CN1393937A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
- Publication number
- CN1393937A CN1393937A CN02108311A CN02108311A CN1393937A CN 1393937 A CN1393937 A CN 1393937A CN 02108311 A CN02108311 A CN 02108311A CN 02108311 A CN02108311 A CN 02108311A CN 1393937 A CN1393937 A CN 1393937A
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- film
- device isolation
- semiconductor
- dielectric film
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims description 37
- 238000002955 isolation Methods 0.000 claims abstract description 124
- 238000007667 floating Methods 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000005530 etching Methods 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 139
- 239000010703 silicon Substances 0.000 claims description 139
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 44
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 44
- 230000012010 growth Effects 0.000 claims description 39
- 239000012535 impurity Substances 0.000 claims description 25
- 230000015572 biosynthetic process Effects 0.000 claims description 22
- 238000005498 polishing Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 21
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 8
- 239000000460 chlorine Substances 0.000 claims description 7
- 229920005591 polysilicon Polymers 0.000 claims description 7
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 239000003595 mist Substances 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000003472 neutralizing effect Effects 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 description 152
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 138
- 238000003860 storage Methods 0.000 description 31
- 239000010410 layer Substances 0.000 description 18
- 239000007789 gas Substances 0.000 description 15
- 238000009792 diffusion process Methods 0.000 description 12
- 239000010409 thin film Substances 0.000 description 11
- 239000012298 atmosphere Substances 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- 210000004027 cell Anatomy 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 5
- 238000000137 annealing Methods 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- AIOWANYIHSOXQY-UHFFFAOYSA-N cobalt silicon Chemical compound [Si].[Co] AIOWANYIHSOXQY-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 210000003323 beak Anatomy 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- -1 phosphonium ion Chemical class 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 101100373011 Drosophila melanogaster wapl gene Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- HAYXDMNJJFVXCI-UHFFFAOYSA-N arsenic(5+) Chemical compound [As+5] HAYXDMNJJFVXCI-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- BUMGIEFFCMBQDG-UHFFFAOYSA-N dichlorosilicon Chemical compound Cl[Si]Cl BUMGIEFFCMBQDG-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 210000004483 pasc Anatomy 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
- H01L29/42336—Gate electrodes for transistors with a floating gate with one gate at least partly formed in a trench
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP192825/2001 | 2001-06-26 | ||
JP2001192825A JP2003007869A (ja) | 2001-06-26 | 2001-06-26 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1393937A true CN1393937A (zh) | 2003-01-29 |
