ATE539450T1 - Siliziumkarbid leistungs-mosfets mit kurzgeschlossenem kanal und verfahren zur deren herstellung - Google Patents
Siliziumkarbid leistungs-mosfets mit kurzgeschlossenem kanal und verfahren zur deren herstellungInfo
- Publication number
- ATE539450T1 ATE539450T1 AT01977328T AT01977328T ATE539450T1 AT E539450 T1 ATE539450 T1 AT E539450T1 AT 01977328 T AT01977328 T AT 01977328T AT 01977328 T AT01977328 T AT 01977328T AT E539450 T1 ATE539450 T1 AT E539450T1
- Authority
- AT
- Austria
- Prior art keywords
- silicon carbide
- mosfets
- type silicon
- regions
- drift layer
- Prior art date
Links
- 229910010271 silicon carbide Inorganic materials 0.000 title abstract 14
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title abstract 13
- -1 Silicon carbide metal-oxide Chemical class 0.000 abstract 1
- 230000005669 field effect Effects 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/049—Conductor-insulator-semiconductor electrodes, e.g. MIS contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
- H01L29/7828—Vertical transistors without inversion channel, e.g. vertical ACCUFETs, normally-on vertical MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7838—Field effect transistors with field effect produced by an insulated gate without inversion channel, e.g. buried channel lateral MISFETs, normally-on lateral MISFETs, depletion-mode lateral MISFETs
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23742600P | 2000-10-03 | 2000-10-03 | |
US23782200P | 2000-10-03 | 2000-10-03 | |
US09/834,283 US6610366B2 (en) | 2000-10-03 | 2001-04-12 | Method of N2O annealing an oxide layer on a silicon carbide layer |
US29430701P | 2001-05-30 | 2001-05-30 | |
US09/911,995 US6956238B2 (en) | 2000-10-03 | 2001-07-24 | Silicon carbide power metal-oxide semiconductor field effect transistors having a shorting channel and methods of fabricating silicon carbide metal-oxide semiconductor field effect transistors having a shorting channel |
PCT/US2001/030715 WO2002029900A2 (en) | 2000-10-03 | 2001-09-28 | Silicon carbide power mosfets having a shorting channel and methods of fabrication them |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE539450T1 true ATE539450T1 (de) | 2012-01-15 |
Family
ID=27540082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01977328T ATE539450T1 (de) | 2000-10-03 | 2001-09-28 | Siliziumkarbid leistungs-mosfets mit kurzgeschlossenem kanal und verfahren zur deren herstellung |
Country Status (10)
Country | Link |
---|---|
US (1) | US6956238B2 (de) |
EP (2) | EP2261955B1 (de) |
JP (2) | JP4865984B2 (de) |
KR (1) | KR100838632B1 (de) |
CN (1) | CN1319176C (de) |
AT (1) | ATE539450T1 (de) |
AU (1) | AU2001296455A1 (de) |
CA (1) | CA2457919C (de) |
TW (1) | TW561624B (de) |
WO (1) | WO2002029900A2 (de) |
Families Citing this family (128)
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KR100873419B1 (ko) * | 2002-06-18 | 2008-12-11 | 페어차일드코리아반도체 주식회사 | 높은 항복 전압, 낮은 온 저항 및 작은 스위칭 손실을갖는 전력용 반도체 소자 |
JP4463482B2 (ja) * | 2002-07-11 | 2010-05-19 | パナソニック株式会社 | Misfet及びその製造方法 |
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US7022378B2 (en) * | 2002-08-30 | 2006-04-04 | Cree, Inc. | Nitrogen passivation of interface states in SiO2/SiC structures |
US7221010B2 (en) * | 2002-12-20 | 2007-05-22 | Cree, Inc. | Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors |
US7615802B2 (en) | 2003-03-19 | 2009-11-10 | Siced Electronics Development Gmbh & Co. Kg | Semiconductor structure comprising a highly doped conductive channel region and method for producing a semiconductor structure |
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- 2001-09-28 EP EP10182120.5A patent/EP2261955B1/de not_active Expired - Lifetime
- 2001-09-28 AT AT01977328T patent/ATE539450T1/de active
- 2001-09-28 CA CA2457919A patent/CA2457919C/en not_active Expired - Lifetime
- 2001-09-28 EP EP01977328A patent/EP1325522B1/de not_active Expired - Lifetime
- 2001-09-28 JP JP2002533381A patent/JP4865984B2/ja not_active Expired - Lifetime
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- 2001-09-28 CN CNB018200079A patent/CN1319176C/zh not_active Expired - Lifetime
- 2001-10-02 TW TW090124444A patent/TW561624B/zh not_active IP Right Cessation
- 2001-10-02 AU AU2001296455A patent/AU2001296455A1/en not_active Abandoned
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KR20030064763A (ko) | 2003-08-02 |
JP4865984B2 (ja) | 2012-02-01 |
EP2261955A2 (de) | 2010-12-15 |
EP1325522A2 (de) | 2003-07-09 |
TW561624B (en) | 2003-11-11 |
JP5909064B2 (ja) | 2016-04-26 |
CN1478302A (zh) | 2004-02-25 |
CN1319176C (zh) | 2007-05-30 |
EP1325522B1 (de) | 2011-12-28 |
CA2457919A1 (en) | 2002-04-11 |
EP2261955A3 (de) | 2011-02-16 |
WO2002029900A2 (en) | 2002-04-11 |
JP2011254119A (ja) | 2011-12-15 |
JP2004519842A (ja) | 2004-07-02 |
WO2002029900A3 (en) | 2002-10-31 |
KR100838632B1 (ko) | 2008-06-19 |
US6956238B2 (en) | 2005-10-18 |
AU2001296455A1 (en) | 2002-04-15 |
EP2261955B1 (de) | 2013-05-15 |
CA2457919C (en) | 2015-01-06 |
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