FR2382770A1 - Procede de formation de tres petites ouvertures de contact dans un dispositif de circuit integre - Google Patents
Procede de formation de tres petites ouvertures de contact dans un dispositif de circuit integreInfo
- Publication number
- FR2382770A1 FR2382770A1 FR7817175A FR7817175A FR2382770A1 FR 2382770 A1 FR2382770 A1 FR 2382770A1 FR 7817175 A FR7817175 A FR 7817175A FR 7817175 A FR7817175 A FR 7817175A FR 2382770 A1 FR2382770 A1 FR 2382770A1
- Authority
- FR
- France
- Prior art keywords
- forming
- integrated circuit
- circuit device
- contact openings
- small contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/35—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices with charge storage in a depletion layer, e.g. charge coupled devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Abstract
La présente invention concerne un procédé de fabrication de dispositif à semiconducteur. Selon ce procédé, on prévoit en cours de fabrication, la formation de couches de silicium polycristallin de recouvrement qui sont disposées au-dessus de portions sélectionnées d'un substrat semiconducteur 12 et isolées du substrat ainsi que l'une de l'autre. Application notamment à la fabrication de mémoires à accès aléatoire.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76239877A | 1977-01-26 | 1977-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2382770A1 true FR2382770A1 (fr) | 1978-09-29 |
FR2382770B1 FR2382770B1 (fr) | 1983-06-03 |
Family
ID=25064929
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7802068A Granted FR2382768A1 (fr) | 1977-01-26 | 1978-01-25 | Procede de preparation d'une surface de substrat d'un dispositif semiconducteur isoplanar |
FR7817173A Granted FR2382769A1 (fr) | 1977-01-26 | 1978-06-08 | Procede de fabrication de couches de silicium polycristallin a haute definition |
FR7817175A Granted FR2382770A1 (fr) | 1977-01-26 | 1978-06-08 | Procede de formation de tres petites ouvertures de contact dans un dispositif de circuit integre |
FR7817174A Granted FR2382767A1 (fr) | 1977-01-26 | 1978-06-08 | Procede de fabrication de dispositif semiconducteur |
FR7817176A Granted FR2382745A1 (fr) | 1977-01-26 | 1978-06-08 | Cellule de memoire |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7802068A Granted FR2382768A1 (fr) | 1977-01-26 | 1978-01-25 | Procede de preparation d'une surface de substrat d'un dispositif semiconducteur isoplanar |
FR7817173A Granted FR2382769A1 (fr) | 1977-01-26 | 1978-06-08 | Procede de fabrication de couches de silicium polycristallin a haute definition |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7817174A Granted FR2382767A1 (fr) | 1977-01-26 | 1978-06-08 | Procede de fabrication de dispositif semiconducteur |
FR7817176A Granted FR2382745A1 (fr) | 1977-01-26 | 1978-06-08 | Cellule de memoire |
Country Status (5)
Country | Link |
---|---|
JP (10) | JPS5394190A (fr) |
DE (1) | DE2802048A1 (fr) |
FR (5) | FR2382768A1 (fr) |
GB (5) | GB1595543A (fr) |
IT (1) | IT1089299B (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1089299B (it) * | 1977-01-26 | 1985-06-18 | Mostek Corp | Procedimento per fabbricare un dispositivo semiconduttore |
JPS5713772A (en) * | 1980-06-30 | 1982-01-23 | Hitachi Ltd | Semiconductor device and manufacture thereof |
GB2290167B (en) * | 1994-06-08 | 1999-01-20 | Hyundai Electronics Ind | Method for fabricating a semiconductor device |
US9954176B1 (en) | 2016-10-06 | 2018-04-24 | International Business Machines Corporation | Dielectric treatments for carbon nanotube devices |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3429029A (en) * | 1963-06-28 | 1969-02-25 | Ibm | Semiconductor device |
