CN100437995C - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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Publication number
CN100437995C
CN100437995C CNB2005100978335A CN200510097833A CN100437995C CN 100437995 C CN100437995 C CN 100437995C CN B2005100978335 A CNB2005100978335 A CN B2005100978335A CN 200510097833 A CN200510097833 A CN 200510097833A CN 100437995 C CN100437995 C CN 100437995C
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China
Prior art keywords
substrate
electrodes
electrode
bonding
protruding
Prior art date
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Expired - Fee Related
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CNB2005100978335A
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English (en)
Chinese (zh)
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CN1744306A (zh
Inventor
须贺唯知
伊藤寿浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yorozu Yuchi
Toshiba Corp
Rohm Co Ltd
NEC Corp
Sharp Corp
Sanyo Electric Co Ltd
Sony Corp
Renesas Electronics Corp
Lapis Semiconductor Co Ltd
Panasonic Holdings Corp
Original Assignee
Renesas Technology Corp
Toshiba Corp
Rohm Co Ltd
NEC Corp
Oki Electric Industry Co Ltd
Sharp Corp
Sanyo Electric Co Ltd
Sony Corp
Matsushita Electric Industrial Co Ltd
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Application filed by Renesas Technology Corp, Toshiba Corp, Rohm Co Ltd, NEC Corp, Oki Electric Industry Co Ltd, Sharp Corp, Sanyo Electric Co Ltd, Sony Corp, Matsushita Electric Industrial Co Ltd filed Critical Renesas Technology Corp
Publication of CN1744306A publication Critical patent/CN1744306A/zh
Application granted granted Critical
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    • H10W70/05—
    • H10W70/644—
    • H10W90/701—
    • H10W72/01271—
    • H10W72/016—
    • H10W72/07118—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/241—
    • H10W72/253—
    • H10W72/923—
    • H10W72/9415—
    • H10W80/301—

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CNB2005100978335A 2004-08-30 2005-08-30 半导体装置及其制造方法 Expired - Fee Related CN100437995C (zh)

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JP2004250453A JP4050732B2 (ja) 2004-08-30 2004-08-30 半導体装置およびその製造方法
JP2004250453 2004-08-30

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CN1744306A CN1744306A (zh) 2006-03-08
CN100437995C true CN100437995C (zh) 2008-11-26

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US (2) US7268430B2 (enExample)
JP (1) JP4050732B2 (enExample)
KR (2) KR20060050794A (enExample)
CN (1) CN100437995C (enExample)
TW (1) TWI297185B (enExample)

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CN103974542A (zh) * 2013-02-06 2014-08-06 雅马哈发动机株式会社 基板固定装置、基板作业装置以及基板固定方法

