CN1945864A - 半导体发光元件 - Google Patents
半导体发光元件 Download PDFInfo
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- CN1945864A CN1945864A CN 200610138809 CN200610138809A CN1945864A CN 1945864 A CN1945864 A CN 1945864A CN 200610138809 CN200610138809 CN 200610138809 CN 200610138809 A CN200610138809 A CN 200610138809A CN 1945864 A CN1945864 A CN 1945864A
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- FHKPLLOSJHHKNU-INIZCTEOSA-N [(3S)-3-[8-(1-ethyl-5-methylpyrazol-4-yl)-9-methylpurin-6-yl]oxypyrrolidin-1-yl]-(oxan-4-yl)methanone Chemical compound C(C)N1N=CC(=C1C)C=1N(C2=NC=NC(=C2N=1)O[C@@H]1CN(CC1)C(=O)C1CCOCC1)C FHKPLLOSJHHKNU-INIZCTEOSA-N 0.000 description 1
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Images
Abstract
Description
错位密度(个/cm2) | 输出(mW) | 寿命(hr) | |
实施例 | 8×107 | 10 | 1300 |
比较例1 | 1×109 | 3 | 800 |
比较例2 | 8×107 | 6 | 1300 |
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP200181447 | 2001-03-21 | ||
JP200180806 | 2001-03-21 | ||
JP2001081447A JP3595277B2 (ja) | 2001-03-21 | 2001-03-21 | GaN系半導体発光ダイオード |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN02806788.6A Division CN1284250C (zh) | 2001-03-21 | 2002-03-20 | 半导体发光元件 |
Publications (2)
Publication Number | Publication Date |
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CN1945864A true CN1945864A (zh) | 2007-04-11 |
CN100521267C CN100521267C (zh) | 2009-07-29 |
Family
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Application Number | Title | Priority Date | Filing Date |
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CNB2006101388096A Expired - Lifetime CN100521267C (zh) | 2001-03-21 | 2002-03-20 | 半导体发光元件 |
CN2009100096535A Expired - Lifetime CN101504962B (zh) | 2001-03-21 | 2002-03-20 | 半导体发光元件及其制造方法 |
Family Applications After (1)
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CN2009100096535A Expired - Lifetime CN101504962B (zh) | 2001-03-21 | 2002-03-20 | 半导体发光元件及其制造方法 |
Country Status (2)
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JP (1) | JP3595277B2 (zh) |
CN (2) | CN100521267C (zh) |
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US7825577B2 (en) | 2006-07-28 | 2010-11-02 | Epistar Corporation | Light emitting device having a patterned substrate and the method thereof |
CN101527342B (zh) * | 2009-03-31 | 2011-04-06 | 西安电子科技大学 | AlGaN基蓝宝石衬底的紫外LED器件的制作方法 |
CN102097558A (zh) * | 2009-12-10 | 2011-06-15 | 华新丽华股份有限公司 | 形成具有排热结构的垂直结构发光二极管的方法 |
CN102299225A (zh) * | 2010-06-22 | 2011-12-28 | 联胜光电股份有限公司 | 具有高反射与低缺陷密度的发光二极管结构 |
CN102544287A (zh) * | 2010-12-10 | 2012-07-04 | 晶元光电股份有限公司 | 光电元件及其制造方法 |
US9093605B2 (en) | 2010-12-02 | 2015-07-28 | Epistar Corporation | Optoelectronic device and method for manufacturing the same |
CN105280776A (zh) * | 2014-05-30 | 2016-01-27 | 日亚化学工业株式会社 | 氮化物半导体元件及其制造方法 |
CN107810563A (zh) * | 2015-06-25 | 2018-03-16 | Lg伊诺特有限公司 | 紫外光发光二极管、发光二极管封装及照明装置 |
CN113517380A (zh) * | 2021-06-30 | 2021-10-19 | 福建晶安光电有限公司 | 一种复合图形衬底及其制作方法 |
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JP5965095B2 (ja) * | 1999-12-03 | 2016-08-10 | クリー インコーポレイテッドCree Inc. | 内部および外部光学要素による光取出しを向上させた発光ダイオード |
JP4055503B2 (ja) | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
JP5800452B2 (ja) * | 2001-07-24 | 2015-10-28 | 日亜化学工業株式会社 | 半導体発光素子 |
US7071494B2 (en) * | 2002-12-11 | 2006-07-04 | Lumileds Lighting U.S. Llc | Light emitting device with enhanced optical scattering |
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JP2004363500A (ja) * | 2003-06-06 | 2004-12-24 | Satoru Tanaka | 窒化物系化合物半導体の製造方法および窒化物系化合物半導体 |
JP2005064492A (ja) * | 2003-07-28 | 2005-03-10 | Kyocera Corp | 単結晶サファイア基板とその製造方法及び半導体発光素子 |
JP4593890B2 (ja) * | 2003-07-28 | 2010-12-08 | 京セラ株式会社 | 半導体発光素子の製造方法 |
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WO2017164103A1 (ja) | 2016-03-24 | 2017-09-28 | 東レ株式会社 | エッチング用マスクレジスト組成物、それを用いた基板の製造方法および発光素子の製造方法 |
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Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3714984B2 (ja) * | 1995-03-06 | 2005-11-09 | シャープ株式会社 | 分布帰還型半導体レーザ装置 |
US5779924A (en) * | 1996-03-22 | 1998-07-14 | Hewlett-Packard Company | Ordered interface texturing for a light emitting device |
JP3439063B2 (ja) * | 1997-03-24 | 2003-08-25 | 三洋電機株式会社 | 半導体発光素子および発光ランプ |
US6091083A (en) * | 1997-06-02 | 2000-07-18 | Sharp Kabushiki Kaisha | Gallium nitride type compound semiconductor light-emitting device having buffer layer with non-flat surface |
JP3930161B2 (ja) * | 1997-08-29 | 2007-06-13 | 株式会社東芝 | 窒化物系半導体素子、発光素子及びその製造方法 |
JP3491538B2 (ja) * | 1997-10-09 | 2004-01-26 | 日亜化学工業株式会社 | 窒化物半導体の成長方法及び窒化物半導体素子 |
JPH11251639A (ja) * | 1998-02-27 | 1999-09-17 | Omron Corp | 半導体発光素子 |
JP3201475B2 (ja) * | 1998-09-14 | 2001-08-20 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
JP3592553B2 (ja) * | 1998-10-15 | 2004-11-24 | 株式会社東芝 | 窒化ガリウム系半導体装置 |
JP4032538B2 (ja) * | 1998-11-26 | 2008-01-16 | ソニー株式会社 | 半導体薄膜および半導体素子の製造方法 |
JP3471685B2 (ja) * | 1999-03-17 | 2003-12-02 | 三菱電線工業株式会社 | 半導体基材及びその製造方法 |
JP3633447B2 (ja) * | 1999-09-29 | 2005-03-30 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子 |
-
2001
- 2001-03-21 JP JP2001081447A patent/JP3595277B2/ja not_active Expired - Fee Related
-
2002
- 2002-03-20 CN CNB2006101388096A patent/CN100521267C/zh not_active Expired - Lifetime
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Also Published As
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CN100521267C (zh) | 2009-07-29 |
JP2002280611A (ja) | 2002-09-27 |
CN101504962B (zh) | 2012-10-10 |
JP3595277B2 (ja) | 2004-12-02 |
CN101504962A (zh) | 2009-08-12 |
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