CN107039387B - 引线框架、半导体装置及引线框架的制造方法 - Google Patents

引线框架、半导体装置及引线框架的制造方法 Download PDF

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CN107039387B
CN107039387B CN201710012575.9A CN201710012575A CN107039387B CN 107039387 B CN107039387 B CN 107039387B CN 201710012575 A CN201710012575 A CN 201710012575A CN 107039387 B CN107039387 B CN 107039387B
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lead
frame
lead frame
resin
leads
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CN107039387A (zh
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笠原哲一郎
松泽秀树
大串正幸
坂井直也
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Shinko Electric Industries Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
CN201710012575.9A 2016-01-18 2017-01-09 引线框架、半导体装置及引线框架的制造方法 Active CN107039387B (zh)

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JP2016-007413 2016-01-18
JP2016007413A JP6577373B2 (ja) 2016-01-18 2016-01-18 リードフレーム及びその製造方法、半導体装置

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CN107039387A CN107039387A (zh) 2017-08-11
CN107039387B true CN107039387B (zh) 2021-09-28

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US (1) US9972560B2 (https=)
JP (1) JP6577373B2 (https=)
CN (1) CN107039387B (https=)
TW (1) TWI700789B (https=)

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JP7021970B2 (ja) * 2018-02-13 2022-02-17 株式会社三井ハイテック リードフレーム、樹脂付きリードフレーム、樹脂付きリードフレームの製造方法および半導体装置の製造方法
KR102724892B1 (ko) * 2018-12-04 2024-11-01 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP7232123B2 (ja) 2019-05-14 2023-03-02 新光電気工業株式会社 配線基板、電子装置、及び配線基板の製造方法
JP7382210B2 (ja) * 2019-11-15 2023-11-16 新光電気工業株式会社 配線基板、電子装置及び配線基板の製造方法
JP7483595B2 (ja) 2020-11-13 2024-05-15 新光電気工業株式会社 配線基板、電子装置及び配線基板の製造方法
JP7617812B2 (ja) 2021-05-24 2025-01-20 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
CN120565531B (zh) * 2025-07-29 2025-11-07 气派科技股份有限公司 一种高密度框架结构及其制作方法

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CN102165586A (zh) * 2008-09-30 2011-08-24 凸版印刷株式会社 引线框基板以及该引线框基板的制造方法
CN103094222A (zh) * 2011-10-27 2013-05-08 三星电机株式会社 半导体封装及其制造方法以及半导体封装模块

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JP3072291B1 (ja) 1999-04-23 2000-07-31 松下電子工業株式会社 リ―ドフレ―ムとそれを用いた樹脂封止型半導体装置およびその製造方法
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CN102165586A (zh) * 2008-09-30 2011-08-24 凸版印刷株式会社 引线框基板以及该引线框基板的制造方法
CN101958305A (zh) * 2010-09-04 2011-01-26 江苏长电科技股份有限公司 双面图形芯片正装模组封装结构及其封装方法
CN103094222A (zh) * 2011-10-27 2013-05-08 三星电机株式会社 半导体封装及其制造方法以及半导体封装模块

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JP2017130493A (ja) 2017-07-27
TW201737430A (zh) 2017-10-16
JP6577373B2 (ja) 2019-09-18
US9972560B2 (en) 2018-05-15
TWI700789B (zh) 2020-08-01
US20170207148A1 (en) 2017-07-20
CN107039387A (zh) 2017-08-11

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