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US7786588B2 (en) * 2006-01-31 2010-08-31 International Business Machines Corporation Composite interconnect structure using injection molded solder technique
KR20090057328A (ko) * 2006-09-26 2009-06-04 알프스 덴키 가부시키가이샤 탄성 접촉자 및 이것을 이용한 금속단자 간의 접합방법
JP2008124355A (ja) * 2006-11-15 2008-05-29 Epson Imaging Devices Corp 半導体装置、異方性導電材、実装構造体、電気光学装置、突起電極の製造方法、異方性導電材の製造方法、及び、電子機器
US7793819B2 (en) * 2007-03-19 2010-09-14 Infineon Technologies Ag Apparatus and method for connecting a component with a substrate
US20080315388A1 (en) * 2007-06-22 2008-12-25 Shanggar Periaman Vertical controlled side chip connection for 3d processor package
JP4992604B2 (ja) * 2007-08-15 2012-08-08 株式会社ニコン 接合装置、接合方法
JP4548459B2 (ja) * 2007-08-21 2010-09-22 セイコーエプソン株式会社 電子部品の実装構造体
US8039960B2 (en) * 2007-09-21 2011-10-18 Stats Chippac, Ltd. Solder bump with inner core pillar in semiconductor package
JP5228479B2 (ja) * 2007-12-28 2013-07-03 富士通株式会社 電子装置の製造方法
JP5493399B2 (ja) * 2009-03-12 2014-05-14 株式会社ニコン 製造装置、及び、半導体装置の製造方法
WO2010106878A1 (ja) * 2009-03-18 2010-09-23 コニカミノルタホールディングス株式会社 熱電変換素子
US8119926B2 (en) * 2009-04-01 2012-02-21 Advanced Interconnections Corp. Terminal assembly with regions of differing solderability
US8969734B2 (en) 2009-04-01 2015-03-03 Advanced Interconnections Corp. Terminal assembly with regions of differing solderability
KR101938022B1 (ko) * 2011-03-11 2019-01-11 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 신규한 에칭 조성물
JP2012243840A (ja) * 2011-05-17 2012-12-10 Renesas Electronics Corp 半導体装置およびその製造方法
TWI577834B (zh) 2011-10-21 2017-04-11 富士軟片電子材料美國股份有限公司 新穎的鈍化組成物及方法
US10784221B2 (en) * 2011-12-06 2020-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method of processing solder bump by vacuum annealing
US9512863B2 (en) * 2012-04-26 2016-12-06 California Institute Of Technology Silicon alignment pins: an easy way to realize a wafer-to-wafer alignment
JP2013251405A (ja) * 2012-05-31 2013-12-12 Tadatomo Suga 金属領域を有する基板の接合方法
JP6032667B2 (ja) * 2012-08-31 2016-11-30 国立研究開発法人産業技術総合研究所 接合方法
KR20140038735A (ko) * 2012-09-21 2014-03-31 (주)호전에이블 패키지 모듈 및 그 제조 방법
ITTO20150229A1 (it) * 2015-04-24 2016-10-24 St Microelectronics Srl Procedimento per produrre bump in componenti elettronici, componente e prodotto informatico corrispondenti
CN105472216B (zh) * 2015-12-01 2020-01-10 宁波舜宇光电信息有限公司 具有缓冲结构的电气支架及摄像模组
US10403601B2 (en) * 2016-06-17 2019-09-03 Fairchild Semiconductor Corporation Semiconductor package and related methods
US10037957B2 (en) 2016-11-14 2018-07-31 Amkor Technology, Inc. Semiconductor device and method of manufacturing thereof
JP6425317B2 (ja) * 2017-07-21 2018-11-21 須賀　唯知 金属領域を有する基板の接合方法
CN108054490B (zh) * 2017-12-08 2020-01-03 中国电子科技集团公司第五十四研究所 一种多层柔性基板局部微弹簧低应力组装结构
GB2584372B (en) * 2018-02-22 2022-04-13 Massachusetts Inst Technology Method of reducing semiconductor substrate surface unevenness
CN110557903A (zh) * 2019-09-05 2019-12-10 深圳市星河电路股份有限公司 一种pcb超高金线邦定值加工方法
JP2022079295A (ja) * 2020-11-16 2022-05-26 沖電気工業株式会社 複合集積フィルム、複合集積フィルム供給ウェハ及び半導体複合装置

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US4893172A (en) * 1987-01-19 1990-01-09 Hitachi, Ltd. Connecting structure for electronic part and method of manufacturing the same
JP2791429B2 (ja) * 1996-09-18 1998-08-27 工業技術院長 シリコンウェハーの常温接合法
JPH10303345A (ja) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd 半導体チップの基板への実装構造
JP2001053106A (ja) * 1999-08-13 2001-02-23 Nec Corp フリップチップ接続構造と電子部品の製造方法
JP2001351892A (ja) * 2000-06-08 2001-12-21 Tadatomo Suga 実装方法および装置
JP2003234370A (ja) * 2002-02-07 2003-08-22 Fujitsu Ltd 電子部品の接続方法及びそれにより得られた接続構造体

