CN1331164C - 芯片电阻器及其制造方法 - Google Patents

芯片电阻器及其制造方法 Download PDF

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Publication number
CN1331164C
CN1331164C CNB2004100373658A CN200410037365A CN1331164C CN 1331164 C CN1331164 C CN 1331164C CN B2004100373658 A CNB2004100373658 A CN B2004100373658A CN 200410037365 A CN200410037365 A CN 200410037365A CN 1331164 C CN1331164 C CN 1331164C
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CN
China
Prior art keywords
interarea
electric conductor
chip resister
face
resistive element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB2004100373658A
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English (en)
Chinese (zh)
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CN1542871A (zh
Inventor
塚田虎之
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Rohm Co Ltd
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Rohm Co Ltd
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Publication date
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Publication of CN1542871A publication Critical patent/CN1542871A/zh
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Publication of CN1331164C publication Critical patent/CN1331164C/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
CNB2004100373658A 2003-04-28 2004-04-27 芯片电阻器及其制造方法 Expired - Lifetime CN1331164C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003123656 2003-04-28
JP2003123656A JP4047760B2 (ja) 2003-04-28 2003-04-28 チップ抵抗器およびその製造方法

Publications (2)

Publication Number Publication Date
CN1542871A CN1542871A (zh) 2004-11-03
CN1331164C true CN1331164C (zh) 2007-08-08

Family

ID=33501484

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100373658A Expired - Lifetime CN1331164C (zh) 2003-04-28 2004-04-27 芯片电阻器及其制造方法

Country Status (3)

Country Link
US (2) US7193499B2 (ja)
JP (1) JP4047760B2 (ja)
CN (1) CN1331164C (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN104637914A (zh) * 2015-02-28 2015-05-20 立昌先进科技股份有限公司 多功能表面黏着型电子组件及其制法

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DE102006060387A1 (de) * 2006-12-20 2008-06-26 Isabellenhütte Heusler Gmbh & Co. Kg Widerstand, insbesondere SMD-Widerstand, und zugehöriges Herstellungsverfahren
US20100236054A1 (en) * 2007-08-30 2010-09-23 Kamaya Electric Co., Ltd. Method and apparatus for manufacturing metal plate chip resistors
JP4537465B2 (ja) * 2008-02-18 2010-09-01 釜屋電機株式会社 抵抗金属板低抵抗チップ抵抗器の製造方法
JP5544839B2 (ja) * 2009-11-24 2014-07-09 コーア株式会社 抵抗器の抵抗値調整方法
JP6134507B2 (ja) * 2011-12-28 2017-05-24 ローム株式会社 チップ抵抗器およびその製造方法
JP6457172B2 (ja) * 2013-10-22 2019-01-23 Koa株式会社 抵抗素子の製造方法
TWI501363B (zh) * 2014-01-10 2015-09-21 Sfi Electronics Technology Inc 一種小型化表面黏著型二極體封裝元件及其製法
US9396849B1 (en) 2014-03-10 2016-07-19 Vishay Dale Electronics Llc Resistor and method of manufacture
KR101630035B1 (ko) * 2014-04-25 2016-06-13 삼성전기주식회사 모바일 기기용 저항 조립체 및 그 제조 방법
KR101973420B1 (ko) * 2014-10-06 2019-04-29 삼성전기주식회사 다단자 전자부품, 그 제조방법 및 다단자 전자부품의 실장 기판
KR20160052283A (ko) * 2014-11-04 2016-05-12 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판
KR101670140B1 (ko) * 2014-12-15 2016-10-27 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판
JP6495724B2 (ja) * 2015-04-15 2019-04-03 Koa株式会社 チップ抵抗器およびその製造方法
JP7018251B2 (ja) * 2015-05-21 2022-02-10 ローム株式会社 チップ抵抗器
TWM516215U (zh) * 2015-09-23 2016-01-21 Yageo Corp 弓形分流器電阻
US10083781B2 (en) * 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
WO2017188307A1 (ja) * 2016-04-27 2017-11-02 パナソニックＩｐマネジメント株式会社 チップ抵抗器およびその製造方法
WO2018013671A1 (en) * 2016-07-12 2018-01-18 Advense Technology Inc. A nanocomposite force sensing material
US10242774B2 (en) 2017-04-27 2019-03-26 Samsung Electro-Mechanics Co., Ltd. Chip resistance element and chip resistance element assembly
US10763017B2 (en) 2017-05-23 2020-09-01 Panasonic Intellectual Property Management Co., Ltd. Metal plate resistor and method for manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
JP6562375B1 (ja) * 2017-12-01 2019-08-21 パナソニックＩｐマネジメント株式会社 金属板抵抗器およびその製造方法
CN108666057B (zh) * 2018-04-03 2024-04-30 广东风华高新科技股份有限公司 一种片式电阻器及其制备方法
DE102018115205A1 (de) * 2018-06-25 2020-01-02 Vishay Electronic Gmbh Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten
CN108987010A (zh) * 2018-07-10 2018-12-11 广东风华高新科技股份有限公司 一种油位电阻片及其制造方法
CN109411166A (zh) * 2018-10-18 2019-03-01 南京萨特科技发展有限公司 一种合金电阻器及其制造方法
JP7546360B2 (ja) * 2020-01-27 2024-09-06 Koa株式会社 抵抗器
TWI718972B (zh) * 2020-07-07 2021-02-11 旺詮股份有限公司 具有精準電阻值之微型電阻元件的製作方法
US11641717B2 (en) * 2021-08-30 2023-05-02 International Business Machines Corporation Soldering of end chip components in series

