CN102470660B - 制造围阻层的方法和材料以及由其制成的器件 - Google Patents

制造围阻层的方法和材料以及由其制成的器件 Download PDF

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Publication number
CN102470660B
CN102470660B CN200980160534.8A CN200980160534A CN102470660B CN 102470660 B CN102470660 B CN 102470660B CN 200980160534 A CN200980160534 A CN 200980160534A CN 102470660 B CN102470660 B CN 102470660B
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China
Prior art keywords
layer
priming coat
exposed region
organic active
pattern
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CN200980160534.8A
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Chinese (zh)
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CN102470660A (zh
Inventor
A·费尼莫尔
J·M·兹芭斯
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LG Chem Ltd
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EI Du Pont de Nemours and Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
    • B32B37/0084—Point bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN200980160534.8A 2009-07-27 2009-12-21 制造围阻层的方法和材料以及由其制成的器件 Active CN102470660B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22868909P 2009-07-27 2009-07-27
US61/228,689 2009-07-27
PCT/US2009/068918 WO2011014216A1 (en) 2009-07-27 2009-12-21 Process and materials for making contained layers and devices made with same

Publications (2)

Publication Number Publication Date
CN102470660A CN102470660A (zh) 2012-05-23
CN102470660B true CN102470660B (zh) 2014-11-19

Family

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CN200980160534.8A Active CN102470660B (zh) 2009-07-27 2009-12-21 制造围阻层的方法和材料以及由其制成的器件

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Country Link
US (2) US8592239B2 (cg-RX-API-DMAC7.html)
EP (1) EP2459379A4 (cg-RX-API-DMAC7.html)
JP (1) JP5727478B2 (cg-RX-API-DMAC7.html)
KR (1) KR101675176B1 (cg-RX-API-DMAC7.html)
CN (1) CN102470660B (cg-RX-API-DMAC7.html)
TW (1) TW201104357A (cg-RX-API-DMAC7.html)
WO (1) WO2011014216A1 (cg-RX-API-DMAC7.html)

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TW201238113A (en) * 2011-02-10 2012-09-16 Du Pont Process and materials for making contained layers and devices made with same
KR101621636B1 (ko) * 2011-12-20 2016-05-16 이 아이 듀폰 디 네모아 앤드 캄파니 격납된 층을 제조하기 위한 방법 및 물질, 및 이를 사용하여 제조된 소자
KR101927848B1 (ko) * 2012-09-17 2018-12-12 삼성디스플레이 주식회사 유기전계발광 표시장치 및 이의 제조 방법
US20140131684A1 (en) * 2012-11-14 2014-05-15 E I Du Pont De Nemours And Company Electronic device having radiation-produced containment regions and processes for making same
JP6371304B2 (ja) * 2012-12-13 2018-08-08 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 閉じ込め層およびそれを使って製造されるデバイスを製造するための方法および材料
DE102014103751A1 (de) * 2014-03-19 2015-09-24 Osram Opto Semiconductors Gmbh Organisches strahlungsemittierendes Bauelement
KR102387145B1 (ko) * 2015-05-22 2022-04-15 삼성디스플레이 주식회사 발광 표시 장치의 제조 방법 및 이를 이용한 발광 표시 장치
KR20240113977A (ko) * 2017-05-17 2024-07-23 오티아이 루미오닉스 인크. 패턴화 코팅 위에 전도성 코팅을 선택적으로 증착시키는 방법 및 전도성 코팅을 포함하는 디바이스
KR102525822B1 (ko) 2017-07-06 2023-04-26 삼성디스플레이 주식회사 표시 소자 및 그 제조 방법
KR102486552B1 (ko) 2018-01-15 2023-01-10 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN110229312B (zh) * 2018-03-05 2022-03-25 北京大学深圳研究生院 一种黑色聚合物材料及其制备方法与应用
US11264437B2 (en) 2018-05-14 2022-03-01 Samsung Display Co., Ltd. Display devices

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