CN100337306C - 灰调掩模的制造方法和灰调掩模 - Google Patents
灰调掩模的制造方法和灰调掩模 Download PDFInfo
- Publication number
- CN100337306C CN100337306C CNB2004100625413A CN200410062541A CN100337306C CN 100337306 C CN100337306 C CN 100337306C CN B2004100625413 A CNB2004100625413 A CN B2004100625413A CN 200410062541 A CN200410062541 A CN 200410062541A CN 100337306 C CN100337306 C CN 100337306C
- Authority
- CN
- China
- Prior art keywords
- pattern
- semi
- light transmitting
- light shielding
- transmitting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 claims abstract description 119
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000010408 film Substances 0.000 claims description 143
- 238000005530 etching Methods 0.000 claims description 77
- 238000002834 transmittance Methods 0.000 claims description 58
- 239000000463 material Substances 0.000 claims description 32
- 239000010409 thin film Substances 0.000 claims description 24
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 5
- 238000001312 dry etching Methods 0.000 description 13
- 238000004380 ashing Methods 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 238000013461 design Methods 0.000 description 7
- 230000007261 regionalization Effects 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 6
- 238000006731 degradation reaction Methods 0.000 description 6
- 229910016006 MoSi Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000001010 compromised effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- HSJPMRKMPBAUAU-UHFFFAOYSA-N cerium(3+);trinitrate Chemical compound [Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O HSJPMRKMPBAUAU-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001804 chlorine Chemical class 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 150000001875 compounds Chemical group 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011214 deviation management Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003187960 | 2003-06-30 | ||
JP187960/2003 | 2003-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1577085A CN1577085A (zh) | 2005-02-09 |
CN100337306C true CN100337306C (zh) | 2007-09-12 |
Family
ID=34587128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100625413A Expired - Lifetime CN100337306C (zh) | 2003-06-30 | 2004-06-30 | 灰调掩模的制造方法和灰调掩模 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP4729606B2 (ja) |
KR (3) | KR101172645B1 (ja) |
CN (1) | CN100337306C (ja) |
TW (1) | TWI286663B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105717737A (zh) * | 2016-04-26 | 2016-06-29 | 深圳市华星光电技术有限公司 | 一种掩膜版及彩色滤光片基板的制备方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4587837B2 (ja) * | 2005-02-18 | 2010-11-24 | Hoya株式会社 | グレートーンマスクの製造方法及びグレートーンマスク |
TWI395053B (zh) * | 2005-02-28 | 2013-05-01 | Hoya Corp | 灰階罩幕及灰階罩幕毛胚 |
KR100800301B1 (ko) * | 2005-07-05 | 2008-02-01 | 주식회사 에스앤에스텍 | 그레이톤 블랭크마스크 및 포토마스크 제조방법 |
KR100850511B1 (ko) * | 2005-12-22 | 2008-08-05 | 주식회사 에스앤에스텍 | 하프톤 블랭크 마스크 및 포토마스크의 제조방법 |
