DE69034157D1 - Bipolartransistor mit isolierter Gate-Elektrode und Verfahren zur Herstellung - Google Patents
Bipolartransistor mit isolierter Gate-Elektrode und Verfahren zur HerstellungInfo
- Publication number
- DE69034157D1 DE69034157D1 DE69034157T DE69034157T DE69034157D1 DE 69034157 D1 DE69034157 D1 DE 69034157D1 DE 69034157 T DE69034157 T DE 69034157T DE 69034157 T DE69034157 T DE 69034157T DE 69034157 D1 DE69034157 D1 DE 69034157D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- bipolar transistor
- insulated gate
- gate bipolar
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Bipolar Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1133202A JPH02312280A (ja) | 1989-05-26 | 1989-05-26 | 絶縁ゲート型バイポーラトランジスタ |
JP13320289 | 1989-05-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69034157D1 true DE69034157D1 (de) | 2004-09-30 |
DE69034157T2 DE69034157T2 (de) | 2005-09-08 |
Family
ID=15099119
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69025990T Expired - Fee Related DE69025990T2 (de) | 1989-05-26 | 1990-05-23 | Bipolarer Transistor mit isolierter Steuerelektrode und Verfahren zu dessen Herstellung |
DE69034157T Expired - Lifetime DE69034157T2 (de) | 1989-05-26 | 1990-05-23 | Bipolartransistor mit isolierter Gate-Elektrode und Verfahren zur Herstellung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69025990T Expired - Fee Related DE69025990T2 (de) | 1989-05-26 | 1990-05-23 | Bipolarer Transistor mit isolierter Steuerelektrode und Verfahren zu dessen Herstellung |
Country Status (4)
Country | Link |
---|---|
US (3) | US5023691A (de) |
EP (2) | EP0690512B1 (de) |
JP (1) | JPH02312280A (de) |
DE (2) | DE69025990T2 (de) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5528058A (en) * | 1986-03-21 | 1996-06-18 | Advanced Power Technology, Inc. | IGBT device with platinum lifetime control and reduced gaw |
JPH02312280A (ja) * | 1989-05-26 | 1990-12-27 | Mitsubishi Electric Corp | 絶縁ゲート型バイポーラトランジスタ |
JP2858404B2 (ja) * | 1990-06-08 | 1999-02-17 | 株式会社デンソー | 絶縁ゲート型バイポーラトランジスタおよびその製造方法 |
JPH05110085A (ja) * | 1991-10-14 | 1993-04-30 | Mitsubishi Electric Corp | 電界効果型半導体装置およびその製造方法 |
JPH05206469A (ja) * | 1992-01-29 | 1993-08-13 | Hitachi Ltd | 絶縁ゲート型バイポーラトランジスタ |
JP2984478B2 (ja) * | 1992-08-15 | 1999-11-29 | 株式会社東芝 | 伝導度変調型半導体装置及びその製造方法 |
DE69207410T2 (de) * | 1992-09-18 | 1996-08-29 | Cons Ric Microelettronica | Monolithisch integrierte Brückenschaltung mit Transistoren und entsprechendes Herstellungsverfahren |
JP3297129B2 (ja) * | 1992-10-08 | 2002-07-02 | 株式会社東芝 | 半導体装置 |
US5317184A (en) * | 1992-11-09 | 1994-05-31 | Harris Corporation | Device and method for improving current carrying capability in a semiconductor device |
US5489788A (en) * | 1993-03-09 | 1996-02-06 | Mitsubishi Denki Kabushiki Kaisha | Insulated gate semiconductor device with improved short-circuit tolerance |
DE4313170A1 (de) * | 1993-04-22 | 1994-10-27 | Abb Management Ag | Leistungshalbleiterbauelement |
DE4315178A1 (de) * | 1993-05-07 | 1994-11-10 | Abb Management Ag | IGBT mit selbstjustierender Kathodenstruktur sowie Verfahren zu dessen Herstellung |
