CN1170885C - 热固性树脂组合物 - Google Patents

热固性树脂组合物 Download PDF

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Publication number
CN1170885C
CN1170885C CNB02126239XA CN02126239A CN1170885C CN 1170885 C CN1170885 C CN 1170885C CN B02126239X A CNB02126239X A CN B02126239XA CN 02126239 A CN02126239 A CN 02126239A CN 1170885 C CN1170885 C CN 1170885C
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CN
China
Prior art keywords
component
composition
epoxy
temperature
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB02126239XA
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English (en)
Chinese (zh)
Other versions
CN1398918A (zh
Inventor
佐藤清
北村和宪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAMAHIDE CHEMISTRY CO Ltd
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YAMAHIDE CHEMISTRY CO Ltd
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Publication of CN1398918A publication Critical patent/CN1398918A/zh
Application granted granted Critical
Publication of CN1170885C publication Critical patent/CN1170885C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CNB02126239XA 2001-07-19 2002-07-17 热固性树脂组合物 Expired - Lifetime CN1170885C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001253678A JP3911690B2 (ja) 2001-07-19 2001-07-19 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板
JP2001253678 2001-07-19

Publications (2)

Publication Number Publication Date
CN1398918A CN1398918A (zh) 2003-02-26
CN1170885C true CN1170885C (zh) 2004-10-13

Family

ID=19081968

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB02126239XA Expired - Lifetime CN1170885C (zh) 2001-07-19 2002-07-17 热固性树脂组合物

Country Status (8)

Country Link
US (2) US6812299B2 (https=)
EP (1) EP1277798B1 (https=)
JP (1) JP3911690B2 (https=)
KR (1) KR100584435B1 (https=)
CN (1) CN1170885C (https=)
AT (1) ATE373047T1 (https=)
DE (1) DE60222340T2 (https=)
TW (1) TW593530B (https=)

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* Cited by examiner, † Cited by third party
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JP3911690B2 (ja) * 2001-07-19 2007-05-09 山栄化学株式会社 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板
JP2003105061A (ja) * 2001-09-27 2003-04-09 Sanei Kagaku Kk 光・熱硬化性樹脂組成物、並びに穴詰プリント配線（基）板の製造方法及び穴詰プリント配線（基）板
JP2004066017A (ja) * 2002-08-01 2004-03-04 Nippon Paint Co Ltd ソルダーレジスト膜の形成方法
JP2005209861A (ja) * 2004-01-22 2005-08-04 Nippon Steel Corp ウェハレベルパッケージ及びその製造方法
JP4683182B2 (ja) * 2004-09-28 2011-05-11 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法
JP4735815B2 (ja) * 2005-04-18 2011-07-27 山栄化学株式会社 穴埋め多層プリント配線板及びその製造方法
JP2007257818A (ja) * 2006-02-27 2007-10-04 Tdk Corp 情報記録媒体製造方法
JP4351239B2 (ja) * 2006-09-13 2009-10-28 タツタ システム・エレクトロニクス株式会社 熱伝導性ペースト
JP5360359B2 (ja) * 2008-07-01 2013-12-04 株式会社スリーボンド エポキシ樹脂組成物
JP5344394B2 (ja) 2008-07-10 2013-11-20 山栄化学株式会社 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板
US7943862B2 (en) * 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling
US20100155128A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Printed electronic circuit boards and other articles having patterned coonductive images
JP5467469B2 (ja) 2011-01-04 2014-04-09 山栄化学株式会社 プリント配線基板に表面実装する方法
JP2012241076A (ja) * 2011-05-18 2012-12-10 Hitachi Industrial Equipment Systems Co Ltd 高耐熱性熱硬化性樹脂組成物およびそれを用いた電気機器
JP5018985B1 (ja) * 2011-06-17 2012-09-05 パナソニック株式会社 配線基板と、配線基板の製造方法
CN104471644B (zh) * 2012-07-20 2018-08-17 协立化学产业株式会社 硬盘装置用固化性组合物
JP6545924B2 (ja) * 2012-12-27 2019-07-17 味の素株式会社 粗化硬化体、積層体、プリント配線板及び半導体装置
CN104530789B (zh) * 2015-01-19 2017-08-08 广东希贵光固化材料有限公司 一种用于转印膜的阳离子光固化涂料
KR101753158B1 (ko) * 2016-04-28 2017-08-09 (주)이녹스첨단소재 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름
KR102605475B1 (ko) * 2016-06-24 2023-11-23 (주)이녹스첨단소재 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름
CN108241253B (zh) * 2016-12-27 2021-11-09 太阳油墨（苏州）有限公司 碱显影型阻焊剂组合物、其干膜、和固化物以及印刷电路板
JP2020019983A (ja) * 2018-07-31 2020-02-06 セイコーエプソン株式会社 配線基板及び配線基板の製造方法
CN109705700A (zh) * 2018-12-21 2019-05-03 北京隆源纳欣科技有限公司 一种双重固化耐湿热重防腐陶瓷涂料
JP7220623B2 (ja) * 2019-05-28 2023-02-10 株式会社タムラ製作所 保護被膜を有する配線板の製造方法

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JP3911690B2 (ja) * 2001-07-19 2007-05-09 山栄化学株式会社 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板

Also Published As

Publication number Publication date
US20030162898A1 (en) 2003-08-28
US20050019582A1 (en) 2005-01-27
US7410673B2 (en) 2008-08-12
US6812299B2 (en) 2004-11-02
KR100584435B1 (ko) 2006-05-26
ATE373047T1 (de) 2007-09-15
DE60222340D1 (de) 2007-10-25
TW593530B (en) 2004-06-21
EP1277798A2 (en) 2003-01-22
JP3911690B2 (ja) 2007-05-09
CN1398918A (zh) 2003-02-26
EP1277798B1 (en) 2007-09-12
KR20030009192A (ko) 2003-01-29
DE60222340T2 (de) 2008-06-19
JP2003026765A (ja) 2003-01-29
EP1277798A3 (en) 2003-06-11

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Granted publication date: 20041013