CN1189947C CN1189947C (zh) | 2005-02-16 |
Family
ID=19031219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021083118A Expired - Fee Related CN1189947C (zh) | 2001-06-26 | 2002-03-28 | 半导体器件及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6649965B2 (zh) |
EP (1) | EP1276148B1 (zh) |
JP (1) | JP2003007869A (zh) |
KR (1) | KR100818873B1 (zh) |
CN (1) | CN1189947C (zh) |
DE (1) | DE60238583D1 (zh) |
TW (1) | TW531895B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101022126B (zh) * | 2006-02-15 | 2011-10-05 | 三星电子株式会社 | 半导体器件及其相关制造方法 |
CN102612748A (zh) * | 2009-07-15 | 2012-07-25 | 桑迪士克3D公司 | 使用牺牲材料制造大马士革二极管的方法 |
CN101373774B (zh) * | 2007-08-23 | 2013-02-06 | 三星电子株式会社 | 集成电路存储器器件及其制造方法 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020091982A (ko) * | 2001-06-01 | 2002-12-11 | 삼성전자 주식회사 | 얕은 트렌치 소자분리 구조를 가지는 비휘발성 메모리소자 및 그 제조방법 |
US6559008B2 (en) * | 2001-10-04 | 2003-05-06 | Hynix Semiconductor America, Inc. | Non-volatile memory cells with selectively formed floating gate |
WO2004001824A1 (en) * | 2002-06-20 | 2003-12-31 | Koninklijke Philips Electronics N.V. | Conductive spacers extended floating gates |
KR100454135B1 (ko) * | 2002-10-10 | 2004-10-26 | 삼성전자주식회사 | 비휘발성 기억소자의 형성방법 |
ITTO20020997A1 (it) * | 2002-11-15 | 2004-05-16 | St Microelectronics Srl | Procedimento autoalllineato per la fabbricazione di |
KR100471575B1 (ko) * | 2002-12-26 | 2005-03-10 | 주식회사 하이닉스반도체 | 플래시 메모리 소자의 제조방법 |
JP2004235313A (ja) * | 2003-01-29 | 2004-08-19 | Renesas Technology Corp | 半導体装置 |
JP2005197363A (ja) * | 2004-01-05 | 2005-07-21 | Toshiba Corp | 不揮発性半導体メモリセル及びその製造方法 |
KR100734261B1 (ko) * | 2004-05-21 | 2007-07-02 | 삼성전자주식회사 | 커플링비를 향상시킬 수 있는 비휘발성 반도체 메모리 소자 |
JP4671775B2 (ja) * | 2004-06-25 | 2011-04-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP4488947B2 (ja) | 2005-04-08 | 2010-06-23 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法 |
KR100689203B1 (ko) * | 2005-04-22 | 2007-03-08 | 경북대학교 산학협력단 | 플래시 메모리 소자 |
US7348256B2 (en) * | 2005-07-25 | 2008-03-25 | Atmel Corporation | Methods of forming reduced electric field DMOS using self-aligned trench isolation |
JP2007134598A (ja) * | 2005-11-11 | 2007-05-31 | Toshiba Corp | 半導体装置の製造方法 |
JP2007165862A (ja) * | 2005-11-15 | 2007-06-28 | Toshiba Corp | 半導体装置の製造方法 |
JP4745039B2 (ja) * | 2005-12-02 | 2011-08-10 | 株式会社東芝 | 不揮発性半導体記憶装置およびその製造方法 |
JP4521366B2 (ja) * | 2006-02-22 | 2010-08-11 | 株式会社東芝 | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法 |
JP2007258510A (ja) * | 2006-03-24 | 2007-10-04 | Toshiba Corp | 半導体装置の製造方法 |
US7998809B2 (en) * | 2006-05-15 | 2011-08-16 | Micron Technology, Inc. | Method for forming a floating gate using chemical mechanical planarization |
US7675104B2 (en) * | 2006-07-31 | 2010-03-09 | Spansion Llc | Integrated circuit memory system employing silicon rich layers |
KR101169396B1 (ko) * | 2006-12-22 | 2012-07-30 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 그 동작 방법 |
KR100814408B1 (ko) * | 2007-04-04 | 2008-03-18 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 이의 제조 방법. |
US8148230B2 (en) * | 2009-07-15 | 2012-04-03 | Sandisk 3D Llc | Method of making damascene diodes using selective etching methods |