JP2987040B2 (ja) * | 1993-11-05 | 1999-12-06 | 三菱電機株式会社 | 絶縁ゲート型半導体装置 |
US5455442A (en) * | 1993-11-17 | 1995-10-03 | Harris Corporation | COMFET switch and method |
DE69326771T2 (de) | 1993-12-07 | 2000-03-02 | Stmicroelectronics S.R.L., Agrate Brianza | Ausgangstufe mit Transistoren von unterschiedlichem Typ |
US5466951A (en) * | 1993-12-08 | 1995-11-14 | Siemens Aktiengesellschaft | Controllable power semiconductor element with buffer zone and method for the manufacture thereof |
EP0661755A1 (de) * | 1993-12-28 | 1995-07-05 | AT&T Corp. | Hochspannung-Halbleiteranordnung mit verbesserter elektrischer Robustheit und verminderter Zellschrittweite |
EP0689238B1 (de) * | 1994-06-23 | 2002-02-20 | STMicroelectronics S.r.l. | Verfahren zur Herstellung eines Leistungsbauteils in MOS-Technik |
US5817546A (en) * | 1994-06-23 | 1998-10-06 | Stmicroelectronics S.R.L. | Process of making a MOS-technology power device |
US5841197A (en) * | 1994-11-18 | 1998-11-24 | Adamic, Jr.; Fred W. | Inverted dielectric isolation process |
US6124179A (en) * | 1996-09-05 | 2000-09-26 | Adamic, Jr.; Fred W. | Inverted dielectric isolation process |
US5798554A (en) * | 1995-02-24 | 1998-08-25 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | MOS-technology power device integrated structure and manufacturing process thereof |
JP3298385B2 (ja) * | 1995-04-05 | 2002-07-02 | 富士電機株式会社 | 絶縁ゲート型サイリスタ |
US5541547A (en) * | 1995-05-03 | 1996-07-30 | Sun Microsystems, Inc. | Test generator system for controllably inducing power pin latch-up and signal pin latch-up in a CMOS device |
EP0768714B1 (de) * | 1995-10-09 | 2003-09-17 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe | Herstellungsverfahren für Leistungsanordnung mit Schutzring |
DE69534919T2 (de) * | 1995-10-30 | 2007-01-25 | Stmicroelectronics S.R.L., Agrate Brianza | Leistungsvorrichtung in MOS-Technologie mit einer einzigen kritischen Größe |
DE69533134T2 (de) * | 1995-10-30 | 2005-07-07 | Stmicroelectronics S.R.L., Agrate Brianza | Leistungsbauteil hoher Dichte in MOS-Technologie |
US6228719B1 (en) | 1995-11-06 | 2001-05-08 | Stmicroelectronics S.R.L. | MOS technology power device with low output resistance and low capacitance, and related manufacturing process |
EP0772244B1 (de) * | 1995-11-06 | 2000-03-22 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Leistungsbauelement in MOS-Technologie mit niedrigem Ausgangswiderstand und geringer Kapazität und dessen Herstellungsverfahren |
DE69518653T2 (de) * | 1995-12-28 | 2001-04-19 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania | MOS-Technologie-Leistungsanordnung in integrierter Struktur |
DE69631524T2 (de) | 1996-07-05 | 2004-10-07 | St Microelectronics Srl | Asymmetrische MOS-Technologie-Leistungsanordnung |
JP3426928B2 (ja) * | 1996-09-18 | 2003-07-14 | 株式会社東芝 | 電力用半導体装置 |
GB9625839D0 (en) * | 1996-12-12 | 1997-01-29 | Westinghouse Brake & Signal | Semiconductor switching devices |
DE19654113A1 (de) * | 1996-12-23 | 1998-06-25 | Asea Brown Boveri | Verfahren zum Herstellen eines MOS-gesteuerten Leistungshalbleiterbauelements |