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US5897326A (en) * 1993-11-16 1999-04-27 Eldridge; Benjamin N. Method of exercising semiconductor devices
US5983493A (en) * 1993-11-16 1999-11-16 Formfactor, Inc. Method of temporarily, then permanently, connecting to a semiconductor device
JPH08139226A (ja) 1994-11-04 1996-05-31 Sony Corp 半導体回路装置及びその回路実装方法
WO1997016866A2 (en) 1995-05-26 1997-05-09 Formfactor, Inc. Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices
JPH10173006A (ja) 1996-12-09 1998-06-26 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP3080047B2 (ja) 1997-11-07 2000-08-21 日本電気株式会社 バンプ構造体及びバンプ構造体形成方法
JPH11214447A (ja) 1998-01-27 1999-08-06 Oki Electric Ind Co Ltd 半導体装置の実装構造及びその実装方法
JPH11233669A (ja) 1998-02-10 1999-08-27 Mitsui High Tec Inc 半導体装置の製造方法
JP2000174165A (ja) 1998-12-08 2000-06-23 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP3903359B2 (ja) 1999-05-10 2007-04-11 積水ハウス株式会社 パネル位置決め治具
JP2001050980A (ja) 1999-08-04 2001-02-23 Taniguchi Consulting Engineers Co Ltd Ｉｃの電極端子用コンタクトの構造および製造方法
US6242324B1 (en) * 1999-08-10 2001-06-05 The United States Of America As Represented By The Secretary Of The Navy Method for fabricating singe crystal materials over CMOS devices
JP2001196110A (ja) * 1999-11-09 2001-07-19 Fujitsu Ltd 接触力クランプばねによって支持された変形可能なコンタクトコネクタを含む電気コネクタ組立体及び電気的接続方法
JP2001156091A (ja) 1999-11-30 2001-06-08 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
US6640432B1 (en) * 2000-04-12 2003-11-04 Formfactor, Inc. Method of fabricating shaped springs
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TW547771U (en) 2002-07-23 2003-08-11 Via Tech Inc Elastic electrical contact package structure
JP4036786B2 (ja) * 2003-04-24 2008-01-23 唯知 須賀 電子部品実装方法
JP4768343B2 (ja) * 2005-07-27 2011-09-07 株式会社デンソー 半導体素子の実装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4893172A (en) * 1987-01-19 1990-01-09 Hitachi, Ltd. Connecting structure for electronic part and method of manufacturing the same
JP2791429B2 (ja) * 1996-09-18 1998-08-27 工業技術院長 シリコンウェハーの常温接合法
JPH10303345A (ja) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd 半導体チップの基板への実装構造
JP2001053106A (ja) * 1999-08-13 2001-02-23 Nec Corp フリップチップ接続構造と電子部品の製造方法
JP2001351892A (ja) * 2000-06-08 2001-12-21 Tadatomo Suga 実装方法および装置
JP2003234370A (ja) * 2002-02-07 2003-08-22 Fujitsu Ltd 電子部品の接続方法及びそれにより得られた接続構造体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103974542A (zh) * 2013-02-06 2014-08-06 雅马哈发动机株式会社 基板固定装置、基板作业装置以及基板固定方法
US9668393B2 (en) 2013-02-06 2017-05-30 Yamaha Hatsudoki Kabushiki Kaisha Substrate fixing apparatus and substrate working apparatus
CN103974542B (zh) * 2013-02-06 2017-06-20 雅马哈发动机株式会社 基板固定装置、基板作业装置以及基板固定方法

Also Published As

Publication number Publication date
KR20060050794A (ko) 2006-05-19
JP2006066809A (ja) 2006-03-09
US7776735B2 (en) 2010-08-17
US20060043552A1 (en) 2006-03-02
KR20070008473A (ko) 2007-01-17
CN1744306A (zh) 2006-03-08
TWI297185B (en) 2008-05-21
TW200616128A (en) 2006-05-16
JP4050732B2 (ja) 2008-02-20
US20080254610A1 (en) 2008-10-16
KR100821574B1 (ko) 2008-04-15
US7268430B2 (en) 2007-09-11

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Co-patentee before: Sanyo Electric Co.,Ltd.

Co-patentee before: Sharp Corp.

Co-patentee before: Sony Corp.

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Patentee after: Renesas Electronics Corp.

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Co-patentee after: Sanyo Electric Co.,Ltd.

Co-patentee after: Sharp Corp.

Co-patentee after: Sony Corp.

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Co-patentee after: Matsushita Electric Industrial Co.,Ltd.

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