DE69631524T2 - Asymmetrische MOS-Technologie-Leistungsanordnung - Google Patents
Asymmetrische MOS-Technologie-Leistungsanordnung Download PDFInfo
- Publication number
- DE69631524T2 DE69631524T2 DE69631524T DE69631524T DE69631524T2 DE 69631524 T2 DE69631524 T2 DE 69631524T2 DE 69631524 T DE69631524 T DE 69631524T DE 69631524 T DE69631524 T DE 69631524T DE 69631524 T2 DE69631524 T2 DE 69631524T2
- Authority
- DE
- Germany
- Prior art keywords
- technology power
- power arrangement
- mos technology
- asymmetric mos
- asymmetric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96830384A EP0817274B1 (de) | 1996-07-05 | 1996-07-05 | Asymmetrische MOS-Technologie-Leistungsanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69631524D1 DE69631524D1 (de) | 2004-03-18 |
DE69631524T2 true DE69631524T2 (de) | 2004-10-07 |
Family
ID=8225959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69631524T Expired - Fee Related DE69631524T2 (de) | 1996-07-05 | 1996-07-05 | Asymmetrische MOS-Technologie-Leistungsanordnung |
Country Status (4)
Country | Link |
---|---|
US (2) | US6222232B1 (de) |
EP (1) | EP0817274B1 (de) |
JP (1) | JPH10107283A (de) |
DE (1) | DE69631524T2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005294584A (ja) * | 2004-03-31 | 2005-10-20 | Eudyna Devices Inc | 半導体装置および不純物導入用マスクならびに半導体装置の製造方法 |
DE102004021393B4 (de) * | 2004-04-30 | 2006-06-14 | Infineon Technologies Ag | Feldeffekt-Leistungstransistor |
US7875936B2 (en) * | 2004-11-19 | 2011-01-25 | Stmicroelectronics, S.R.L. | Power MOS electronic device and corresponding realizing method |
ITMI20042243A1 (it) | 2004-11-19 | 2005-02-19 | St Microelectronics Srl | Processo per la realizzazione di un dispositivo mos di potenza ad alta densita' di integrazione |
JP6047297B2 (ja) * | 2012-04-09 | 2016-12-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9673103B2 (en) | 2015-06-30 | 2017-06-06 | Stmicroelectronics, Inc. | MOSFET devices with asymmetric structural configurations introducing different electrical characteristics |
JP7029364B2 (ja) * | 2018-08-20 | 2022-03-03 | 株式会社東芝 | 半導体装置 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4069067A (en) * | 1975-03-20 | 1978-01-17 | Matsushita Electric Industrial Co., Ltd. | Method of making a semiconductor device |
US4412242A (en) | 1980-11-17 | 1983-10-25 | International Rectifier Corporation | Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions |
US4417385A (en) | 1982-08-09 | 1983-11-29 | General Electric Company | Processes for manufacturing insulated-gate semiconductor devices with integral shorts |
US4816882A (en) | 1986-03-10 | 1989-03-28 | Siliconix Incorporated | Power MOS transistor with equipotential ring |
US4920393A (en) * | 1987-01-08 | 1990-04-24 | Texas Instruments Incorporated | Insulated-gate field-effect semiconductor device with doped regions in channel to raise breakdown voltage |
US4920388A (en) | 1987-02-17 | 1990-04-24 | Siliconix Incorporated | Power transistor with integrated gate resistor |
US4916509A (en) | 1987-11-13 | 1990-04-10 | Siliconix Incorporated | Method for obtaining low interconnect resistance on a grooved surface and the resulting structure |
EP0332822A1 (de) | 1988-02-22 | 1989-09-20 | Asea Brown Boveri Ag | Feldeffektgesteuertes, bipolares Leistungshalbleiter-Bauelement sowie Verfahren zu seiner Herstellung |
JPH0648729B2 (ja) | 1988-02-24 | 1994-06-22 | シーメンス、アクチエンゲゼルシシヤフト | 電界効果制御可能のバイポーラ・トランジスタ |
US5248891A (en) | 1988-03-25 | 1993-09-28 | Hiroshi Takato | High integration semiconductor device |
JP2675572B2 (ja) | 1988-03-31 | 1997-11-12 | 株式会社東芝 | 半導体集積回路の製造方法 |
DE4001947A1 (de) | 1989-02-17 | 1990-08-23 | Volkswagen Ag | Sicherheitseinrichtung fuer ein fahrzeug |
US4998151A (en) | 1989-04-13 | 1991-03-05 | General Electric Company | Power field effect devices having small cell size and low contact resistance |
