JP4560394B2 - 薄膜形成用分子供給装置 - Google Patents
薄膜形成用分子供給装置 Download PDFInfo
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- JP4560394B2 JP4560394B2 JP2004359650A JP2004359650A JP4560394B2 JP 4560394 B2 JP4560394 B2 JP 4560394B2 JP 2004359650 A JP2004359650 A JP 2004359650A JP 2004359650 A JP2004359650 A JP 2004359650A JP 4560394 B2 JP4560394 B2 JP 4560394B2
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- film formation
- guide paths
- formation surface
- film
- thin film
- Prior art date
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- 230000015572 biosynthetic process Effects 0.000 title claims description 80
- 239000010409 thin film Substances 0.000 title claims description 36
- 239000010408 film Substances 0.000 claims description 119
- 239000000463 material Substances 0.000 claims description 18
- 238000001704 evaporation Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 38
- 238000009826 distribution Methods 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
一般に分子線源の分子放出口が単一の場合、成膜面に形成される薄膜の膜厚分布は、蒸着源出口からの角度をαとするとcos3αに比例する。これを補正するために様々な手法が用いられてきた。例えば特開2004−176111号公報に記載されたように、成膜中に成膜面を有する基板を回転したり、移動することで膜厚の平準化を図る試み等である。
しかしこの手段でも、基本的には成膜面の子放出箇所に対向した部分の膜厚が局所的に大きくなり、膜厚の均一化に限界がある。
このような本発明による薄膜形成用分子供給装置では、筒状通路を有する複数の案内路4a、4b、4cのうち一部の案内路4aを成膜面9の中心部に向けて配置し、他の案内路4b、4cを成膜面9の周辺部に向けて配置しているので、案内路4a、4b、4cから放出される分子は、方向性を有しており、成膜面9の目的の位置に分子を供給することが出来る。そして、そ成膜面9の中心部に向けて導くべき分子量と成膜面9の周辺部に向けて導くべき分子量との比に応じて、前記一部の案内路4aと他の案内路4b、4cの分子通路の総面積の比を設定している。これにより、成膜面9の任意の位置にそれぞれ適当な量の分子を供給することが出来る。従って、基板8の成膜面9の中心部より膜厚が薄くなりやすい基板8の成膜面9の周辺部等により多くの分子を供給することにより、成膜する薄膜の膜厚の平準化を図ることが出来る。これにより、膜厚分布がより均一な薄膜の形成が可能となる。なお、外側に向いた案内路4b、4cの中心線の延長線の成膜面9に達する位置が成膜面9の最外部かまたはそれよりも外側にあるようにするとよい。
以下、本発明を実施するための最良の形態について、実施例をあげて詳細に説明する。
図1に示すように、分子線源1から共有される分子mは、ダクト2を通して分配室3に導かれる。ダクト2の途中には、分子の供給路を開閉し、調整するバルブ10が設けられている。
なお、外側に向いた案内路4b、4cの中心線の延長線の成膜面9に達する位置が成膜面9の最外部かまたはそれよりも外側にあるようにするとよい。
案内路4a、4b、4cから放出される分子の放出方向は、導入路の径と長さの比で決まるが、制限板5を設けた場合は制限板5の分子通過口6で分子蒸気が拡散するので、制限板5の分子通過口6から案内路4bの出口7bまでの長Lrさの比で分子放出の方向性が依存する。本発明者の検討によれば、効果的に蒸気の広がり方を規制する為には、Lr≧2Dnとするのがよく、Lrがこれ以下では効果が得られなかった。
4a 案内路
4b 案内路
4c 案内路
6 分子通過口
9 成膜面
Claims (5)
- 蒸発源(1)から発生する成膜材料の分子を成膜面(9)に向けて案内し、この成膜面(9)に成膜材料を被着させて成膜する薄膜形成用分子供給装置において、蒸発源(1)から成膜面(9)に向けて分子を放出する筒状通路を有する複数の案内路(4a)、(4b)、(4c)を設け、そのうち一部の案内路(4a)を成膜面(9)の中心部に向けて配置し、他の案内路(4b)、(4c)を成膜面(9)の周辺部に向けて配置し、成膜面(9)の中心部に向けて導くべき分子量と成膜面(9)の周辺部に向けて導くべき分子量との比に応じて、前記一部の案内路(4a)と他の案内路(4b)、(4c)の分子通路の総面積の比を設定し、さらに前記複数の案内路(4a)、(4b)、(4c)の蒸気入り口側内径をDiとし、その出口側内径をDoとした時、Do≧Diとしたことを特徴とする薄膜形成用分子供給装置。
- 複数の案内路(4b)の通路面積を規制する規制手段を有し、この規制手段が各案内路(4b)の入り口面積の規制によりなされることを特徴とする請求項1に記載の薄膜形成用分子供給装置。
- 複数の案内路(4b)の通路面積を規制する規制手段がそれぞれ分子通過口(6)を有し、各案内路(4b)に設けられたオリフィス状の制限板(5)によりなされることを特徴とする請求項2に記載の薄膜形成用分子供給装置。
- 制限板(5)が置かれる位置が、案内路(4b)の出口から制限板(5)までの距離をLr、制限板(5)の分子通過口(6)の径をDnとした時にLr≧2×Dnであることを特徴とする請求項3に記載の薄膜形成用分子供給装置。
- 外側に向いた案内路(4b)、(4c)の中心線の延長線の成膜面(9)に達する位置が成膜面(9)の最外部かまたはそれよりも外側にあることを特徴とする請求項1〜4の何れかに記載の薄膜形成用分子供給装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004359650A JP4560394B2 (ja) | 2004-12-13 | 2004-12-13 | 薄膜形成用分子供給装置 |
TW094127369A TWI395828B (zh) | 2004-12-13 | 2005-08-11 | 薄膜成形用分子供給裝置 |
US11/205,734 US20060124061A1 (en) | 2004-12-13 | 2005-08-17 | Molecule supply source for use in thin-film forming |
CN2005101076348A CN1789479B (zh) | 2004-12-13 | 2005-09-29 | 用于薄膜形成的分子供应源 |
KR1020050093875A KR101204527B1 (ko) | 2004-12-13 | 2005-10-06 | 박막형성용 분자공급장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004359650A JP4560394B2 (ja) | 2004-12-13 | 2004-12-13 | 薄膜形成用分子供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006169551A JP2006169551A (ja) | 2006-06-29 |
