TW200706364A - Laminate containing 4-methyl-1-pentene based polymer and release film comprising the same - Google Patents

Laminate containing 4-methyl-1-pentene based polymer and release film comprising the same

Info

Publication number
TW200706364A
TW200706364A TW095116834A TW95116834A TW200706364A TW 200706364 A TW200706364 A TW 200706364A TW 095116834 A TW095116834 A TW 095116834A TW 95116834 A TW95116834 A TW 95116834A TW 200706364 A TW200706364 A TW 200706364A
Authority
TW
Taiwan
Prior art keywords
release film
layer
laminate
methyl
cushioning
Prior art date
Application number
TW095116834A
Other languages
Chinese (zh)
Other versions
TWI294351B (en
Inventor
Yusuke Mishiro
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of TW200706364A publication Critical patent/TW200706364A/en
Application granted granted Critical
Publication of TWI294351B publication Critical patent/TWI294351B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4023—Coloured on the layer surface, e.g. ink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56—Damping, energy absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2451/00—Decorative or ornamental articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

This invention provides a laminate, which, when used for the production of a flexible printed board, has good releasability, causes no significant forcing-out of a cushioning layer in a release film, and is deformed so as to conform to the surface shape of a board with an electric circuit provided thereon and thus to prevent an adhesive between the board and a coverlay film from being forced out, that is, has excellent cushioning properties, and a release film comprising the laminate. The laminate comprises at least a surface layer (A), an adhesive layer (B), and a cushioning layer (C). The adhesive layer (B) is provided between the surface layer (A) and the cushioning layer (C). The surface layer (A) contains 80 to 100% by mass of a 4-methyl-1-pentene polymer. The cushioning layer (C) contains a heat resistant resin (c1) having a melting point of 190 C or above and a flexible resin (c2) having a melting point of 170 C or below. The release film and the release film for flexible printed board production comprise the laminate.
TW095116834A 2005-05-13 2006-05-12 Laminate containing 4-methyl-1-pentene based polymer and release film comprising the same TWI294351B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005141912 2005-05-13

Publications (2)

Publication Number Publication Date
TW200706364A true TW200706364A (en) 2007-02-16
TWI294351B TWI294351B (en) 2008-03-11

Family

ID=37396493

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116834A TWI294351B (en) 2005-05-13 2006-05-12 Laminate containing 4-methyl-1-pentene based polymer and release film comprising the same

Country Status (5)

Country Link
JP (1) JP4786657B2 (en)
KR (1) KR100927514B1 (en)
CN (1) CN101175637B (en)
TW (1) TWI294351B (en)
WO (1) WO2006120983A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008001682A1 (en) * 2006-06-27 2008-01-03 Mitsui Chemicals, Inc. Film and mold release film
JP4332204B2 (en) * 2007-09-21 2009-09-16 積水化学工業株式会社 Release film
JP5270989B2 (en) * 2008-07-16 2013-08-21 三井化学株式会社 Method for manufacturing printed wiring board
JP5563981B2 (en) * 2008-08-28 2014-07-30 三井化学東セロ株式会社 Mold release film for manufacturing semiconductor resin package, and method for manufacturing semiconductor resin package using the same
CN102202885B (en) * 2008-11-06 2013-11-13 陶氏环球技术有限责任公司 Co-extruded, multilayered polyolefin-based backsheet for electronic device modules
JP5297233B2 (en) * 2009-03-09 2013-09-25 三井化学株式会社 Release film for semiconductor encapsulation process and method for producing resin-encapsulated semiconductor using the same
CN103588917B (en) * 2009-11-06 2015-10-14 三井化学株式会社 4-methyl-1-pentene alpha-olefin copolymer and the composition containing this multipolymer
WO2014045888A1 (en) * 2012-09-18 2014-03-27 住友ベークライト株式会社 Release film
JPWO2014097964A1 (en) * 2012-12-18 2017-01-12 株式会社カネカ Resin composition for hot melt adhesive and hot melt adhesive film using the same
US9161452B2 (en) * 2013-06-17 2015-10-13 Microcosm Technology Co., Ltd. Component-embedded printed circuit board and method of forming the same
JP6223913B2 (en) 2013-08-05 2017-11-01 積水化学工業株式会社 Release film
JP6271320B2 (en) * 2014-03-28 2018-01-31 アキレス株式会社 Release film
JP6503633B2 (en) * 2014-04-24 2019-04-24 味の素株式会社 Method of manufacturing circuit board
KR102056500B1 (en) * 2014-10-24 2019-12-16 주식회사 두산 Metal clad laminates for coverlay and coverlay free multilayered flexible printed circuit board
JP6350303B2 (en) * 2015-01-23 2018-07-04 王子ホールディングス株式会社 Release film
CN109466138B (en) * 2017-12-27 2020-11-06 宁波长阳科技股份有限公司 Release film and preparation method thereof
JP7283639B2 (en) * 2020-08-12 2023-05-30 住友ベークライト株式会社 Method for manufacturing release film and molded product
JP6870775B1 (en) * 2020-10-21 2021-05-12 住友ベークライト株式会社 Manufacturing method of release film and molded product
CN114507486B (en) * 2020-11-16 2024-02-20 象山激智新材料有限公司 High-temperature-resistant protective film and preparation method thereof
CN112622312A (en) * 2020-12-29 2021-04-09 宁波长阳科技股份有限公司 Release film and preparation method and application thereof
CN112793271B (en) * 2020-12-31 2023-02-24 苏州市新广益电子股份有限公司 Composite film containing 4-methyl-1-pentene polymer and release film comprising same
JP2023011253A (en) * 2021-07-12 2023-01-24 東洋紡株式会社 Heat-fusible laminated film

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062369B2 (en) * 1985-08-02 1994-01-12 三井石油化学工業株式会社 Surface roughening film and sheet made of poly-4-methyl-1-pentene for manufacturing multilayer printed wiring board
JP2619034B2 (en) * 1988-12-28 1997-06-11 三井石油化学工業株式会社 Release film composed of laminate
JP3710316B2 (en) * 1999-03-19 2005-10-26 三井化学株式会社 Release film for producing printed circuit board and method for producing the same
EP1264685A4 (en) * 2000-09-20 2003-05-21 Mitsui Chemicals Inc Multilayered 4-methyl-1-pentene copolymer film and process for producing the same
JP2002225207A (en) * 2000-09-20 2002-08-14 Mitsui Chemicals Inc 4-methyl-1-pentene copolymer multilayer film and method of producing the same
JP2002179863A (en) * 2000-12-12 2002-06-26 Mitsui Chemicals Inc 4-methyl-1-pentene-based polymer composition and its use
JP2003211602A (en) * 2002-01-24 2003-07-29 Sumitomo Bakelite Co Ltd Release multilayered film and cover-lay molding method
JP2003276140A (en) * 2002-03-25 2003-09-30 Sumitomo Bakelite Co Ltd Method for molding release multilayered film and cover lay
JP2004082717A (en) * 2002-06-28 2004-03-18 Mitsui Chemicals Inc Multi-layer film of 4-methyl-1-pentene type polymer

Also Published As

Publication number Publication date
CN101175637B (en) 2012-07-25
KR20080012356A (en) 2008-02-11
JPWO2006120983A1 (en) 2008-12-18
KR100927514B1 (en) 2009-11-17
JP4786657B2 (en) 2011-10-05
WO2006120983A1 (en) 2006-11-16
TWI294351B (en) 2008-03-11
CN101175637A (en) 2008-05-07

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