DE2018027A1 (de) * | 1969-04-15 | 1970-10-22 | Tokyo Shibaura Electric Co. Ltd., Kawasaki (Japan) | Verfahren zum Einbringen extrem feiner öffnungen |
DE2134385A1 (de) * | 1970-07-10 | 1972-02-03 | Motorola Inc | Maskier verfahren für Halbleiteranordnungen |
US3810795A (en) * | 1972-06-30 | 1974-05-14 | Ibm | Method for making self-aligning structure for charge-coupled and bucket brigade devices |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1175392A (en) * | 1966-09-14 | 1969-12-23 | Hitachi Ltd | Method of Treating Protective Coatings for Semiconductor Devices |
US3590477A (en) | 1968-12-19 | 1971-07-06 | Ibm | Method for fabricating insulated-gate field effect transistors having controlled operating characeristics |
US3825997A (en) * | 1969-10-02 | 1974-07-30 | Sony Corp | Method for making semiconductor device |
DE2040180B2 (de) | 1970-01-22 | 1977-08-25 | Intel Corp, Mountain View, Calif. (V.St.A.) | Verfahren zur verhinderung von mechanischen bruechen einer duennen, die oberflaeche eines halbleiterkoerpers ueberdeckende isolierschichten ueberziehenden elektrisch leitenden schicht |
US3811974A (en) * | 1971-07-19 | 1974-05-21 | North American Rockwell | Silicon nitride-silicon oxide etchant |
JPS5112507B2 (fr) | 1971-10-22 | 1976-04-20 | ||
JPS5139835B2 (fr) * | 1971-12-27 | 1976-10-29 | ||
DE2218035A1 (de) * | 1972-04-14 | 1973-10-31 | Vepa Ag | Verfahren und vorrichtung zum kontinuierlichen fixieren und schrumpfen von synthese-fasern |
DE2320195A1 (de) | 1972-04-24 | 1973-12-13 | Standard Microsyst Smc | Durch ionenimplantation hergestellter speicherfeldeffekt-transistor mit siliciumbasis |
JPS5910073B2 (ja) * | 1972-10-27 | 1984-03-06 | 株式会社日立製作所 | シリコン・ゲ−トmos型半導体装置の製造方法 |
US3898105A (en) * | 1973-10-25 | 1975-08-05 | Mostek Corp | Method for making FET circuits |
JPS50123274A (fr) * | 1974-03-15 | 1975-09-27 | ||
JPS5912495B2 (ja) | 1974-10-01 | 1984-03-23 | カブシキガイシヤ ニツポンジドウシヤブヒンソウゴウケンキユウシヨ | 衝突検知装置 |
US3984822A (en) * | 1974-12-30 | 1976-10-05 | Intel Corporation | Double polycrystalline silicon gate memory device |
JPS51114079A (en) * | 1975-03-31 | 1976-10-07 | Fujitsu Ltd | Construction of semiconductor memory device |
JPS51118393A (en) * | 1975-04-10 | 1976-10-18 | Matsushita Electric Ind Co Ltd | Semicondector unit |
JPS51118392A (en) | 1975-04-10 | 1976-10-18 | Matsushita Electric Ind Co Ltd | Manuforcturing process for semiconductor unit |
US4002511A (en) * | 1975-04-16 | 1977-01-11 | Ibm Corporation | Method for forming masks comprising silicon nitride and novel mask structures produced thereby |
US4012757A (en) * | 1975-05-05 | 1977-03-15 | Intel Corporation | Contactless random-access memory cell and cell pair |
JPS51142982A (en) * | 1975-05-05 | 1976-12-08 | Intel Corp | Method of producing single crystal silicon ic |
JPS51139263A (en) * | 1975-05-28 | 1976-12-01 | Hitachi Ltd | Method of selective oxidation of silicon substrate |
NL7506594A (nl) * | 1975-06-04 | 1976-12-07 | Philips Nv | Werkwijze voor het vervaardigen van een halfge- leiderinrichting en halfgeleiderinrichting ver- vaardigd met behulp van de werkwijze. |
IT1061530B (it) * | 1975-06-12 | 1983-04-30 | Ncr Co | Metodo per la formazione di connessioni elettriche in regioni selezionate di una superficie di un dispositivo semiconduttore a circuito integrato |
DE2532594B2 (de) * | 1975-07-21 | 1980-05-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiterspeicher |
GB1540450A (en) | 1975-10-29 | 1979-02-14 | Intel Corp | Self-aligning double polycrystalline silicon etching process |
JPS6034270B2 (ja) * | 1976-01-12 | 1985-08-07 | テキサス・インスツルメンツ・インコ−ポレイテツド | 半導体メモリ装置およびその製造方法 |