JPH07105496B2 (ja) * | 1989-04-28 | 1995-11-13 | 三菱電機株式会社 | 絶縁ゲート型バイポーラトランジスタ |
JPH02312280A (ja) * | 1989-05-26 | 1990-12-27 | Mitsubishi Electric Corp | 絶縁ゲート型バイポーラトランジスタ |
US4985740A (en) | 1989-06-01 | 1991-01-15 | General Electric Company | Power field effect devices having low gate sheet resistance and low ohmic contact resistance |
US5234851A (en) | 1989-09-05 | 1993-08-10 | General Electric Company | Small cell, low contact assistance rugged power field effect devices and method of fabrication |
US5119153A (en) | 1989-09-05 | 1992-06-02 | General Electric Company | Small cell low contact resistance rugged power field effect devices and method of fabrication |
US5047833A (en) | 1990-10-17 | 1991-09-10 | International Rectifier Corporation | Solderable front metal contact for MOS devices |
US5404040A (en) | 1990-12-21 | 1995-04-04 | Siliconix Incorporated | Structure and fabrication of power MOSFETs, including termination structures |
US5183769A (en) | 1991-05-06 | 1993-02-02 | Motorola, Inc. | Vertical current flow semiconductor device utilizing wafer bonding |
JPH05206469A (ja) * | 1992-01-29 | 1993-08-13 | Hitachi Ltd | 絶縁ゲート型バイポーラトランジスタ |
US5321281A (en) * | 1992-03-18 | 1994-06-14 | Mitsubishi Denki Kabushiki Kaisha | Insulated gate semiconductor device and method of fabricating same |
US5319222A (en) * | 1992-04-29 | 1994-06-07 | North Carolina State University | MOS gated thyristor having on-state current saturation capability |
JP2984478B2 (ja) | 1992-08-15 | 1999-11-29 | 株式会社東芝 | 伝導度変調型半導体装置及びその製造方法 |
US5486715A (en) | 1993-10-15 | 1996-01-23 | Ixys Corporation | High frequency MOS device |
DE69434268T2 (de) * | 1994-07-14 | 2006-01-12 | Stmicroelectronics S.R.L., Agrate Brianza | Intergrierte Struktur einer Hochgeschwindigkeits-MOS-Technologe-Leistungsvorrichtung und zugehöriges Herstellungsverfahren |
JPH08227999A (ja) * | 1994-12-21 | 1996-09-03 | Mitsubishi Electric Corp | 絶縁ゲート型バイポーラトランジスタ及びその製造方法並びに半導体集積回路及びその製造方法 |
-
1996
- 1996-07-05 DE DE69631524T patent/DE69631524T2/de not_active Expired - Fee Related
- 1996-07-05 EP EP96830384A patent/EP0817274B1/de not_active Expired - Lifetime
-
1997
- 1997-07-01 US US08/886,836 patent/US6222232B1/en not_active Expired - Lifetime
- 1997-07-02 JP JP9176976A patent/JPH10107283A/ja active Pending
-
2000
- 2000-12-21 US US09/746,789 patent/US6326271B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69631524D1 (de) | 2004-03-18 |
EP0817274A1 (de) | 1998-01-07 |
EP0817274B1 (de) | 2004-02-11 |
US20010001213A1 (en) | 2001-05-17 |
JPH10107283A (ja) | 1998-04-24 |
US6326271B2 (en) | 2001-12-04 |
US6222232B1 (en) | 2001-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69834353D1 (de) | Leistungsteilungs-/-addierschaltung | |
DE59700704D1 (de) | Gleitlager | |
DE69727188D1 (de) | Stromversorgungsgerät | |
ATE218014T1 (de) | Stromschiene | |
DE59707253D1 (de) | Antriebsaggregat | |
DE69508897D1 (de) | Asymmetrische MOS-Anordnung niedriger Leistung | |
ATE228237T1 (de) | Rotor | |
DE69631524T2 (de) | Asymmetrische MOS-Technologie-Leistungsanordnung | |
ATA198296A (de) | Peltonrad - vorspannung | |
FI962271A (fi) | Hakkurivirtalähdejärjestely | |
DE29602715U1 (de) | Mehrfachsteckdose | |
DE29615384U1 (de) | Holzklapperfigur | |
FI965275A0 (fi) | Aonglaoda i kartong- eller pappersmaskin | |
KR980000222U (ko) | 브레지어 | |
FI961262A (fi) | Vesivoimalaitos | |
UA25376A (uk) | Короткозамкhутий ротор | |
SE9600633D0 (sv) | Rotor | |
FIU960227U0 (fi) | Tuulimylly | |
KR970052251U (ko) | 동력전달 장치 | |
SE9602513D0 (sv) | Strömturbin | |
EE00082U1 (et) | Tuulevurri komlekt | |
KR980000853U (ko) | 전원 자동 탈거 장치 | |
KR970059848U (ko) | 파워 라인 장치 | |
KR970064282U (ko) | 절전콘센트 | |
KR960005754U (ko) | 전원 케이스 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |