ATE496392T1 - Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement - Google Patents

Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement

Info

Publication number
ATE496392T1
ATE496392T1 AT05709466T AT05709466T ATE496392T1 AT E496392 T1 ATE496392 T1 AT E496392T1 AT 05709466 T AT05709466 T AT 05709466T AT 05709466 T AT05709466 T AT 05709466T AT E496392 T1 ATE496392 T1 AT E496392T1
Authority
AT
Austria
Prior art keywords
silicon carbide
carbide substrate
production method
semiconductor component
carbide semiconductor
Prior art date
Application number
AT05709466T
Other languages
English (en)
Inventor
Kunimasa Takahashi
Makoto Kitabatake
Kenya Yamashita
Masao Uchida
Osamu Kusumoto
Ryoko Miyanaga
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE496392T1 publication Critical patent/ATE496392T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00Ion implantation into wafers, substrates or parts of devices
    • H10P30/20Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00Ion implantation into wafers, substrates or parts of devices
    • H10P30/20Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H10P30/2042Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors into crystalline silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90Thermal treatments, e.g. annealing or sintering

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Bipolar Transistors (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT05709466T 2004-02-06 2005-01-28 Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement ATE496392T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004030972 2004-02-06
PCT/JP2005/001240 WO2005076327A1 (ja) 2004-02-06 2005-01-28 炭化珪素半導体素子及びその製造方法

Publications (1)

Publication Number Publication Date
ATE496392T1 true ATE496392T1 (de) 2011-02-15

Family

ID=34836022

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05709466T ATE496392T1 (de) 2004-02-06 2005-01-28 Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement

Country Status (8)

Country Link
US (1) US7462540B2 (de)
EP (1) EP1713117B1 (de)
JP (1) JP4418794B2 (de)
KR (1) KR20060125700A (de)
CN (1) CN100490077C (de)
AT (1) ATE496392T1 (de)
DE (1) DE602005025976D1 (de)
WO (1) WO2005076327A1 (de)

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US9627552B2 (en) * 2006-07-31 2017-04-18 Vishay-Siliconix Molybdenum barrier metal for SiC Schottky diode and process of manufacture
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JP2014225692A (ja) * 2008-12-25 2014-12-04 ローム株式会社 半導体装置および半導体装置の製造方法
JP5518326B2 (ja) 2008-12-26 2014-06-11 昭和電工株式会社 炭化珪素半導体装置の製造方法
WO2010110123A1 (ja) * 2009-03-26 2010-09-30 キヤノンアネルバ株式会社 基板処理方法および結晶性炭化ケイ素(SiC)基板の製造方法
JP5525940B2 (ja) 2009-07-21 2014-06-18 ローム株式会社 半導体装置および半導体装置の製造方法
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US20120076927A1 (en) * 2010-02-01 2012-03-29 United States Government As Represented By The Secretary Of The Army Method of improving the thermo-mechanical properties of fiber-reinforced silicon carbide matrix composites
JP5220049B2 (ja) * 2010-03-09 2013-06-26 三菱電機株式会社 炭化珪素半導体装置の製造方法
JP5766495B2 (ja) * 2010-05-18 2015-08-19 株式会社日立ハイテクノロジーズ 熱処理装置
JP2010239152A (ja) * 2010-06-23 2010-10-21 Mitsubishi Electric Corp 炭化珪素半導体装置
JP5954856B2 (ja) 2011-02-01 2016-07-20 ルネサスエレクトロニクス株式会社 縦チャネル型ノーマリオフ型パワーjfetの製造方法
JP5799458B2 (ja) * 2011-03-29 2015-10-28 学校法人関西学院 半導体素子の製造方法
WO2012157679A1 (ja) * 2011-05-18 2012-11-22 ローム株式会社 半導体装置およびその製造方法
JP5759293B2 (ja) * 2011-07-20 2015-08-05 住友電気工業株式会社 半導体装置の製造方法
JP6011340B2 (ja) * 2011-08-05 2016-10-19 住友電気工業株式会社 基板、半導体装置およびこれらの製造方法
JP5802492B2 (ja) * 2011-09-09 2015-10-28 株式会社東芝 半導体素子及びその製造方法
JP5977986B2 (ja) 2011-11-08 2016-08-24 株式会社日立ハイテクノロジーズ 熱処理装置
JP5539302B2 (ja) * 2011-12-21 2014-07-02 三菱電機株式会社 カーボン膜除去方法
WO2013145022A1 (ja) * 2012-03-30 2013-10-03 株式会社日立製作所 炭化珪素半導体装置の製造方法
JP2015065316A (ja) * 2013-09-25 2015-04-09 住友電気工業株式会社 炭化珪素半導体装置の製造方法
JP2015065318A (ja) * 2013-09-25 2015-04-09 住友電気工業株式会社 炭化珪素半導体装置の製造方法
JP2015065289A (ja) * 2013-09-25 2015-04-09 住友電気工業株式会社 炭化珪素半導体装置の製造方法
CN105723499B (zh) * 2013-11-13 2018-11-06 三菱电机株式会社 半导体装置的制造方法以及半导体装置
JP6588423B2 (ja) * 2014-03-24 2019-10-09 キヤノンアネルバ株式会社 半導体基板の熱処理方法、半導体基板の製造方法、熱処理装置、及び基板処理システム
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US20160045881A1 (en) * 2014-08-15 2016-02-18 Rec Silicon Inc High-purity silicon to form silicon carbide for use in a fluidized bed reactor
JP6472016B2 (ja) * 2014-09-25 2019-02-20 国立研究開発法人産業技術総合研究所 炭化珪素半導体装置の製造方法
CN104766798A (zh) * 2015-03-27 2015-07-08 西安电子科技大学 改善SiC/SiO2界面粗糙度的方法
JP2015159309A (ja) * 2015-04-07 2015-09-03 ルネサスエレクトロニクス株式会社 パワーjfet
CN105470119B (zh) * 2015-11-19 2018-09-11 泰科天润半导体科技(北京)有限公司 一种碳化硅器件的正面欧姆接触的加工方法
CN105448673B (zh) * 2016-01-04 2018-05-18 株洲南车时代电气股份有限公司 一种碳化硅器件背面欧姆接触的制作方法
JP7687078B2 (ja) 2021-06-21 2025-06-03 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
CN113644119A (zh) * 2021-07-14 2021-11-12 深圳市森国科科技股份有限公司 碳化硅肖特基二极管及其制造方法、装置及存储介质
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Also Published As

Publication number Publication date
EP1713117A4 (de) 2009-07-22
JPWO2005076327A1 (ja) 2007-08-02
US20060220027A1 (en) 2006-10-05
KR20060125700A (ko) 2006-12-06
EP1713117B1 (de) 2011-01-19
EP1713117A1 (de) 2006-10-18
CN100490077C (zh) 2009-05-20
DE602005025976D1 (de) 2011-03-03
US7462540B2 (en) 2008-12-09
CN1788335A (zh) 2006-06-14
JP4418794B2 (ja) 2010-02-24
WO2005076327A1 (ja) 2005-08-18

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