US4240092A (en) | 1976-09-13 | 1980-12-16 | Texas Instruments Incorporated | Random access memory cell with different capacitor and transistor oxide thickness |
US4112575A (en) * | 1976-12-20 | 1978-09-12 | Texas Instruments Incorporated | Fabrication methods for the high capacity ram cell |
IT1089299B (it) * | 1977-01-26 | 1985-06-18 | Mostek Corp | Procedimento per fabbricare un dispositivo semiconduttore |
FR2584786B1 (fr) * | 1985-07-15 | 1989-10-27 | Valeo | Montage de butee de debrayage et butee de debrayage propre a un tel montage |
-
1977
- 1977-12-30 IT IT31506/77A patent/IT1089299B/it active
-
1978
- 1978-01-18 DE DE19782802048 patent/DE2802048A1/de active Granted
- 1978-01-25 GB GB3022/78A patent/GB1595543A/en not_active Expired
- 1978-01-25 GB GB32524/79A patent/GB1595546A/en not_active Expired
- 1978-01-25 FR FR7802068A patent/FR2382768A1/fr active Granted
- 1978-01-25 GB GB32525/79A patent/GB1595547A/en not_active Expired
- 1978-01-25 GB GB19043/80A patent/GB1595548A/en not_active Expired
- 1978-01-25 GB GB32523/79A patent/GB1595545A/en not_active Expired
- 1978-01-26 JP JP679578A patent/JPS5394190A/ja active Pending
- 1978-06-08 FR FR7817173A patent/FR2382769A1/fr active Granted
- 1978-06-08 FR FR7817175A patent/FR2382770A1/fr active Granted
- 1978-06-08 FR FR7817174A patent/FR2382767A1/fr active Granted
- 1978-06-08 FR FR7817176A patent/FR2382745A1/fr active Granted
-
1981
- 1981-08-07 JP JP56123141A patent/JPS5760852A/ja active Pending
-
1987
- 1987-01-29 JP JP62017430A patent/JPS62290152A/ja active Granted
- 1987-01-29 JP JP62017431A patent/JPS62290181A/ja active Pending
- 1987-01-29 JP JP62017429A patent/JPS62290180A/ja active Pending
- 1987-01-29 JP JP62017428A patent/JPS62290147A/ja active Pending
-
1991
- 1991-08-19 JP JP1991065301U patent/JPH04107840U/ja active Pending
-
1995
- 1995-10-09 JP JP7261151A patent/JPH098299A/ja active Pending
- 1995-10-09 JP JP7261375A patent/JP2720911B2/ja not_active Expired - Lifetime
- 1995-10-09 JP JP7261450A patent/JPH0918003A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3429029A (en) * | 1963-06-28 | 1969-02-25 | Ibm | Semiconductor device |
DE2018027A1 (de) * | 1969-04-15 | 1970-10-22 | Tokyo Shibaura Electric Co. Ltd., Kawasaki (Japan) | Verfahren zum Einbringen extrem feiner öffnungen |
DE2134385A1 (de) * | 1970-07-10 | 1972-02-03 | Motorola Inc | Maskier verfahren für Halbleiteranordnungen |
US3810795A (en) * | 1972-06-30 | 1974-05-14 | Ibm | Method for making self-aligning structure for charge-coupled and bucket brigade devices |
Also Published As
Publication number | Publication date |
---|---|
JPS62290181A (ja) | 1987-12-17 |
FR2382768B1 (fr) | 1983-06-10 |
FR2382770B1 (fr) | 1983-06-03 |
JPH0917799A (ja) | 1997-01-17 |
JP2720911B2 (ja) | 1998-03-04 |
JPH04107840U (ja) | 1992-09-17 |
IT1089299B (it) | 1985-06-18 |
GB1595546A (en) | 1981-08-12 |
JPS62290152A (ja) | 1987-12-17 |
FR2382769B1 (fr) | 1983-06-03 |
JPH0362300B2 (fr) | 1991-09-25 |
FR2382745B1 (fr) | 1983-06-03 |
JPS62290180A (ja) | 1987-12-17 |
JPH0918003A (ja) | 1997-01-17 |
JPS5760852A (en) | 1982-04-13 |
FR2382745A1 (fr) | 1978-09-29 |
JPS5394190A (en) | 1978-08-17 |
GB1595548A (en) | 1981-08-12 |
GB1595543A (en) | 1981-08-12 |
FR2382767B1 (fr) | 1983-06-03 |
GB1595547A (en) | 1981-08-12 |
FR2382767A1 (fr) | 1978-09-29 |
JPH098299A (ja) | 1997-01-10 |
DE2802048A1 (de) | 1978-07-27 |
GB1595545A (en) | 1981-08-12 |
DE2802048C2 (fr) | 1993-02-11 |
FR2382769A1 (fr) | 1978-09-29 |
JPS62290147A (ja) | 1987-12-17 |
FR2382768A1 (fr) | 1978-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
CA | Change of address | ||
CD | Change of name or company name | ||
TP | Transmission of property |