DE69025990T2 - Bipolarer Transistor mit isolierter Steuerelektrode und Verfahren zu dessen Herstellung - Google Patents

Bipolarer Transistor mit isolierter Steuerelektrode und Verfahren zu dessen Herstellung

Info

Publication number
DE69025990T2
DE69025990T2 DE69025990T DE69025990T DE69025990T2 DE 69025990 T2 DE69025990 T2 DE 69025990T2 DE 69025990 T DE69025990 T DE 69025990T DE 69025990 T DE69025990 T DE 69025990T DE 69025990 T2 DE69025990 T2 DE 69025990T2
Authority
DE
Germany
Prior art keywords
production
bipolar transistor
control electrode
insulated control
insulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69025990T
Other languages
English (en)
Other versions
DE69025990D1 (de
Inventor
Hiroyasu Hagino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE69025990D1 publication Critical patent/DE69025990D1/de
Application granted granted Critical
Publication of DE69025990T2 publication Critical patent/DE69025990T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095Body region, i.e. base region, of DMOS transistors or IGBTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692Surface layout
    • H01L29/0696Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395Vertical transistors, e.g. vertical IGBT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE69025990T 1989-05-26 1990-05-23 Bipolarer Transistor mit isolierter Steuerelektrode und Verfahren zu dessen Herstellung Expired - Fee Related DE69025990T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1133202A JPH02312280A (ja) 1989-05-26 1989-05-26 絶縁ゲート型バイポーラトランジスタ

Publications (2)

Publication Number Publication Date
DE69025990D1 DE69025990D1 (de) 1996-04-25
DE69025990T2 true DE69025990T2 (de) 1996-11-28

Family

ID=15099119

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69034157T Expired - Lifetime DE69034157T2 (de) 1989-05-26 1990-05-23 Bipolartransistor mit isolierter Gate-Elektrode und Verfahren zur Herstellung
DE69025990T Expired - Fee Related DE69025990T2 (de) 1989-05-26 1990-05-23 Bipolarer Transistor mit isolierter Steuerelektrode und Verfahren zu dessen Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69034157T Expired - Lifetime DE69034157T2 (de) 1989-05-26 1990-05-23 Bipolartransistor mit isolierter Gate-Elektrode und Verfahren zur Herstellung

Country Status (4)

Country Link
US (3) US5023691A (de)
EP (2) EP0405138B1 (de)
JP (1) JPH02312280A (de)
DE (2) DE69034157T2 (de)

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JP2007207862A (ja) * 2006-01-31 2007-08-16 Mitsubishi Electric Corp 半導体装置
JP5036234B2 (ja) * 2006-07-07 2012-09-26 三菱電機株式会社 半導体装置
JP5283326B2 (ja) * 2006-10-27 2013-09-04 三菱電機株式会社 半導体装置およびその製造方法
JP2012089565A (ja) * 2010-10-15 2012-05-10 Honda Motor Co Ltd 半導体装置
JP5568036B2 (ja) * 2011-03-09 2014-08-06 トヨタ自動車株式会社 Igbt
JP5609939B2 (ja) * 2011-09-27 2014-10-22 株式会社デンソー 半導体装置
JP5645899B2 (ja) * 2012-10-10 2014-12-24 三菱電機株式会社 半導体装置およびその製造方法
CN102956638B (zh) * 2012-11-13 2015-04-15 清华大学 连体igbt器件及其加工方法
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Also Published As

Publication number Publication date
JPH02312280A (ja) 1990-12-27
EP0405138A2 (de) 1991-01-02
EP0405138B1 (de) 1996-03-20
EP0690512A1 (de) 1996-01-03
US5023691A (en) 1991-06-11
DE69025990D1 (de) 1996-04-25
US5391898A (en) 1995-02-21
EP0405138A3 (en) 1991-11-27
DE69034157D1 (de) 2004-09-30
EP0690512B1 (de) 2004-08-25
DE69034157T2 (de) 2005-09-08
US5170239A (en) 1992-12-08

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