JP2020019983A - 配線基板及び配線基板の製造方法 - Google Patents
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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Abstract
Description
例えば、特許文献1には、基板である合成樹脂の基体にレーザービームを照射して表面改質し、該表面改質をした部分にイオン触媒を接触させて無電解めっきをすることで金属配線を形成する、配線基板である成形回路部品の製造方法が開示されている。
上記課題を解決するための本発明の第1の態様の配線基板は、樹脂を主成分とする基板が前記樹脂と触媒とが混ざり合った混合層を含み、金属配線が前記混合層を覆って配置され、前記金属配線は前記触媒と接触していることを特徴とする。
ここで、「触媒」とは、金属めっき層を形成する際の金属の析出反応を行わせる際の触媒を意味する。
本発明の実施例1に係る配線基板1及びの配線基板1の製造方法について図1から図3を参照して説明する。図1では、配線基板1の製造開始状態を表す1番上の図から完成した状態を表す1番下の図まで、配線基板1の製造過程を表している。本実施例の配線基板1は、金属配線が形成される配線基板である。金属配線に使用される金属としては、例えば、銅を好ましく用いることができるが銅に限定されない。
次に、本発明の実施例2に係る配線基板1及びの配線基板1の製造方法について図4及び図5を参照して説明する。本実施例の配線基板1も実施例1の配線基板1と同様、金属配線が形成される配線基板である。金属配線に使用される金属としては、例えば、銅を好ましく用いることができるが銅に限定されない。
なお、図4は実施例1の配線基板1における図1に対応する図であり、図5は実施例1の配線基板1の製造方法における図2に対応する図である。なお、上記実施例1と共通する構成部材は同じ符号で示しており、詳細な説明は省略する。
次に、本発明の実施例3に係る配線基板1及びの配線基板1の製造方法について図6及び図7を参照して説明する。本実施例の配線基板1も実施例1及び実施例2の配線基板1と同様、金属配線が形成される配線基板である。金属配線に使用される金属としては、例えば、銅を好ましく用いることができるが銅に限定されない。
なお、図6は実施例1の配線基板1における図1に対応する図であり、図7は実施例1の配線基板1の製造方法における図2に対応する図である。なお、上記実施例1及び実施例2と共通する構成部材は同じ符号で示しており、詳細な説明は省略する。
5…レーザー、6…金属めっき層(金属配線)、11…絶縁性材料、
12…絶縁性材料11の除去部分、21…表面層形成部、23…表面層、
24…表面改質部分、R1…レーザー5の照射領域(金属配線の形成部分)、
R2…レーザー5の非照射領域
Claims (6)
- 樹脂を主成分とする基板が前記樹脂と触媒とが混ざり合った混合層を含み、
金属配線が前記混合層を覆って配置され、前記金属配線は前記触媒と接触していることを特徴とする配線基板。 - 請求項1に記載の配線基板において、
前記基板の一面における前記金属配線の非形成部分に絶縁性の材料が配置されていることを特徴とする配線基板。 - 樹脂を主成分とする基板の一面に触媒を付与する触媒付与工程と、
前記基板へ前記触媒を介してレーザーを照射する第一のレーザー照射工程と、
前記第一のレーザー照射工程におけるレーザーの照射領域に金属めっきをする金属めっき工程と、
を含むことを特徴とする配線基板の製造方法。 - 請求項3に記載の配線基板の製造方法において、
前記基板の一面に絶縁性の材料を付与する絶縁性材料付与工程と、
前記基板へ前記絶縁性の材料を介してレーザーを照射する第二のレーザー照射工程と、
を前記触媒付与工程に先立って実行し、
前記触媒付与工程は、前記第二のレーザー照射工程におけるレーザーの照射領域を含む領域に前記触媒を付与し、
前記第一のレーザー照射工程は、前記第二のレーザー照射工程におけるレーザーの照射領域に、レーザーを照射することを特徴とする配線基板の製造方法。 - 請求項3または4の配線基板の製造方法において、
前記第一のレーザー照射工程は、前記触媒を前記樹脂中に拡散させる拡散工程と、前記樹脂を溶発する溶発工程と、を含むことを特徴とする配線基板の製造方法。 - 樹脂を主成分とする基板の一面に、触媒と前記樹脂とが混ざり合った表面層を形成する表面層形成工程と、
前記表面層にレーザーを照射する表面層への第三のレーザー照射工程と、
前記第三のレーザー照射工程におけるレーザーの照射領域に金属めっきをする金属めっき工程と、
を含むことを特徴とする配線基板の製造方法。
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JP2018143270A JP2020019983A (ja) | 2018-07-31 | 2018-07-31 | 配線基板及び配線基板の製造方法 |
CN201910682803.2A CN110785018A (zh) | 2018-07-31 | 2019-07-26 | 配线基板以及配线基板的制造方法 |
US16/526,072 US11109491B2 (en) | 2018-07-31 | 2019-07-30 | Wiring substrate and method of manufacturing the wiring substrate |
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JP2006253282A (ja) * | 2005-03-09 | 2006-09-21 | Ebara Corp | 金属膜のパターン形成方法 |
JP2017157592A (ja) * | 2016-02-29 | 2017-09-07 | アルプス電気株式会社 | 配線構造体の製造方法および配線構造体 |
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