JPS5691455A - Lead frame for manufacturing of semiconductor device - Google Patents

Lead frame for manufacturing of semiconductor device

Info

Publication number
JPS5691455A
JPS5691455A JP16811879A JP16811879A JPS5691455A JP S5691455 A JPS5691455 A JP S5691455A JP 16811879 A JP16811879 A JP 16811879A JP 16811879 A JP16811879 A JP 16811879A JP S5691455 A JPS5691455 A JP S5691455A
Authority
JP
Japan
Prior art keywords
frame
lead
terminal
outside
die stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16811879A
Other languages
Japanese (ja)
Other versions
JPS6231497B2 (en
Inventor
Akihiro Kubota
Tsuyoshi Aoki
Rikio Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16811879A priority Critical patent/JPS5691455A/en
Publication of JPS5691455A publication Critical patent/JPS5691455A/en
Publication of JPS6231497B2 publication Critical patent/JPS6231497B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49534—Multi-layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To increase mechanical strength by thickening an outside terminal and to heighten density by thinning an inside terminal, by placing the second frame of the same shape on the outside terminal of the first frame provided with a die stage, the inside terminal and the outside terminal. CONSTITUTION:The first frame 1 is composed of a die stage 2 to be loaded with a semiconductor, an inside lead 3a and an outside lead 3b, and the second frame 5 is composed of a die stage and an inside lead equal to the die stage and the inside lead 3a of the first frame provided that the inside positions are eliminated. The section indicated by a broken line is the area where a resin stop 8 is arranged. By making these two (2) frame face each, the frames are pressed and joined through a metallic material 7 and a plated layer 6. As the outside leads, which were put together in layers, become thicker and stronger while the inside lead in the center becomes thinner and a fine pattern is formed, it is possible to heighten density.
JP16811879A 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device Granted JPS5691455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16811879A JPS5691455A (en) 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16811879A JPS5691455A (en) 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5691455A true JPS5691455A (en) 1981-07-24
JPS6231497B2 JPS6231497B2 (en) 1987-07-08

Family

ID=15862176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16811879A Granted JPS5691455A (en) 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5691455A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236547U (en) * 1985-08-20 1987-03-04
US4706105A (en) * 1983-02-02 1987-11-10 Hitachi, Ltd. Semiconductor device and method of producing the same
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
US5162895A (en) * 1990-04-18 1992-11-10 Kabushiki Kaisha Toshiba Lead frame for semiconductor device that prevents island torsion
JP2017130493A (en) * 2016-01-18 2017-07-27 新光電気工業株式会社 Lead frame, method for producing the same, and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147668A (en) * 1974-05-16 1975-11-26
JPS5140869A (en) * 1974-10-04 1976-04-06 Nippon Electric Co

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147668A (en) * 1974-05-16 1975-11-26
JPS5140869A (en) * 1974-10-04 1976-04-06 Nippon Electric Co

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4706105A (en) * 1983-02-02 1987-11-10 Hitachi, Ltd. Semiconductor device and method of producing the same
JPS6236547U (en) * 1985-08-20 1987-03-04
JPH0519958Y2 (en) * 1985-08-20 1993-05-25
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
US5162895A (en) * 1990-04-18 1992-11-10 Kabushiki Kaisha Toshiba Lead frame for semiconductor device that prevents island torsion
JP2017130493A (en) * 2016-01-18 2017-07-27 新光電気工業株式会社 Lead frame, method for producing the same, and semiconductor device

Also Published As

Publication number Publication date
JPS6231497B2 (en) 1987-07-08

Similar Documents

Publication Publication Date Title
JPS55163868A (en) Lead frame and semiconductor device using the same
JPS5691455A (en) Lead frame for manufacturing of semiconductor device
JPS55127047A (en) Resin-sealed semiconductor device
JPS5548943A (en) Composite integrated circuit
JPS55146951A (en) Lead frame
CA1024663A (en) Method for forming openings through insulative layers in the fabrication of integrated circuits
ES426538A2 (en) Process of producing solderable composites containing AgCdO
JPS5662348A (en) Semiconductor device and production thereof
ES8602929A1 (en) Method and device for manufacturing a cake of compound soap, cake of soap thus composed and elements of soap material.
JPS5295176A (en) Manufacture of semiconductor apparatus
JPS5324280A (en) Production of semiconductor integrated circuit
JPS5544836A (en) Mold and method of producing same
JPS57148362A (en) Semiconductor device
JPS5313357A (en) Formation of connector lead of semiconductor device
JPS55151357A (en) Lead frame for semiconductor device
JPS5233113A (en) Manufaceuring method for resisting pessure vessel
JPS5742137A (en) Semiconductor device
JPS5278003A (en) Manufacturing process of electric machine coils
JPS533084A (en) Semiconductor device
JPS6442844A (en) Lead frame for semiconductor device
JPS6412558A (en) Integrated circuit package and manufacture thereof
JPS5687350A (en) Semiconductor device
JPS56137664A (en) Lead frame and semiconductor device having lead frame
JPS572554A (en) Semiconductor device
JPS5432293A (en) Superconduction coil