US20110133266A1 (en) * | 2009-12-03 | 2011-06-09 | Sanh Tang | Flash Memory Having a Floating Gate in the Shape of a Curved Section |
KR20120024199A (ko) * | 2010-09-06 | 2012-03-14 | 주식회사 유진테크 | 반도체 소자의 제조 방법 |
US9082654B2 (en) | 2013-05-30 | 2015-07-14 | Rohm Co., Ltd. | Method of manufacturing non-volatile memory cell with simplified step of forming floating gate |
JP2017224857A (ja) * | 2017-09-13 | 2017-12-21 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0344034A (ja) | 1989-07-12 | 1991-02-25 | Sony Corp | 多層配線形成方法 |
JPH04192422A (ja) | 1990-11-27 | 1992-07-10 | Canon Inc | 半導体装置およびその製造方法 |
JPH0536991A (ja) * | 1991-07-31 | 1993-02-12 | Nippon Steel Corp | 半導体記憶装置 |
WO1996008840A1 (en) * | 1994-09-13 | 1996-03-21 | Macronix International Co., Ltd. | A flash eprom transistor array and method for manufacturing the same |
JP3991383B2 (ja) | 1997-03-07 | 2007-10-17 | ソニー株式会社 | 半導体記憶装置及びその製造方法 |
JPH11163304A (ja) | 1997-11-28 | 1999-06-18 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
JPH11297863A (ja) * | 1998-04-10 | 1999-10-29 | Nec Corp | コンタクトレスアレイ構成の不揮発性メモリおよびその製造方法 |
JP2000012813A (ja) | 1998-04-22 | 2000-01-14 | Sony Corp | 半導体不揮発性記憶装置およびその製造方法 |
KR100316709B1 (ko) * | 1998-07-13 | 2001-12-12 | 윤종용 | 불휘발성 메모리 장치 제조 방법 |
JP4237344B2 (ja) * | 1998-09-29 | 2009-03-11 | 株式会社東芝 | 半導体装置及びその製造方法 |
KR100318683B1 (ko) * | 1998-12-17 | 2001-12-28 | 윤종용 | 산화막/질화막/산화막 유전층의 형성방법 |
JP3875455B2 (ja) * | 1999-04-28 | 2007-01-31 | 株式会社東芝 | 半導体装置の製造方法 |
KR100304710B1 (ko) * | 1999-08-30 | 2001-11-01 | 윤종용 | 셀 어레이 영역내에 벌크 바이어스 콘택 구조를 구비하는 비휘발성 메모리소자 |
JP3785003B2 (ja) * | 1999-09-20 | 2006-06-14 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法 |
FR2799050A1 (fr) * | 1999-09-24 | 2001-03-30 | St Microelectronics Sa | Procede de fabrication de points memoire eprom a surface reduite |
KR100331556B1 (ko) * | 1999-10-05 | 2002-04-06 | 윤종용 | 자기 정렬된 트랜치를 갖는 플레시 메모리 및 그 제조방법 |
JP3878374B2 (ja) * | 1999-12-01 | 2007-02-07 | 株式会社東芝 | 不揮発性半導体記憶装置 |
-
2001
- 2001-06-26 JP JP2001192825A patent/JP2003007869A/ja active Pending
-
2002
- 2002-03-04 EP EP02290517A patent/EP1276148B1/en not_active Expired - Lifetime
- 2002-03-04 DE DE60238583T patent/DE60238583D1/de not_active Expired - Lifetime
- 2002-03-06 TW TW091104169A patent/TW531895B/zh not_active IP Right Cessation
- 2002-03-07 US US10/091,507 patent/US6649965B2/en not_active Expired - Lifetime
- 2002-03-28 CN CNB021083118A patent/CN1189947C/zh not_active Expired - Fee Related
- 2002-03-29 KR KR1020020017297A patent/KR100818873B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101022126B (zh) * | 2006-02-15 | 2011-10-05 | 三星电子株式会社 | 半导体器件及其相关制造方法 |
CN101373774B (zh) * | 2007-08-23 | 2013-02-06 | 三星电子株式会社 | 集成电路存储器器件及其制造方法 |
CN102612748A (zh) * | 2009-07-15 | 2012-07-25 | 桑迪士克3D公司 | 使用牺牲材料制造大马士革二极管的方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1276148A2 (en) | 2003-01-15 |
TW531895B (en) | 2003-05-11 |
US20020195645A1 (en) | 2002-12-26 |
EP1276148B1 (en) | 2010-12-15 |
JP2003007869A (ja) | 2003-01-10 |
US6649965B2 (en) | 2003-11-18 |
DE60238583D1 (de) | 2011-01-27 |
KR100818873B1 (ko) | 2008-04-01 |
KR20030001230A (ko) | 2003-01-06 |
EP1276148A3 (en) | 2007-12-26 |
CN1189947C (zh) | 2005-02-16 |
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