CN103342877B - 树脂组合物、预渍体、层叠板及布线板 - Google Patents
树脂组合物、预渍体、层叠板及布线板 Download PDFInfo
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- CN103342877B CN103342877B CN201310204048.XA CN201310204048A CN103342877B CN 103342877 B CN103342877 B CN 103342877B CN 201310204048 A CN201310204048 A CN 201310204048A CN 103342877 B CN103342877 B CN 103342877B
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- Prior art keywords
- resin
- resin combination
- plywood
- coefficient
- epoxy resin
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- 239000011521 glass Substances 0.000 claims description 23
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- 239000002759 woven fabric Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 13
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical compound N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 claims description 13
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 8
- -1 cresols phenolic aldehyde Chemical class 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
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- 239000004760 aramid Substances 0.000 claims description 4
- 229920003235 aromatic polyamide Polymers 0.000 claims description 4
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 claims description 3
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- 238000001723 curing Methods 0.000 description 28
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 20
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 20
- 238000003860 storage Methods 0.000 description 18
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
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- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
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- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- XOSCKTQMAZSFBZ-UHFFFAOYSA-N 2-[[1-[[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]methyl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2CC=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 XOSCKTQMAZSFBZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910016847 F2-WS Inorganic materials 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 125000005577 anthracene group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
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- 238000001029 thermal curing Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 210000000689 upper leg Anatomy 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
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- 238000005253 cladding Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
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- 238000009833 condensation Methods 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
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- 238000005728 strengthening Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006125603 | 2006-04-28 | ||
| JP2006-125603 | 2006-04-28 | ||
| CN2007800151940A CN101432330B (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800151940A Division CN101432330B (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103342877A CN103342877A (zh) | 2013-10-09 |
| CN103342877B true CN103342877B (zh) | 2016-05-04 |
Family
ID=38655504
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310204066.8A Expired - Fee Related CN103333459B (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
| CN2013102039196A Pending CN103342876A (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
| CN201310204048.XA Expired - Fee Related CN103342877B (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
| CN2007800151940A Expired - Fee Related CN101432330B (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
| CN2010106221014A Pending CN102134303A (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
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| CN201310204066.8A Expired - Fee Related CN103333459B (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
| CN2013102039196A Pending CN103342876A (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
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| CN2007800151940A Expired - Fee Related CN101432330B (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
| CN2010106221014A Pending CN102134303A (zh) | 2006-04-28 | 2007-04-26 | 树脂组合物、预渍体、层叠板及布线板 |
Country Status (10)
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| JP (6) | JP5338187B2 (OSRAM) |
| KR (1) | KR101398342B1 (OSRAM) |
| CN (5) | CN103333459B (OSRAM) |
| CA (1) | CA2649841C (OSRAM) |
| DE (1) | DE112007001047B4 (OSRAM) |
| MY (2) | MY169438A (OSRAM) |
| SG (1) | SG173402A1 (OSRAM) |
| TW (1) | TWI417337B (OSRAM) |
| WO (1) | WO2007125979A1 (OSRAM) |
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| JP5712488B2 (ja) * | 2009-02-27 | 2015-05-07 | 日立化成株式会社 | 絶縁性樹脂フィルム及びそれを用いた積層板、配線板 |