Citations (3)

* Cited by examiner, † Cited by third party
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JPH10144505A (ja) * 1996-11-07 1998-05-29 Tdk Corp チップ形サーミスタ
JP2001167907A (ja) * 1992-11-30 2001-06-22 Mitsubishi Materials Corp チップ型サーミスタ及びその製造方法
JP2002057010A (ja) * 2000-08-07 2002-02-22 Koa Corp 抵抗器の製造方法および抵抗器

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US5907274A (en) * 1996-09-11 1999-05-25 Matsushita Electric Industrial Co., Ltd. Chip resistor
JP3058097B2 (ja) * 1996-10-09 2000-07-04 株式会社村田製作所 サーミスタチップ及びその製造方法
JP3466411B2 (ja) 1997-03-31 2003-11-10 太陽誘電株式会社 チップ抵抗器
TW414898B (en) * 1997-10-06 2000-12-11 Tdk Corp Electronic device and its production
JP2000114009A (ja) 1998-10-08 2000-04-21 Alpha Electronics Kk 抵抗器、その実装方法および製造方法
JP2001176701A (ja) 1999-12-17 2001-06-29 Tateyama Kagaku Kogyo Kk 抵抗器とその製造方法
JP4722318B2 (ja) * 2000-06-05 2011-07-13 ローム株式会社 チップ抵抗器
JP4138215B2 (ja) 2000-08-07 2008-08-27 コーア株式会社 チップ抵抗器の製造方法
JP2002222701A (ja) * 2001-01-25 2002-08-09 Matsushita Electric Ind Co Ltd チップ状電子部品およびチップ抵抗器
JP3703725B2 (ja) * 2001-03-01 2005-10-05 寛治 大塚 バス終端方法、終端抵抗器、配線基板およびその製造方法
JP3846312B2 (ja) * 2002-01-15 2006-11-15 松下電器産業株式会社 多連チップ抵抗器の製造方法
JP3869273B2 (ja) * 2002-01-17 2007-01-17 ローム株式会社 チップ抵抗器の製造方法
JP3967272B2 (ja) * 2003-02-25 2007-08-29 ローム株式会社 チップ抵抗器
JP2004259864A (ja) * 2003-02-25 2004-09-16 Rohm Co Ltd チップ抵抗器
JP3971335B2 (ja) * 2003-04-08 2007-09-05 ローム株式会社 チップ抵抗器およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001167907A (ja) * 1992-11-30 2001-06-22 Mitsubishi Materials Corp チップ型サーミスタ及びその製造方法
JPH10144505A (ja) * 1996-11-07 1998-05-29 Tdk Corp チップ形サーミスタ
JP2002057010A (ja) * 2000-08-07 2002-02-22 Koa Corp 抵抗器の製造方法および抵抗器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104637914A (zh) * 2015-02-28 2015-05-20 立昌先进科技股份有限公司 多功能表面黏着型电子组件及其制法
CN104637914B (zh) * 2015-02-28 2018-02-13 立昌先进科技股份有限公司 多功能表面黏着型电子组件及其制法

Also Published As

Publication number Publication date
CN1542871A (zh) 2004-11-03
US7193499B2 (en) 2007-03-20
JP4047760B2 (ja) 2008-02-13
US20070132545A1 (en) 2007-06-14
JP2004327907A (ja) 2004-11-18
US20040252009A1 (en) 2004-12-16
US7378937B2 (en) 2008-05-27

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Granted publication date: 20070808