KR100812253B1 (ko) * | 2006-01-20 | 2008-03-10 | 주식회사 에스앤에스텍 | 그레이톤 포토마스크의 제조방법, 그레이톤 포토마스크 및그레이톤 블랭크마스크 |
CN1808267B (zh) * | 2006-02-13 | 2010-12-01 | 友达光电股份有限公司 | 掩膜及其制造方法及其应用 |
KR100822296B1 (ko) * | 2006-04-10 | 2008-04-15 | 엘지마이크론 주식회사 | 다단 구조를 가지는 하프톤 마스크 및 그 제조 방법 |
TW200913013A (en) * | 2007-07-30 | 2009-03-16 | Hoya Corp | Method of manufacturing a gray tone mask, gray tone mask, method of inspecting a gray tone mask, and method of transferring a pattern |
JP2009128558A (ja) * | 2007-11-22 | 2009-06-11 | Hoya Corp | フォトマスク及びフォトマスクの製造方法、並びにパターン転写方法 |
CN101738846B (zh) * | 2008-11-17 | 2012-02-29 | 北京京东方光电科技有限公司 | 掩模板及其制备方法 |
KR101186890B1 (ko) * | 2009-05-21 | 2012-10-02 | 엘지이노텍 주식회사 | 하프톤 마스크 및 이의 제조 방법 |
CN101943854B (zh) * | 2009-07-03 | 2012-07-04 | 深圳清溢光电股份有限公司 | 半灰阶掩模板半曝光区的设计方法及其制造方法 |
CN108267927B (zh) * | 2011-12-21 | 2021-08-24 | 大日本印刷株式会社 | 大型相移掩膜 |
JP6063650B2 (ja) * | 2012-06-18 | 2017-01-18 | Hoya株式会社 | フォトマスクの製造方法 |
JP5635577B2 (ja) * | 2012-09-26 | 2014-12-03 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク、パターン転写方法、及びフラットパネルディスプレイの製造方法 |
JP6157832B2 (ja) * | 2012-10-12 | 2017-07-05 | Hoya株式会社 | 電子デバイスの製造方法、表示装置の製造方法、フォトマスクの製造方法、及びフォトマスク |
KR102253995B1 (ko) * | 2013-03-12 | 2021-05-18 | 마이크로닉 아베 | 기계적으로 생성된 정렬 표식 방법 및 정렬 시스템 |
CN104849525B (zh) * | 2014-02-13 | 2017-12-01 | 上海和辉光电有限公司 | 使用测试组件的测试方法 |
KR102378211B1 (ko) * | 2015-06-23 | 2022-03-25 | 삼성디스플레이 주식회사 | 마스크 및 이를 이용한 표시장치의 제조방법 |
CN105529274B (zh) * | 2016-02-02 | 2018-10-26 | 京东方科技集团股份有限公司 | 薄膜晶体管的制作方法、阵列基板和显示装置 |
CN106887439A (zh) * | 2017-03-21 | 2017-06-23 | 上海中航光电子有限公司 | 阵列基板及其制作方法、显示面板 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0798493A (ja) * | 1993-09-28 | 1995-04-11 | Toppan Printing Co Ltd | 位相シフトマスク及びその製造方法 |
JPH08106151A (ja) * | 1994-10-04 | 1996-04-23 | Sony Corp | 位相シフト・マスクおよびその製造方法 |
JPH0943830A (ja) * | 1995-08-03 | 1997-02-14 | Hoya Corp | ハーフトーン型位相シフトマスク及びハーフトーン型位相シフトマスクブランク並びにそれらの製造方法 |
JPH1124231A (ja) * | 1997-07-01 | 1999-01-29 | Sony Corp | ハーフトーン位相シフトマスク、及びその製造方法 |
JPH11289010A (ja) * | 1998-04-01 | 1999-10-19 | Sony Corp | 多層配線の形成方法 |
JPH11295874A (ja) * | 1998-04-15 | 1999-10-29 | Oki Electric Ind Co Ltd | 位相シフトマスクの製造方法 |
JPH11327121A (ja) * | 1998-05-20 | 1999-11-26 | Toppan Printing Co Ltd | ハーフトーン型位相シフトマスクの製造方法およびハーフトーン型位相シフトマスクのブランク |
JP2000111958A (ja) * | 1998-10-01 | 2000-04-21 | Samsung Electronics Co Ltd | 4枚のマスクを利用した液晶表示装置用薄膜トランジスタ基板の製造方法及び液晶表示装置用薄膜トランジスタ基板 |
JP2001022048A (ja) * | 1999-07-07 | 2001-01-26 | Toppan Printing Co Ltd | 遮光領域つきハーフトーン型位相シフトマスク |
JP2002189281A (ja) * | 2000-12-19 | 2002-07-05 | Hoya Corp | グレートーンマスク及びその製造方法 |
CN1442884A (zh) * | 2002-03-01 | 2003-09-17 | 株式会社日立制作所 | 电子装置的制造方法 |
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US5153083A (en) * | 1990-12-05 | 1992-10-06 | At&T Bell Laboratories | Method of making phase-shifting lithographic masks |
JPH0749410A (ja) * | 1993-08-06 | 1995-02-21 | Dainippon Printing Co Ltd | 階調マスク及びその製造方法 |
JPH0764274A (ja) * | 1993-08-30 | 1995-03-10 | Sony Corp | 位相シフトマスク及びその製造方法 |