| JP2010222391A (ja) * | 2009-03-19 | 2010-10-07 | Sekisui Chem Co Ltd | エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板 |
| JP5588646B2 (ja) * | 2009-09-15 | 2014-09-10 | 太陽ホールディングス株式会社 | 熱硬化性樹脂組成物及びドライフィルム |
| TWI506082B (zh) * | 2009-11-26 | 2015-11-01 | Ajinomoto Kk | Epoxy resin composition |
| SG183365A1 (en) * | 2010-02-24 | 2012-09-27 | Hitachi Chemical Co Ltd | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board |
| JP5558885B2 (ja) * | 2010-03-30 | 2014-07-23 | 電気化学工業株式会社 | 樹脂複合組成物及びその用途 |
| KR101473556B1 (ko) * | 2012-03-27 | 2014-12-16 | 다이요 잉키 세이조 가부시키가이샤 | 난연성 경화성 수지 조성물, 드라이 필름, 난연성 피막 및 인쇄 배선판 |
| KR101388750B1 (ko) * | 2012-07-31 | 2014-04-25 | 삼성전기주식회사 | 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판 |
| KR20160029900A (ko) * | 2014-09-05 | 2016-03-16 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
| TWI694110B (zh) * | 2014-12-16 | 2020-05-21 | 美商塞特工業公司 | 用於複合材料之環氧基樹脂組合物及其應用 |
| JPWO2016143524A1 (ja) * | 2015-03-09 | 2017-12-28 | 小松精練株式会社 | 繊維強化樹脂材料、繊維強化樹脂成形体および繊維強化樹脂成形体の製造方法 |
| JP6735505B2 (ja) * | 2016-09-06 | 2020-08-05 | パナソニックＩｐマネジメント株式会社 | プリント配線板、プリント回路板、プリプレグ |
| US10543164B2 (en) | 2017-06-30 | 2020-01-28 | The Procter & Gamble Company | Deodorant compositions |
| MX2019015684A (es) | 2017-06-30 | 2020-02-26 | Procter & Gamble | Composiciones para el cuidado del cabello que comprenden un material de 2-piridinol-n-oxido y un quelante de hierro. |
| US10555884B2 (en) | 2017-06-30 | 2020-02-11 | The Procter & Gamble Company | 2-pyridinol-N-oxide deodorant and antiperspirant compositions |
| CN110753617A (zh) * | 2017-07-10 | 2020-02-04 | Dic株式会社 | 层叠体、使用其的印刷布线板、挠性印刷布线板及成形品 |
| JP7163605B2 (ja) * | 2018-03-26 | 2022-11-01 | 味の素株式会社 | 樹脂組成物 |
| KR20210042259A (ko) * | 2018-08-09 | 2021-04-19 | 미츠비시 가스 가가쿠 가부시키가이샤 | 프린트 배선판용 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판 및 다층 프린트 배선판 |
| CN116635456A (zh) * | 2020-12-21 | 2023-08-22 | 富士胶片株式会社 | 层叠体及聚合物膜 |
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2007
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- 2007-04-26 MY MYPI2012004864A patent/MY169438A/en unknown
- 2007-04-26 CN CN2013102039196A patent/CN103342876A/zh active Pending
- 2007-04-26 DE DE112007001047.9T patent/DE112007001047B4/de not_active Expired - Fee Related
- 2007-04-26 US US12/298,168 patent/US9078365B2/en not_active Expired - Fee Related
- 2007-04-26 CN CN201310204048.XA patent/CN103342877B/zh not_active Expired - Fee Related
- 2007-04-26 CN CN2007800151940A patent/CN101432330B/zh not_active Expired - Fee Related
- 2007-04-26 SG SG2011052628A patent/SG173402A1/en unknown
- 2007-04-26 CA CA 2649841 patent/CA2649841C/en not_active Expired - Fee Related
- 2007-04-26 WO PCT/JP2007/059022 patent/WO2007125979A1/ja not_active Ceased
- 2007-04-26 KR KR1020087028671A patent/KR101398342B1/ko not_active Expired - Fee Related
- 2007-04-26 CN CN2010106221014A patent/CN102134303A/zh active Pending
- 2007-04-27 TW TW96115132A patent/TWI417337B/zh not_active IP Right Cessation
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2008
- 2008-08-07 JP JP2008204304A patent/JP5338187B2/ja active Active
- 2008-08-07 JP JP2008204303A patent/JP4950141B2/ja not_active Expired - Fee Related
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- 2008-10-22 MY MYPI20084221A patent/MY154552A/en unknown
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| US5519177A (en) * | 1993-05-19 | 1996-05-21 | Ibiden Co., Ltd. | Adhesives, adhesive layers for electroless plating and printed circuit boards |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5338187B2 (ja) | 2013-11-13 |
| JP2013080930A (ja) | 2013-05-02 |
| US20090200071A1 (en) | 2009-08-13 |
| CN103342876A (zh) | 2013-10-09 |
| JP5505486B2 (ja) | 2014-05-28 |
| CN103342877A (zh) | 2013-10-09 |
| JP2009024177A (ja) | 2009-02-05 |
| MY154552A (en) | 2015-06-30 |
| CA2649841C (en) | 2013-11-26 |
| TWI417337B (zh) | 2013-12-01 |
| CN103333459B (zh) | 2016-06-01 |
| CN101432330A (zh) | 2009-05-13 |
| DE112007001047B4 (de) | 2020-06-04 |
| DE112007001047T5 (de) | 2009-04-16 |
| JP2013080931A (ja) | 2013-05-02 |
| MY169438A (en) | 2019-04-10 |
| JP2008303397A (ja) | 2008-12-18 |
| US9078365B2 (en) | 2015-07-07 |
| JP4950142B2 (ja) | 2012-06-13 |
| CN101432330B (zh) | 2011-08-03 |
| JP5505485B2 (ja) | 2014-05-28 |
| CN102134303A (zh) | 2011-07-27 |
| SG173402A1 (en) | 2011-08-29 |
| JP2009007576A (ja) | 2009-01-15 |
| CN103333459A (zh) | 2013-10-02 |
| WO2007125979A1 (ja) | 2007-11-08 |
| JP4950141B2 (ja) | 2012-06-13 |
| CA2649841A1 (en) | 2007-11-08 |
| KR101398342B1 (ko) | 2014-05-22 |
| JP5316267B2 (ja) | 2013-10-16 |
| JP2009280823A (ja) | 2009-12-03 |
| KR20090014173A (ko) | 2009-02-06 |
| TW200801111A (en) | 2008-01-01 |
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