JP4560394B2 true JP4560394B2 (ja) | 2010-10-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004359650A Active JP4560394B2 (ja) | 2004-12-13 | 2004-12-13 | 薄膜形成用分子供給装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060124061A1 (ja) |
JP (1) | JP4560394B2 (ja) |
KR (1) | KR101204527B1 (ja) |
CN (1) | CN1789479B (ja) |
TW (1) | TWI395828B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100980729B1 (ko) * | 2006-07-03 | 2010-09-07 | 주식회사 야스 | 증착 공정용 다중 노즐 증발원 |
JP2008019477A (ja) * | 2006-07-13 | 2008-01-31 | Canon Inc | 真空蒸着装置 |
KR20080045974A (ko) * | 2006-11-21 | 2008-05-26 | 삼성전자주식회사 | 박막 증착장치 및 박막 증착방법 |
JP5127372B2 (ja) * | 2007-09-03 | 2013-01-23 | キヤノン株式会社 | 蒸着装置 |
WO2009055628A1 (en) * | 2007-10-26 | 2009-04-30 | E. I. Du Pont De Nemours And Company | Process and materials for making contained layers and devices made with same |
JP5727368B2 (ja) * | 2008-05-19 | 2015-06-03 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 電子デバイスにおける気相コーティングの装置および方法 |
CN102470660B (zh) * | 2009-07-27 | 2014-11-19 | E.I.内穆尔杜邦公司 | 制造围阻层的方法和材料以及由其制成的器件 |
EP2592172B1 (en) * | 2011-11-09 | 2017-03-15 | Essilor International (Compagnie Générale D'Optique) | Support for a liquid composition |
KR102046440B1 (ko) | 2012-10-09 | 2019-11-20 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법 |
JP6105115B1 (ja) * | 2016-03-14 | 2017-03-29 | 株式会社東芝 | 処理装置及びコリメータ |
WO2019233601A1 (en) * | 2018-06-08 | 2019-12-12 | Applied Materials, Inc. | Static evaporation source, vacuum processing chamber, and method of depositing material on a substrate |
CN118374771B (zh) * | 2024-04-30 | 2024-09-24 | 江苏微迈思半导体科技有限公司 | 一种真空蒸镀用一体式蒸发源 |
Citations (4)
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JP2000017425A (ja) * | 1998-07-07 | 2000-01-18 | Ulvac Corp | 有機化合物用の容器、及び有機薄膜製造方法 |
JP2001162108A (ja) * | 1999-12-09 | 2001-06-19 | Asada Kagaku Kogyo Kk | 鉄・アルミニウム複合凝集剤の製造方法 |
US6565661B1 (en) * | 1999-06-04 | 2003-05-20 | Simplus Systems Corporation | High flow conductance and high thermal conductance showerhead system and method |
JP2004162108A (ja) * | 2002-11-12 | 2004-06-10 | Eiko Engineering Co Ltd | 薄膜堆積用分子線源セル |
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2004
- 2004-12-13 JP JP2004359650A patent/JP4560394B2/ja active Active
-
2005
- 2005-08-11 TW TW094127369A patent/TWI395828B/zh not_active IP Right Cessation
- 2005-08-17 US US11/205,734 patent/US20060124061A1/en not_active Abandoned
- 2005-09-29 CN CN2005101076348A patent/CN1789479B/zh not_active Expired - Fee Related
- 2005-10-06 KR KR1020050093875A patent/KR101204527B1/ko active IP Right Grant
Patent Citations (4)
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JP2000017425A (ja) * | 1998-07-07 | 2000-01-18 | Ulvac Corp | 有機化合物用の容器、及び有機薄膜製造方法 |
US6565661B1 (en) * | 1999-06-04 | 2003-05-20 | Simplus Systems Corporation | High flow conductance and high thermal conductance showerhead system and method |
JP2001162108A (ja) * | 1999-12-09 | 2001-06-19 | Asada Kagaku Kogyo Kk | 鉄・アルミニウム複合凝集剤の製造方法 |
JP2004162108A (ja) * | 2002-11-12 | 2004-06-10 | Eiko Engineering Co Ltd | 薄膜堆積用分子線源セル |
Also Published As
Publication number | Publication date |
---|---|
KR101204527B1 (ko) | 2012-11-23 |
KR20060066622A (ko) | 2006-06-16 |
JP2006169551A (ja) | 2006-06-29 |
US20060124061A1 (en) | 2006-06-15 |
TWI395828B (zh) | 2013-05-11 |
CN1789479B (zh) | 2010-12-08 |
CN1789479A (zh) | 2006-06-21 |
TW200619407A (en) | 2006-06-16 |
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