FR2844394B1 - Substrat en silicium monocristallin, substrat de type soi, dispositif a semi-conducteur, dispositif d'affichage, et procede de fabrication d'un dispositif a semi-conducteur - Google Patents
Substrat en silicium monocristallin, substrat de type soi, dispositif a semi-conducteur, dispositif d'affichage, et procede de fabrication d'un dispositif a semi-conducteurInfo
- Publication number
- FR2844394B1 FR2844394B1 FR0311250A FR0311250A FR2844394B1 FR 2844394 B1 FR2844394 B1 FR 2844394B1 FR 0311250 A FR0311250 A FR 0311250A FR 0311250 A FR0311250 A FR 0311250A FR 2844394 B1 FR2844394 B1 FR 2844394B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- soi
- monocrystalline silicon
- silicon substrate
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title 1
Classifications
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/78654—Monocrystalline silicon transistors
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
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- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002280078 | 2002-09-25 | ||
JP2002299577A JP2004134675A (ja) | 2002-10-11 | 2002-10-11 | Soi基板、表示装置およびsoi基板の製造方法 |
JP2003067109A JP4837240B2 (ja) | 2002-09-25 | 2003-03-12 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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FR2844394A1 FR2844394A1 (fr) | 2004-03-12 |
FR2844394B1 true FR2844394B1 (fr) | 2007-06-08 |
Family
ID=34279455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0311250A Expired - Fee Related FR2844394B1 (fr) | 2002-09-25 | 2003-09-25 | Substrat en silicium monocristallin, substrat de type soi, dispositif a semi-conducteur, dispositif d'affichage, et procede de fabrication d'un dispositif a semi-conducteur |
Country Status (5)
Country | Link |
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US (3) | US7508034B2 (fr) |
KR (2) | KR100693881B1 (fr) |
CN (2) | CN101694847A (fr) |
FR (1) | FR2844394B1 (fr) |
TW (1) | TWI260746B (fr) |
Families Citing this family (297)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7508034B2 (en) * | 2002-09-25 | 2009-03-24 | Sharp Kabushiki Kaisha | Single-crystal silicon substrate, SOI substrate, semiconductor device, display device, and manufacturing method of semiconductor device |
US7253040B2 (en) * | 2003-08-05 | 2007-08-07 | Sharp Kabushiki Kaisha | Fabrication method of semiconductor device |
JP2005150686A (ja) * | 2003-10-22 | 2005-06-09 | Sharp Corp | 半導体装置およびその製造方法 |
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JP4794810B2 (ja) * | 2003-03-20 | 2011-10-19 | シャープ株式会社 | 半導体装置の製造方法 |
JP4105044B2 (ja) * | 2003-06-13 | 2008-06-18 | 株式会社東芝 | 電界効果トランジスタ |
WO2006117900A1 (fr) * | 2005-04-26 | 2006-11-09 | Sharp Kabushiki Kaisha | Procédé de production d’un dispositif semi-conducteur et dispostif semi-conducteur |
JP5142831B2 (ja) * | 2007-06-14 | 2013-02-13 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
US8114722B2 (en) * | 2007-08-24 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US8314009B2 (en) * | 2007-09-14 | 2012-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate and method for manufacturing semiconductor device |
US20090117708A1 (en) * | 2007-11-01 | 2009-05-07 | Sumco Corporation | Method for manufacturing soi substrate |
US7842583B2 (en) * | 2007-12-27 | 2010-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
JP2011077504A (ja) * | 2009-09-02 | 2011-04-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP5713603B2 (ja) * | 2009-09-02 | 2015-05-07 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
-
2003
- 2003-09-24 US US10/668,186 patent/US7508034B2/en not_active Expired - Fee Related
- 2003-09-25 CN CN200910207679A patent/CN101694847A/zh active Pending
- 2003-09-25 FR FR0311250A patent/FR2844394B1/fr not_active Expired - Fee Related
- 2003-09-25 TW TW092126486A patent/TWI260746B/zh not_active IP Right Cessation
- 2003-09-25 KR KR1020030066670A patent/KR100693881B1/ko not_active IP Right Cessation
- 2003-09-25 CN CNB03159798XA patent/CN100573824C/zh not_active Expired - Fee Related
-
2005
- 2005-12-19 KR KR1020050125315A patent/KR100641209B1/ko not_active IP Right Cessation
-
2008
- 2008-09-29 US US12/240,428 patent/US20090095956A1/en not_active Abandoned
-
2011
- 2011-09-30 US US13/250,220 patent/US20120012972A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FR2844394A1 (fr) | 2004-03-12 |
CN101694847A (zh) | 2010-04-14 |
KR20040027418A (ko) | 2004-04-01 |
US20040061176A1 (en) | 2004-04-01 |
TWI260746B (en) | 2006-08-21 |
TW200416965A (en) | 2004-09-01 |
CN100573824C (zh) | 2009-12-23 |
US20120012972A1 (en) | 2012-01-19 |
KR100641209B1 (ko) | 2006-11-01 |
US7508034B2 (en) | 2009-03-24 |
CN1492481A (zh) | 2004-04-28 |
KR20060004623A (ko) | 2006-01-12 |
KR100693881B1 (ko) | 2007-03-13 |
US20090095956A1 (en) | 2009-04-16 |
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