KR100397858B1 (ko) * | 1996-12-27 | 2003-12-18 | 페어차일드코리아반도체 주식회사 | 절연게이트 바이폴라 트랜지스터 |
KR100256109B1 (ko) * | 1997-05-07 | 2000-05-01 | 김덕중 | 전력 반도체 장치 |
US6121089A (en) * | 1997-10-17 | 2000-09-19 | Intersil Corporation | Methods of forming power semiconductor devices having merged split-well body regions therein |
KR100455363B1 (ko) * | 1997-10-22 | 2005-06-07 | 페어차일드코리아반도체 주식회사 | 절연게이트 구조의 바이폴라 트랜지스터(igbt) 및 그 제조방법 |
EP0961325B1 (de) | 1998-05-26 | 2008-05-07 | STMicroelectronics S.r.l. | MOS-Technologie-Leistungsanordnung mit hoher Integrationsdichte |
DE19829614B4 (de) * | 1998-07-02 | 2004-09-23 | Semikron Elektronik Gmbh | Verfahren zur Herstellung eines Leistungshalbleiterbauelementes |
US6037631A (en) * | 1998-09-18 | 2000-03-14 | Siemens Aktiengesellschaft | Semiconductor component with a high-voltage endurance edge structure |
JP4865166B2 (ja) * | 2001-08-30 | 2012-02-01 | 新電元工業株式会社 | トランジスタの製造方法、ダイオードの製造方法 |
JP4770119B2 (ja) * | 2004-02-20 | 2011-09-14 | 株式会社デンソー | Mos型半導体装置およびそれを備えた点火装置 |
JP5119589B2 (ja) * | 2005-11-04 | 2013-01-16 | 富士電機株式会社 | 半導体装置 |
JP2007194575A (ja) | 2005-12-21 | 2007-08-02 | Mitsubishi Electric Corp | 半導体装置 |
JP2007207862A (ja) * | 2006-01-31 | 2007-08-16 | Mitsubishi Electric Corp | 半導体装置 |
JP5036234B2 (ja) * | 2006-07-07 | 2012-09-26 | 三菱電機株式会社 | 半導体装置 |
JP5283326B2 (ja) * | 2006-10-27 | 2013-09-04 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP2012089565A (ja) * | 2010-10-15 | 2012-05-10 | Honda Motor Co Ltd | 半導体装置 |
JP5568036B2 (ja) * | 2011-03-09 | 2014-08-06 | トヨタ自動車株式会社 | Igbt |
JP5609939B2 (ja) * | 2011-09-27 | 2014-10-22 | 株式会社デンソー | 半導体装置 |
JP5645899B2 (ja) * | 2012-10-10 | 2014-12-24 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
CN102956638B (zh) * | 2012-11-13 | 2015-04-15 | 清华大学 | 连体igbt器件及其加工方法 |
KR101489088B1 (ko) | 2013-09-03 | 2015-02-04 | (주) 아이씨티케이 | 식별키 생성 장치 및 방법 |
CN104393032A (zh) * | 2014-12-04 | 2015-03-04 | 国家电网公司 | 一种平面栅igbt及其制作方法 |
JP6561496B2 (ja) * | 2015-02-26 | 2019-08-21 | サンケン電気株式会社 | 半導体装置 |
US10833671B2 (en) * | 2018-10-23 | 2020-11-10 | Infnieon Technologies Americas Corp. | Increasing forward biased safe operating area by source segmentation |
US10998403B2 (en) * | 2019-03-04 | 2021-05-04 | Infineon Technologies Americas Corp. | Device with increased forward biased safe operating area (FBSOA) through using source segments having different threshold voltages |
US11217666B2 (en) | 2019-09-17 | 2022-01-04 | Infineon Technologies Americas Corp. | Method of increasing forward biased safe operating area using different threshold voltage segments |
CN117038708B (zh) * | 2023-09-28 | 2024-01-23 | 绍兴中芯集成电路制造股份有限公司 | 沟槽型场效应晶体管及其制备方法 |
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US4441117A (en) * | 1981-07-27 | 1984-04-03 | Intersil, Inc. | Monolithically merged field effect transistor and bipolar junction transistor |
US4532534A (en) * | 1982-09-07 | 1985-07-30 | Rca Corporation | MOSFET with perimeter channel |
JPS60196974A (ja) * | 1984-03-19 | 1985-10-05 | Toshiba Corp | 導電変調型mosfet |
