MY169438A - Resin composition, prepreg, laminate, and wiring board - Google Patents

Resin composition, prepreg, laminate, and wiring board

Info

Publication number
MY169438A
MY169438A MYPI2012004864A MYPI2012004864A MY169438A MY 169438 A MY169438 A MY 169438A MY PI2012004864 A MYPI2012004864 A MY PI2012004864A MY PI2012004864 A MYPI2012004864 A MY PI2012004864A MY 169438 A MY169438 A MY 169438A
Authority
MY
Malaysia
Prior art keywords
resin composition
laminate
prepreg
wiring board
insulating resin
Prior art date
Application number
MYPI2012004864A
Other languages
English (en)
Inventor
Morita Koji
Takanezawa Shin
Sakai Kazunaga
Kondou Yuusuke
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY169438A publication Critical patent/MY169438A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
MYPI2012004864A 2006-04-28 2007-04-26 Resin composition, prepreg, laminate, and wiring board MY169438A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006125603 2006-04-28

Publications (1)

Publication Number Publication Date
MY169438A true MY169438A (en) 2019-04-10

Family

ID=38655504

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2012004864A MY169438A (en) 2006-04-28 2007-04-26 Resin composition, prepreg, laminate, and wiring board
MYPI20084221A MY154552A (en) 2006-04-28 2008-10-22 Resin composition, prepreg, laminate, and wiring board

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI20084221A MY154552A (en) 2006-04-28 2008-10-22 Resin composition, prepreg, laminate, and wiring board

Country Status (10)

Country Link
US (1) US9078365B2 (OSRAM)
JP (6) JP5338187B2 (OSRAM)
KR (1) KR101398342B1 (OSRAM)
CN (5) CN103333459B (OSRAM)
CA (1) CA2649841C (OSRAM)
DE (1) DE112007001047B4 (OSRAM)
MY (2) MY169438A (OSRAM)
SG (1) SG173402A1 (OSRAM)
TW (1) TWI417337B (OSRAM)
WO (1) WO2007125979A1 (OSRAM)

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JP5588646B2 (ja) * 2009-09-15 2014-09-10 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びドライフィルム
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JP5558885B2 (ja) * 2010-03-30 2014-07-23 電気化学工業株式会社 樹脂複合組成物及びその用途
KR101473556B1 (ko) * 2012-03-27 2014-12-16 다이요 잉키 세이조 가부시키가이샤 난연성 경화성 수지 조성물, 드라이 필름, 난연성 피막 및 인쇄 배선판
KR101388750B1 (ko) * 2012-07-31 2014-04-25 삼성전기주식회사 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판
KR20160029900A (ko) * 2014-09-05 2016-03-16 삼성전자주식회사 반도체 소자의 제조 방법
TWI694110B (zh) * 2014-12-16 2020-05-21 美商塞特工業公司 用於複合材料之環氧基樹脂組合物及其應用
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JP6735505B2 (ja) * 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
US10543164B2 (en) 2017-06-30 2020-01-28 The Procter & Gamble Company Deodorant compositions
MX2019015684A (es) 2017-06-30 2020-02-26 Procter & Gamble Composiciones para el cuidado del cabello que comprenden un material de 2-piridinol-n-oxido y un quelante de hierro.
US10555884B2 (en) 2017-06-30 2020-02-11 The Procter & Gamble Company 2-pyridinol-N-oxide deodorant and antiperspirant compositions
CN110753617A (zh) * 2017-07-10 2020-02-04 Dic株式会社 层叠体、使用其的印刷布线板、挠性印刷布线板及成形品
JP7163605B2 (ja) * 2018-03-26 2022-11-01 味の素株式会社 樹脂組成物
KR20210042259A (ko) * 2018-08-09 2021-04-19 미츠비시 가스 가가쿠 가부시키가이샤 프린트 배선판용 수지 조성물, 프리프레그, 적층판, 금속박 피복 적층판, 프린트 배선판 및 다층 프린트 배선판
CN116635456A (zh) * 2020-12-21 2023-08-22 富士胶片株式会社 层叠体及聚合物膜

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Also Published As

Publication number Publication date
JP5338187B2 (ja) 2013-11-13
JP2013080930A (ja) 2013-05-02
US20090200071A1 (en) 2009-08-13
CN103342876A (zh) 2013-10-09
JP5505486B2 (ja) 2014-05-28
CN103342877A (zh) 2013-10-09
JP2009024177A (ja) 2009-02-05
MY154552A (en) 2015-06-30
CA2649841C (en) 2013-11-26
TWI417337B (zh) 2013-12-01
CN103333459B (zh) 2016-06-01
CN101432330A (zh) 2009-05-13
DE112007001047B4 (de) 2020-06-04
DE112007001047T5 (de) 2009-04-16
JP2013080931A (ja) 2013-05-02
JP2008303397A (ja) 2008-12-18
US9078365B2 (en) 2015-07-07
JP4950142B2 (ja) 2012-06-13
CN101432330B (zh) 2011-08-03
JP5505485B2 (ja) 2014-05-28
CN102134303A (zh) 2011-07-27
SG173402A1 (en) 2011-08-29
JP2009007576A (ja) 2009-01-15
CN103333459A (zh) 2013-10-02
WO2007125979A1 (ja) 2007-11-08
JP4950141B2 (ja) 2012-06-13
CA2649841A1 (en) 2007-11-08
KR101398342B1 (ko) 2014-05-22
JP5316267B2 (ja) 2013-10-16
CN103342877B (zh) 2016-05-04
JP2009280823A (ja) 2009-12-03
KR20090014173A (ko) 2009-02-06
TW200801111A (en) 2008-01-01

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