CN1758993B - 基板切割设备和基板切割方法 - Google Patents

基板切割设备和基板切割方法 Download PDF

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Publication number
CN1758993B
CN1758993B CN2004800063132A CN200480006313A CN1758993B CN 1758993 B CN1758993 B CN 1758993B CN 2004800063132 A CN2004800063132 A CN 2004800063132A CN 200480006313 A CN200480006313 A CN 200480006313A CN 1758993 B CN1758993 B CN 1758993B
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China
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cut
substrate
line part
curved portion
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Expired - Fee Related
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CN2004800063132A
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English (en)
Chinese (zh)
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CN1758993A (zh
Inventor
西尾仁孝
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN1758993A publication Critical patent/CN1758993A/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
CN2004800063132A 2003-01-29 2004-01-28 基板切割设备和基板切割方法 Expired - Fee Related CN1758993B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP021109/2003 2003-01-29
JP2003021109 2003-01-29
PCT/JP2004/000780 WO2004067243A1 (ja) 2003-01-29 2004-01-28 基板分断装置および基板分断方法

Related Child Applications (3)

Application Number Title Priority Date Filing Date
CN2009101320237A Division CN101585656B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320241A Division CN101585655B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320256A Division CN101585657B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法

Publications (2)

Publication Number Publication Date
CN1758993A CN1758993A (zh) 2006-04-12
CN1758993B true CN1758993B (zh) 2012-03-21

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
CN2004800063132A Expired - Fee Related CN1758993B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320241A Expired - Fee Related CN101585655B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320256A Expired - Fee Related CN101585657B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320237A Expired - Fee Related CN101585656B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN2009101320241A Expired - Fee Related CN101585655B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320256A Expired - Fee Related CN101585657B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320237A Expired - Fee Related CN101585656B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法

Country Status (7)

Country Link
US (1) US20070164072A1 (OSRAM)
EP (1) EP1600270A4 (OSRAM)
JP (2) JP4606325B2 (OSRAM)
KR (1) KR100822322B1 (OSRAM)
CN (4) CN1758993B (OSRAM)
TW (1) TW200420510A (OSRAM)
WO (1) WO2004067243A1 (OSRAM)

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KR100628276B1 (ko) * 2004-11-05 2006-09-27 엘지.필립스 엘시디 주식회사 스크라이브 장비 및 이를 구비한 기판의 절단장치 및이것을 이용한 기판의 절단방법
JP2006206361A (ja) * 2005-01-27 2006-08-10 Optrex Corp ガラス板の切断方法及び切断装置
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CN102344245B (zh) 2005-07-06 2015-10-28 三星钻石工业股份有限公司 脆性材料用划线轮和采用该划线轮的划线方法及装置、工具
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JP6355001B2 (ja) * 2017-03-29 2018-07-11 三星ダイヤモンド工業株式会社 基板ブレーク装置
CN107379292B (zh) * 2017-09-15 2019-07-02 京东方科技集团股份有限公司 显示面板的切割方法、系统和存储介质
JP6911720B2 (ja) * 2017-11-14 2021-07-28 日本電気硝子株式会社 ガラス板の製造方法及びガラス板
CN107942566A (zh) * 2018-01-04 2018-04-20 京东方科技集团股份有限公司 基板切割方法
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TWI715429B (zh) * 2020-02-03 2021-01-01 晶達光電股份有限公司 液晶面板切割裝置以及液晶面板切割方法
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JP7448970B2 (ja) 2021-08-02 2024-03-13 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
JP7408162B2 (ja) * 2021-08-17 2024-01-05 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
CN114163118B (zh) * 2021-12-01 2023-09-01 成都晶华光电科技股份有限公司 一种用于切割光学玻璃的二次激光裂片装置
CN115432920A (zh) * 2022-10-25 2022-12-06 深圳市益铂晶科技有限公司 一种玻璃激光切割的浸湿裂片方法

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