JPH0934099A (ja) * | 1995-07-25 | 1997-02-07 | Hoya Corp | 位相シフトマスク及びその製造方法 |
JPH09258426A (ja) * | 1996-03-18 | 1997-10-03 | Toshiba Corp | パターン形成方法 |
KR100215850B1 (ko) * | 1996-04-12 | 1999-08-16 | 구본준 | 하프톤 위상 반전 마스크 및_그제조방법 |
JPH1064788A (ja) * | 1996-08-22 | 1998-03-06 | Toshiba Corp | 半導体装置の製造方法と露光用マスク |
JP3749083B2 (ja) * | 2000-04-25 | 2006-02-22 | 株式会社ルネサステクノロジ | 電子装置の製造方法 |
JP2001324725A (ja) * | 2000-05-12 | 2001-11-22 | Hitachi Ltd | 液晶表示装置およびその製造方法 |
KR20020002089A (ko) * | 2000-06-29 | 2002-01-09 | 주식회사 현대 디스플레이 테크놀로지 | 고개구율 액정 표시 소자의 제조방법 |
JP2003029393A (ja) * | 2001-07-12 | 2003-01-29 | Matsushita Electric Ind Co Ltd | マスク、それを用いたパターン形成方法およびリソグラフィ方法 |
JP3831868B2 (ja) * | 2001-08-13 | 2006-10-11 | 大林精工株式会社 | アクティブマトリックス表示装置とその製造方法 |
-
2004
- 2004-06-28 TW TW093118772A patent/TWI286663B/zh not_active IP Right Cessation
- 2004-06-30 KR KR1020040050390A patent/KR101172645B1/ko active IP Right Grant
- 2004-06-30 CN CNB2004100625413A patent/CN100337306C/zh not_active Expired - Lifetime
-
2007
- 2007-03-26 KR KR1020070029448A patent/KR101182038B1/ko active IP Right Grant
-
2008
- 2008-07-28 JP JP2008193231A patent/JP4729606B2/ja not_active Expired - Lifetime
- 2008-09-27 JP JP2008249334A patent/JP4806701B2/ja not_active Expired - Fee Related
-
2011
- 2011-09-28 KR KR1020110097940A patent/KR101215742B1/ko active IP Right Grant
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0798493A (ja) * | 1993-09-28 | 1995-04-11 | Toppan Printing Co Ltd | 位相シフトマスク及びその製造方法 |
JPH08106151A (ja) * | 1994-10-04 | 1996-04-23 | Sony Corp | 位相シフト・マスクおよびその製造方法 |
JPH0943830A (ja) * | 1995-08-03 | 1997-02-14 | Hoya Corp | ハーフトーン型位相シフトマスク及びハーフトーン型位相シフトマスクブランク並びにそれらの製造方法 |
JPH1124231A (ja) * | 1997-07-01 | 1999-01-29 | Sony Corp | ハーフトーン位相シフトマスク、及びその製造方法 |
JPH11289010A (ja) * | 1998-04-01 | 1999-10-19 | Sony Corp | 多層配線の形成方法 |
JPH11295874A (ja) * | 1998-04-15 | 1999-10-29 | Oki Electric Ind Co Ltd | 位相シフトマスクの製造方法 |
JPH11327121A (ja) * | 1998-05-20 | 1999-11-26 | Toppan Printing Co Ltd | ハーフトーン型位相シフトマスクの製造方法およびハーフトーン型位相シフトマスクのブランク |
JP2000111958A (ja) * | 1998-10-01 | 2000-04-21 | Samsung Electronics Co Ltd | 4枚のマスクを利用した液晶表示装置用薄膜トランジスタ基板の製造方法及び液晶表示装置用薄膜トランジスタ基板 |
JP2001022048A (ja) * | 1999-07-07 | 2001-01-26 | Toppan Printing Co Ltd | 遮光領域つきハーフトーン型位相シフトマスク |
JP2002189281A (ja) * | 2000-12-19 | 2002-07-05 | Hoya Corp | グレートーンマスク及びその製造方法 |
CN1442884A (zh) * | 2002-03-01 | 2003-09-17 | 株式会社日立制作所 | 电子装置的制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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KR20110122654A (ko) | 2011-11-10 |
KR20070038493A (ko) | 2007-04-10 |
JP4806701B2 (ja) | 2011-11-02 |
TWI286663B (en) | 2007-09-11 |
KR101215742B1 (ko) | 2012-12-26 |
KR20050002662A (ko) | 2005-01-10 |
JP2008282046A (ja) | 2008-11-20 |
CN1577085A (zh) | 2005-02-09 |
JP2008310367A (ja) | 2008-12-25 |
TW200506514A (en) | 2005-02-16 |
KR101172645B1 (ko) | 2012-08-08 |
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