in 1N sodium hydroxide solution 6 〇 97104159 30 200848257 minutes, then (3) at Dry at 115 ° C for 2 hours. Then measure the rate of change of weight. Calculate the rate of change of weight according to the following formula: Weight change rate [weight magic = (wi-W2) xi00 / W1 which represents the weight of the sample after (1), W2 represents (3) Weight of the sample afterwards. Acid resistance · Samples of size 5 cm x 5 cm (4) were dried for 20 hours, (5) 6 (circulated in 4N hydrochloric acid solution for 6 minutes, then (6) Dry at 115 ° C for 20 hours. Then measure the rate of change of weight. Calculate the rate of change of weight according to the following formula: Weight change rate [% by weight] = (W3-W4) X100/W3 where W3 represents the weight of the sample after (4), W4 represents the weight of the sample after (6). The symbols of alkali resistance and acid resistance in Table 1 have the following meanings: 〇: the rate of change in weight is less than 0.1% by weight. x: the rate of change in weight is 〇·1% by weight or more. Big 0 Table 1

Ex71~ Ex. 2 Ex. 3 Ex. 4 Ex. 6 Glass transition temperature (°c) 229.6 238. 8 255. 8 260.3 263. 9 Thermal expansion coefficient (ppm/°C) 33. 8 42. 5 32. 1 23 9 _28j_ 34. 3 Welded heat 〇〇〇〇〇 ________' 耐热 After heat absorption, heat 〇〇〇〇〇 〇〇〇〇〇 alkaline 〇〇〇〇〇 acid resistance 〇〇〇〇〇 火 1 v-0 V-〇v-0 v-0 v - 〇v-0 fire resistance 2 ν~Π — n v-fl V- 〇v-0 Εχ·=Example 97104159 31 200848257 Table 1 (Continued)

Ex. 7 Ex. 8 Ex. 9 Ex. 10 Ex. 11 Glass transition temperature (°c) 233. 0 241. 7 250. 1 232. 2 242. 8 Thermal expansion coefficient (ppm/°C) 40. 5 23. 8 43. 7 40. 2 23. 9 Resistance to soldering heat 耐热 Heat resistance after moisture absorption 〇〇〇〇〇 〇〇〇〇〇 〇〇〇〇〇 - Acid resistance 〇〇〇〇 Fire resistance 1 v-0 v -0 v-0 v-0 v-〇 fire resistance, 2 v-0 v-0 v-0 v-0 v-0 ί Ε χ ·=Example Table 1 (continued)

Table 1 shows that the chemical resistance and solder heat resistance of Examples 1 to 11 of the present invention are superior to those of Comparative Example 1, 2 ^ Be fine * Examples 1 to 11 each using gibbsite as a flame retardant. Comparative Examples 6 and 8 and Comparative Examples 6 and 8 each using a prepolymer of 2,2-bis(4-cyanophenyl)propane; and Example 1 to The heat resistance after moisture absorption of 11 was superior to that of Comparative Example 7 using a phenol novolac type cyanate. Therefore, it has been confirmed that the laminate of the prepreg obtained according to the present invention has excellent chemical resistance 97104159 32 200848257 property, high glass transition temperature and excellent heat resistance, and can be used without using a halogen-containing flame retardant. Understand UL94V-0 fire resistance.

97104159 33

Claims (1)

200848257 X. Patent application scope: The pre-/slice 'inclusion-resin composition and the base material (E), :, and the beneficial substance contains the naphthol aralkyl type cyanate tree represented by formula (1) :i Oxygen resin (8), water Ming soil (C) and tantalum powder (1), relative to | 1GQ parts by weight of naphthalene aromatic base type cyanate resin) The total amount of human non-epoxy resin (B) m ( The amount of G) is Γ^3 (3Λ reread, and relative to the total amount of the naphthalene-based aryl-based sulphur ester resin (1) and the no-(tetra) oxy-resin (B) per 1 GG parts by weight, the linalool powder (D) The amount is 5 to 3 parts by weight, C - I R OCN Η . (1) wherein R represents a hydrogen atom or a fluorenyl group, and an integer of Q i to 50. 2.=Application of the prepreg according to item i of the patent range, wherein the number of cyanate ester ((3)) groups in the naphthyl aralkyl type cyanate resin (A) in the resin composition is a halogen-free epoxy resin The ratio (CN/Ep) between the number of epoxy (Ep) groups in (B) is in the range of 〇·7 to 2.5. 3. A laminate which is obtained by curing the dipstick of the scope of the patent application. And a metal-clad laminate which is obtained by laminating a prepreg and a metal foil of the first application of the patent application and curing the pre-production with the metal foil. , '97104159 34 200848257 VII. Designated representative map: (1) The representative representative of the case is: No (2) The symbol of the symbol of the representative figure is simple: No. If there is a chemical formula in this case, please reveal the characteristics that can best show the invention. Chemical formula: OCN OCN C R / rL R •Η •(1) 97104159 4