JPS60254658A (ja) * | 1984-05-30 | 1985-12-16 | Toshiba Corp | 導電変調型mosfet |
US4672407A (en) * | 1984-05-30 | 1987-06-09 | Kabushiki Kaisha Toshiba | Conductivity modulated MOSFET |
CA1227171A (en) * | 1984-09-04 | 1987-09-22 | Hyok S. Lew | Sky-slide emergency escape system |
JPS6184865A (ja) * | 1984-10-02 | 1986-04-30 | Nec Corp | 半導体装置 |
JPH0783112B2 (ja) * | 1985-01-17 | 1995-09-06 | 株式会社東芝 | 導電変調型mosfet |
JPS61184865A (ja) * | 1985-02-12 | 1986-08-18 | Matsushita Electronics Corp | 半導体記憶装置 |
JPS61191071A (ja) * | 1985-02-20 | 1986-08-25 | Toshiba Corp | 伝導度変調型半導体装置及びその製造方法 |
JPH0667270B2 (ja) * | 1985-02-26 | 1994-08-24 | 三菱電機株式会社 | 間欠駆動形磁気記録装置 |
JPH0612827B2 (ja) * | 1985-02-28 | 1994-02-16 | 株式会社東芝 | 導電変調型mosfet |
DE3628857A1 (de) * | 1985-08-27 | 1987-03-12 | Mitsubishi Electric Corp | Halbleitereinrichtung |
EP0219995B1 (de) * | 1985-09-30 | 1994-03-02 | Kabushiki Kaisha Toshiba | Mittels Steuerelektrode abschaltbarer Thyristor mit unabhängigen Zünd-/Lösch-Kontrolltransistoren |
US4641162A (en) * | 1985-12-11 | 1987-02-03 | General Electric Company | Current limited insulated gate device |
JPH0779164B2 (ja) * | 1986-01-30 | 1995-08-23 | 三菱電機株式会社 | 半導体装置 |
JPH061831B2 (ja) * | 1986-07-08 | 1994-01-05 | 株式会社日立製作所 | ゲ−トタ−ンオフサイリスタ |
JP2786196B2 (ja) * | 1987-07-21 | 1998-08-13 | 株式会社デンソー | 絶縁ゲート型半導体装置 |
EP0332822A1 (de) * | 1988-02-22 | 1989-09-20 | Asea Brown Boveri Ag | Feldeffektgesteuertes, bipolares Leistungshalbleiter-Bauelement sowie Verfahren zu seiner Herstellung |
DE58909474D1 (de) * | 1988-02-24 | 1995-11-30 | Siemens Ag | Verfahren zur Herstellung eines durch Feldeffekt steuerbaren Bipolartransistors. |
EP0340445B1 (de) * | 1988-04-22 | 1993-08-25 | Asea Brown Boveri Ag | Abschaltbares Leistungshalbleiterbauelement |
JPH02163974A (ja) * | 1988-12-16 | 1990-06-25 | Mitsubishi Electric Corp | 絶縁ゲート型バイポーラトランジスタおよびその製造方法 |
JPH02312280A (ja) * | 1989-05-26 | 1990-12-27 | Mitsubishi Electric Corp | 絶縁ゲート型バイポーラトランジスタ |
-
1989
- 1989-05-26 JP JP1133202A patent/JPH02312280A/ja active Pending
- 1989-09-01 US US07/401,827 patent/US5023691A/en not_active Expired - Lifetime
-
1990
- 1990-05-23 DE DE69025990T patent/DE69025990T2/de not_active Expired - Fee Related
- 1990-05-23 EP EP95114058A patent/EP0690512B1/de not_active Expired - Lifetime
- 1990-05-23 DE DE69034157T patent/DE69034157T2/de not_active Expired - Lifetime
- 1990-05-23 EP EP90109810A patent/EP0405138B1/de not_active Expired - Lifetime
-
1991
- 1991-01-31 US US07/648,902 patent/US5170239A/en not_active Expired - Lifetime
-
1992
- 1992-08-10 US US07/926,378 patent/US5391898A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69025990D1 (de) | 1996-04-25 |
EP0405138A2 (de) | 1991-01-02 |
EP0690512B1 (de) | 2004-08-25 |
US5391898A (en) | 1995-02-21 |
DE69034157T2 (de) | 2005-09-08 |
US5170239A (en) | 1992-12-08 |
EP0405138A3 (en) | 1991-11-27 |
EP0690512A1 (de) | 1996-01-03 |
JPH02312280A (ja) | 1990-12-27 |
US5023691A (en) | 1991-06-11 |
DE69025990T2 (de) | 1996-11-28 |
EP0405138B1 (de) | 1996-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |