JP4735815B2 - 穴埋め多層プリント配線板及びその製造方法 - Google Patents
穴埋め多層プリント配線板及びその製造方法 Download PDFInfo
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- JP4735815B2 JP4735815B2 JP2005147287A JP2005147287A JP4735815B2 JP 4735815 B2 JP4735815 B2 JP 4735815B2 JP 2005147287 A JP2005147287 A JP 2005147287A JP 2005147287 A JP2005147287 A JP 2005147287A JP 4735815 B2 JP4735815 B2 JP 4735815B2
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Description
即ち、本発明は、両面プリント配線板の貫通穴に二段階硬化型樹脂組成物を塗布により充填し、100〜200℃の加熱若しくはUV照射により上記充填樹脂の第一段硬化を行い、研磨を行うことなく両面プリント配線板をア)樹脂付き銅箔と樹脂付き銅箔、又はイ)樹脂付き銅箔とプリプレグとの間に挟んで、第二段硬化温度以上にて積層プレスした後、表層の銅箔より導体パターンを形成する穴埋め多層プリント配線板の製造方法を提供する。
[II]:(メタ)アクリレート類。
[III]:ラジカル熱重合開始剤。
[IV]:光架橋剤。
[V]:エポキシ樹脂。
「VI]:潜在性硬化剤。
本発明の穴埋め多層プリント配線板の製造方法においては先ず、両面プリント配線板の貫通穴に二段階硬化型樹脂組成物を塗布により充填して、貫通穴の穴埋めを行う。
[II]:(メタ)アクリレート類。
[III]:ラジカル熱重合開始剤。
[V]:エポキシ樹脂。
[VI]:潜在性硬化剤。
<熱・熱硬化型樹脂組成物の調製>
・調製例1〜3
成分[I]と成分[II]との混合物、成分[III]、成分[V]、成分[VI]、並びに他の配合成分を順次加え、撹拌混合した。次いで、3本ロールミルにて均一に分散させた。得られた均一分散物を真空脱泡して、熱・熱硬化型樹脂組成物(調製例1〜3)を調製した。表5に各配合成分及び配合量(重量部)を示す。
・調製例4
成分[I]、成分[II]、成分「IV]、成分[V]、成分[VI]、並びに他の配合成分を順次加え、撹拌混合した。次いで、3本ロールミルにて均一に分散させた。得られた均一分散物を真空脱泡して、光・熱硬化型樹脂組成物(調製例4)を調製した。表5に各配合成分及び配合量(重量部)を示す。
・実施例1
両面プリント配線板として、絶縁基板[図1A、(1)]の両面に導体パターン層[図1A、(2)]を備え、且つスルーホール[図1A、(3)]内壁が銅張りされたもの[銅回路厚が40μ、L/S=75μ]を使用した。
上記のようにして、本発明の穴埋多層プリント配線板(実施例1)を製造した[図1D]。
スルーホール内に充填・穴埋する熱・熱硬化型樹脂組成物として、調製例1の替わりに調製例2を使用し、更に一次硬化の加熱温度を150℃の替わりに120℃とした以外は、すべて上記の実施例1と同様の方法で、穴埋多層プリント配線板(実施例2)を製造した。
スルーホール内に充填・穴埋する熱・熱硬化型樹脂組成物として、調製例1の替わりに調製例3を使用し、更に一次硬化の加熱温度を150℃の替わりに110℃とした以外は、すべて上記の実施例1と同様の方法で、穴埋多層プリント配線板(実施例3)を製造した。
両面プリント配線板として、絶縁基板の両面に導体パターン層を備え、且つスルーホール内壁が銅張りされたもの[銅回路厚が40μ、L/S=75μ]を使用した。
上記のようにして、穴埋多層プリント配線板(比較例1)を製造した。
・実施例4
両面プリント配線板として、絶縁基板[図1A、(1)]の両面に導体パターン層[図1A、(2)]を備え、且つスルーホール[図1A、(3)]内壁が銅張りされたもの[銅回路厚が40μ、L/S=75μ]を使用した。
両面プリント配線板として、絶縁基板[図2A、(9)]の両面に導体パターン層[図2A、(10)]を備え、且つスルーホール[図2A、(11)]内壁が銅張りされたもの[銅回路厚が40μ、L/S=75μ]を使用した。
上記のようにして、穴埋多層プリント配線板(比較例2)を作製した[図2E]。
得られた穴埋多層プリント配線板の穴埋部分の平坦性を調べた。即ち、穴埋多層プリント配線板の表層銅箔の平坦性を、表面粗さ計によって調べた。結果を表7に示す。
2,7,10,15,17,22,28,31,33,36,39:導体パターン。
3,11:スルーホール。
4,12,18,23,29,34,40:熱・熱硬化型樹脂組成物A又は光・熱硬化型樹脂組成物B。
5,13,19,24,30,35,41:樹脂付き銅箔の樹脂層。
6,14,20,25:樹脂付き銅箔の銅箔。
8:導体パターン間の凹部。
26,37:プリプレグ。
Claims (4)
- 両面プリント配線板の貫通穴に二段階硬化型樹脂組成物を塗布により充填し、100〜200℃の加熱若しくはUV照射により上記充填樹脂の第一段硬化を行い、研磨を行うことなく両面プリント配線板を
ア)樹脂付き銅箔と樹脂付き銅箔、又は
イ)樹脂付き銅箔とプリプレグ
との間に挟んで、第二段硬化温度以上にて積層プレスした後、表層の銅箔より導体パターンを形成することを特徴とする穴埋め多層プリント配線板の製造方法。 - 二段階硬化型樹脂組成物が、下記成分[I]、[II]、[III]、[V]、及び[VI]を含有する熱・熱硬化型樹脂組成物A、又は
下記成分[I]、[II]、[IV]、[V]、及び[VI]を含有する光・熱硬化型樹脂組成物Bであることを特徴とする請求項1に記載の穴埋め多層プリント配線板の製造方法。
[I]:エポキシ樹脂の不飽和脂肪酸部分付加物。
[II]:(メタ)アクリレート類。
[III]:ラジカル熱重合開始剤。
[IV]:光架橋剤。
[V]:エポキシ樹脂。
[VI]:潜在性硬化剤。 - 成分[V]:エポキシ樹脂が、結晶性エポキシ樹脂及び/又は液状エポキシ樹脂である請求項2に記載の穴埋め多層プリント配線板の製造方法。
- 請求項1乃至3の何れかに記載の製造方法にて製造される穴埋め多層プリント配線板。
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04215498A (ja) * | 1990-12-14 | 1992-08-06 | Matsushita Electric Works Ltd | 多層回路板の製造方法 |
JPH06338687A (ja) * | 1993-05-31 | 1994-12-06 | Nec Corp | 多層印刷配線板およびその製造方法 |
JPH07336054A (ja) * | 1994-04-14 | 1995-12-22 | Sumitomo Bakelite Co Ltd | 多層プリント配線板用層間絶縁樹脂材料及び多層プリント配線板の製造方法 |
JP2000244118A (ja) * | 1999-02-23 | 2000-09-08 | Matsushita Electric Works Ltd | ビルドアップ多層配線板の製造方法 |
JP2003026765A (ja) * | 2001-07-19 | 2003-01-29 | Sanei Kagaku Kk | 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板 |
JP2003105061A (ja) * | 2001-09-27 | 2003-04-09 | Sanei Kagaku Kk | 光・熱硬化性樹脂組成物、並びに穴詰プリント配線(基)板の製造方法及び穴詰プリント配線(基)板 |
JP2003286333A (ja) * | 2002-03-28 | 2003-10-10 | Mitsubishi Gas Chem Co Inc | スルーホール充填用エポキシ組成物及びプリント板の孔埋め方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3352023B2 (ja) * | 1998-03-26 | 2002-12-03 | イビデン株式会社 | 多層プリント配線板の製造方法 |
-
2005
- 2005-04-18 JP JP2005147287A patent/JP4735815B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04215498A (ja) * | 1990-12-14 | 1992-08-06 | Matsushita Electric Works Ltd | 多層回路板の製造方法 |
JPH06338687A (ja) * | 1993-05-31 | 1994-12-06 | Nec Corp | 多層印刷配線板およびその製造方法 |
JPH07336054A (ja) * | 1994-04-14 | 1995-12-22 | Sumitomo Bakelite Co Ltd | 多層プリント配線板用層間絶縁樹脂材料及び多層プリント配線板の製造方法 |
JP2000244118A (ja) * | 1999-02-23 | 2000-09-08 | Matsushita Electric Works Ltd | ビルドアップ多層配線板の製造方法 |
JP2003026765A (ja) * | 2001-07-19 | 2003-01-29 | Sanei Kagaku Kk | 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板 |
JP2003105061A (ja) * | 2001-09-27 | 2003-04-09 | Sanei Kagaku Kk | 光・熱硬化性樹脂組成物、並びに穴詰プリント配線(基)板の製造方法及び穴詰プリント配線(基)板 |
JP2003286333A (ja) * | 2002-03-28 | 2003-10-10 | Mitsubishi Gas Chem Co Inc | スルーホール充填用エポキシ組成物及びプリント板の孔埋め方法 |
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